Product overview
Description
The STM32F413xG/H devices are based on the high-performance Arm® Cortex®-M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a floating-point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
The STM32F413xG/H devices belong to the STM32F4 access product lines (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing to save even more power consumption during data batching.
The STM32F413xG/H devices incorporate high-speed embedded memories (up to 1.5 Mbytes of flash memory, 320 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, three AHB buses and a 32-bit multi-AHB bus matrix.
All devices offer a 12-bit ADC, two 12-bit DACs, a low-power RTC, twelve general-purpose 16-bit timers including two PWM timer for motor control, two general-purpose 32-bit timers and a low-power timer.
They also feature standard and advanced communication interfaces.
-
All features
- Includes ST state-of-the-art patented technology
- Dynamic Efficiency Line with eBAM (enhanced Batch Acquisition Mode)
- 1.7 V to 3.6 V power supply
- -40 °C to 85/105/125 °C temperature range
- Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/ 1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
- Memories
- Up to 1.5 Mbytes of flash memory
- 320 Kbytes of SRAM
- Flexible external static memory controller with up to 16-bit data bus: SRAM, PSRAM, NOR Flash memory
- Dual mode Quad-SPI interface
- 512 bytes of OTP memory
- LCD parallel interface, 8080/6800 modes
- Clock, reset and supply management
- 1.7 to 3.6 V application supply and I/Os
- POR, PDR, PVD and BOR
- 4-to-26 MHz crystal oscillator
- Internal 16 MHz factory-trimmed RC
- 32 kHz oscillator for RTC with calibration
- Internal 32 kHz RC with calibration
- Power consumption
- Run: 112 µA/MHz (peripheral off)
- Stop (Flash in Stop mode, fast wakeup time): 42 µA Typ.; 80 µA max @25 °C
- Stop (Flash in Deep power down mode, slow wakeup time): 15 µA Typ.; 46 µA max @25 °C
- Standby without RTC: 1.1 µA Typ.; 14.7 µA max at @85 °C
- VBAT supply for RTC: 1 µA @25 °C
- 2x12-bit D/A converters
- 1×12-bit, 2.4 MSPS ADC: up to 16 channels
- 6x digital filters for sigma delta modulator, 12x PDM interfaces, with stereo microphone and sound source localization support
- General-purpose DMA: 16-stream DMA
- Up to 18 timers: up to twelve 16-bit timers, two 32-bit timers up to 100 MHz each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window), one SysTick timer, and a low-power timer
- Debug mode
- Serial wire debug (SWD) & JTAG
- Cortex®-M4 Embedded Trace Macrocell™
- Up to 114 I/O ports with interrupt capability
- Up to 109 fast I/Os up to 50 MHz
- Up to 114 five V-tolerant I/Os
- Up to 24 communication interfaces
- Up to 4x I2C interfaces (SMBus/PMBus)
- Up to 10 UARTS: 4 USARTs / 6 UARTs (2 x 12.5 Mbit/s, 2 x 6.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control)
- Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI or I2S audio protocol), out of which 2 muxed full-duplex I2S interfaces
- SDIO interface (SD/MMC/eMMC)
- Advanced connectivity: USB 2.0 full-speed device/host/OTG controller with PHY
- 3x CAN (2.0B Active), 1xSAI
- True random number generator
- CRC calculation unit, 96-bit unique ID
- RTC: subsecond accuracy, hardware calendarAll packages are ECOPACK®2
Circuit Diagram
Recommended Tools & Software
EDA Symbols, Footprints and 3D Models
STMicroelectronics - STM32F413ZH
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :
Symbols
Footprints
3D models
All resources
| Resource title | Version | Latest update |
|---|
System View Description (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 2.0 | 12 Feb 2024 | 12 Feb 2024 |
IBIS models (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.2 | 20 May 2020 | 20 May 2020 |
BSDL files (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.0 | 28 Nov 2016 | 28 Nov 2016 |
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| STM32F413ZHJ3 | Proposal | UFBGA 144 10x10x0.6 P 0.8 mm | Industrial | - | |
| STM32F413ZHJ6 | Active | UFBGA 144 10x10x0.6 P 0.8 mm | Industrial | Ecopack2 | |
| STM32F413ZHJ6TR | Active | UFBGA 144 10x10x0.6 P 0.8 mm | Industrial | Ecopack2 | |
| STM32F413ZHT3 | Active | LQFP 144 20x20x1.4 mm | Industrial | Ecopack2 | |
| STM32F413ZHT6 | Active | LQFP 144 20x20x1.4 mm | Industrial | Ecopack2 |
STM32F413ZHJ3
Package:
UFBGA 144 10x10x0.6 P 0.8 mmMaterial Declaration**:
STM32F413ZHT6
Package:
LQFP 144 20x20x1.4 mmMaterial Declaration**:
PDF(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | D/A Converters (typ) (12-bit) | Timers (typ) (16-bit) | Timers (typ) (32-bit) | Number of Channels (typ) | SMPS | Number of Channels (typ) | UART (typ) | I/Os (High Current) | Integrated op-amps | Comparator | SPI (typ) | USART (typ) | Number of Channels (typ) | I2S (typ) | Advanced Motor Control Timers | CAN (2.0) | CAN (FD) | Ethernet | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||||||||||||||||||||||
| STM32F413ZHJ6TR | Active | 5.9594 / 10k | distributors No availability of distributors reported, please contact our sales office | UFBGA 144 10x10x0.6 P 0.8 mm | Tape and Reel | PHILIPPINES | 3A991.a.2 | NEC | -40 | 85 | 2 | 12 | 2 |
|
|
| 6 | 114 |
|
| 5 | 4 | 16 | 5 |
| 3 |
|
| ||||
| STM32F413ZHT3 | Active | 6.7681 / 10k | distributors No availability of distributors reported, please contact our sales office | LQFP 144 20x20x1.4 mm | Tray | PHILIPPINES | 3A991.a.2 | NEC | -40 | 125 | 2 | 12 | 2 |
|
|
| 6 | 114 |
|
| 5 | 4 | 16 | 5 |
| 3 |
|
| ||||
| STM32F413ZHT6 | Active | 5.8853 / 10k | distributors No availability of distributors reported, please contact our sales office | LQFP 144 20x20x1.4 mm | Tray | PHILIPPINES | 3A991.a.2 | NEC | -40 | 85 | 2 | 12 | 2 |
|
|
| 6 | 114 |
|
| 5 | 4 | 16 | 5 |
| 3 |
|
| ||||
| STM32F413ZHJ6 | Active | 5.9594 / 10k | distributors No availability of distributors reported, please contact our sales office | UFBGA 144 10x10x0.6 P 0.8 mm | Tray | PHILIPPINES | 3A991.a.2 | NEC | -40 | 85 | 2 | 12 | 2 |
|
|
| 6 | 114 |
|
| 5 | 4 | 16 | 5 |
| 3 |
|
| ||||
| STM32F413ZHJ3 | Proposal | | distributors No availability of distributors reported, please contact our sales office | UFBGA 144 10x10x0.6 P 0.8 mm | -40 | 125 | 2 | 12 | 2 |
|
|
| 6 | 114 |
|
| 5 | 4 | 16 | 5 |
| 3 |
|
| ||||||||
STM32F413ZHJ6TR Active
STM32F413ZHT3 Active
STM32F413ZHT6 Active
STM32F413ZHJ6 Active
STM32F413ZHJ3 Proposal
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors