Product overview
Description
The STM32F103xC, STM32F103xD and STM32F103xE performance line family incorporates the high-performance ARM® Cortex®-M3 32-bit RISC core operating at a 72 MHz frequency, high-speed embedded memories (Flash memory up to 512 Kbytes and SRAM up to 64 Kbytes), and an extensive range of enhanced I/Os and peripherals connected to two APB buses. All devices offer three 12-bit ADCs, four general-purpose 16-bit timers plus two PWM timers, as well as standard and advanced communication interfaces: up to two I2Cs, three SPIs, two I2Ss, one SDIO, five USARTs, an USB and a CAN.
The STM32F103xC/D/E high-density performance line family operates in the –40 to +105 °C temperature range, from a 2.0 to 3.6 V power supply. A comprehensive set of power-saving mode allows the design of low-power applications.
These features make the STM32F103xC/D/E high-density performance line microcontroller family suitable for a wide range of applications such as motor drives, application control, medical and handheld equipment, PC and gaming peripherals, GPS platforms, industrial applications, PLCs, inverters, printers, scanners, alarm systems video intercom, and HVAC.
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All features
- Core: ARM® 32-bit Cortex®-M3 CPU
- 72 MHz maximum frequency, 1.25 DMIPS/MHz (Dhrystone 2.1) performance at 0 wait state memory access
- Single-cycle multiplication and hardware division
- Memories
- 256 to 512 Kbytes of Flash memory
- up to 64 Kbytes of SRAM
- Flexible static memory controller with 4 Chip Select. Supports Compact Flash, SRAM, PSRAM, NOR and NAND memories
- LCD parallel interface, 8080/6800 modes
- Clock, reset and supply management
- 2.0 to 3.6 V application supply and I/Os
- POR, PDR, and programmable voltage detector (PVD)
- 4-to-16 MHz crystal oscillator
- Internal 8 MHz factory-trimmed RC
- Internal 40 kHz RC with calibration
- 32 kHz oscillator for RTC with calibration
- Low power
- Sleep, Stop and Standby modes
- VBAT supply for RTC and backup registers
- 3 × 12-bit, 1 μs A/D converters (up to 21 channels)
- Conversion range: 0 to 3.6 V
- Triple-sample and hold capability
- Temperature sensor
- 2 × 12-bit D/A converters
- DMA: 12-channel DMA controller
- Supported peripherals: timers, ADCs, DAC, SDIO, I2Ss, SPIs, I2Cs and USARTs
- Debug mode
- Serial wire debug (SWD) & JTAG interfaces
- Cortex®-M3 Embedded Trace Macrocell™
- Up to 112 fast I/O ports
- 51/80/112 I/Os, all mappable on 16 external interrupt vectors and almost all 5 V-tolerant
- Up to 11 timers
- Up to four 16-bit timers, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
- 2 × 16-bit motor control PWM timers with dead-time generation and emergency stop
- 2 × watchdog timers (Independent and Window)
- SysTick timer: a 24-bit downcounter
- 2 × 16-bit basic timers to drive the DAC
- Up to 13 communication interfaces
- Up to 2 × I2C interfaces (SMBus/PMBus)
- Up to 5 USARTs (ISO 7816 interface, LIN, IrDA capability, modem control)
- Up to 3 SPIs (18 Mbit/s), 2 with I2S interface multiplexed
- CAN interface (2.0B Active)
- USB 2.0 full speed interface
- SDIO interface
- CRC calculation unit, 96-bit unique ID
- ECOPACK® packages
- Core: ARM® 32-bit Cortex®-M3 CPU
Circuit Diagram
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All resources
| Resource title | Version | Latest update |
|---|
Product Specifications (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 13.0 | 12 Jul 2018 | 12 Jul 2018 |
Application Notes (5 of 46)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 10 Oct 2022 | 10 Oct 2022 | ||
| 4.0 | 08 Jul 2020 | 08 Jul 2020 | ||
| 4.0 | 06 Jul 2022 | 06 Jul 2022 | ||
| 1.1 | 16 Jan 2024 | 16 Jan 2024 | ||
| 3.0 | 16 Jul 2019 | 16 Jul 2019 | ||
| 8.0 | 09 Dec 2022 | 09 Dec 2022 | ||
| 8.0 | 27 Feb 2025 | 27 Feb 2025 | ||
| 4.0 | 04 Oct 2024 | 04 Oct 2024 | ||
| 7.0 | 09 Dec 2024 | 09 Dec 2024 | ||
| 2.1 | 11 Jul 2017 | 11 Jul 2017 | ||
| 3.0 | 17 Aug 2022 | 17 Aug 2022 | ||
| 5.0 | 27 Feb 2025 | 27 Feb 2025 | ||
| 10.0 | 29 Oct 2024 | 29 Oct 2024 | ||
| 1.0 | 25 Sep 2023 | 25 Sep 2023 | ||
| 9.0 | 06 Feb 2025 | 06 Feb 2025 | ||
| 8.0 | 27 Feb 2025 | 27 Feb 2025 | ||
| 2.0 | 17 Jul 2019 | 17 Jul 2019 | ||
| 9.0 | 14 Mar 2024 | 14 Mar 2024 | ||
| 7.0 | 27 Jun 2023 | 27 Jun 2023 | ||
| 10.0 | 27 Feb 2025 | 27 Feb 2025 | ||
| 10.0 | 27 Feb 2025 | 27 Feb 2025 | ||
| 11.0 | 27 Feb 2025 | 27 Feb 2025 | ||
| 13.0 | 27 Feb 2025 | 27 Feb 2025 | ||
| 1.6 | 01 Jul 2024 | 01 Jul 2024 | ||
| 1.4 | 15 Nov 2023 | 15 Nov 2023 | ||
| 3.0 | 10 Feb 2015 | 10 Feb 2015 | ||
| 6.0 | 10 Feb 2017 | 10 Feb 2017 | ||
| 7.0 | 20 Sep 2018 | 20 Sep 2018 | ||
| 3.4 | 28 Mar 2024 | 28 Mar 2024 | ||
| 2.0 | 02 Dec 2016 | 02 Dec 2016 | ||
| 2.4 | 10 Jan 2024 | 10 Jan 2024 | ||
| 3.0 | 18 Jul 2022 | 18 Jul 2022 | ||
| 1.2 | 13 Sep 2018 | 13 Sep 2018 | ||
| 5.1 | 08 Apr 2019 | 08 Apr 2019 | ||
| 3.0 | 29 Mar 2022 | 29 Mar 2022 | ||
| 3.0 | 28 Jan 2021 | 28 Jan 2021 | ||
| 65.0 | 17 Feb 2025 | 17 Feb 2025 | ||
| 1.1 | 20 May 2017 | 20 May 2017 | ||
| 2.0 | 17 Jul 2017 | 17 Jul 2017 | ||
| 1.6 | 20 May 2024 | 20 May 2024 | ||
| 8.0 | 07 Nov 2024 | 07 Nov 2024 | ||
| 1.6 | 31 Oct 2024 | 31 Oct 2024 | ||
| 19.0 | 05 Feb 2025 | 05 Feb 2025 | ||
| 17.0 | 17 Feb 2025 | 17 Feb 2025 | ||
| 4.2 | 05 Mar 2014 | 05 Mar 2014 | ||
| 1.1 | 11 Jul 2017 | 11 Jul 2017 |
Technical Notes & Articles (5 of 8)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 4.0 | 11 Jul 2017 | 11 Jul 2017 | ||
| 4.3 | 04 Jun 2023 | 04 Jun 2023 | ||
| 5.0 | 17 Jul 2024 | 17 Jul 2024 | ||
| 2.1 | 11 Jul 2017 | 11 Jul 2017 | ||
| 3.0 | 11 Jul 2017 | 11 Jul 2017 | ||
| 3.0 | 11 Jul 2017 | 11 Jul 2017 | ||
| 1.0 | 11 Jul 2017 | 11 Jul 2017 | ||
| 1.0 | 11 Jul 2017 | 11 Jul 2017 |
User Manuals (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.1 | 28 Jun 2024 | 28 Jun 2024 | ||
| 1.0 | 18 Sep 2015 | 18 Sep 2015 |
Reference Manuals (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 21.0 | 23 Feb 2021 | 23 Feb 2021 |
Programming Manuals (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.4 | 22 Aug 2024 | 22 Aug 2024 | ||
| 7.0 | 03 Dec 2024 | 03 Dec 2024 |
Errata Sheets (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 17.0 | 29 Jun 2022 | 29 Jun 2022 |
Device Option Lists (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.1 | 01 Aug 2015 | 01 Aug 2015 |
Application Notes for related Tools & Software (5 of 49)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.0 | 13 Jan 2016 | 13 Jan 2016 | ||
| 4.0 | 23 Nov 2016 | 23 Nov 2016 | ||
| 2.0 | 15 Mar 2024 | 15 Mar 2024 | ||
| 2.2 | 13 Sep 2018 | 13 Sep 2018 | ||
| 1.7 | 03 Mar 2023 | 03 Mar 2023 | ||
| 2.0 | 23 Feb 2018 | 23 Feb 2018 | ||
| 2.6 | 31 Oct 2024 | 31 Oct 2024 | ||
| 3.6 | 03 Aug 2022 | 03 Aug 2022 | ||
| 1.0 | 28 Feb 2025 | 28 Feb 2025 | ||
| 5.0 | 06 Apr 2018 | 06 Apr 2018 | ||
| 4.0 | 10 Feb 2022 | 10 Feb 2022 | ||
| 2.0 | 14 Dec 2020 | 14 Dec 2020 | ||
| 3.0 | 24 Jul 2020 | 24 Jul 2020 | ||
| 1.0 | 29 Oct 2019 | 29 Oct 2019 | ||
| 2.3 | 10 Nov 2013 | 10 Nov 2013 | ||
| 6.0 | 20 Aug 2019 | 20 Aug 2019 | ||
| 10.0 | 22 Aug 2023 | 22 Aug 2023 | ||
| 5.0 | 05 Oct 2021 | 05 Oct 2021 | ||
| 2.1 | 10 Oct 2022 | 10 Oct 2022 | ||
| 1.0 | 28 Nov 2024 | 28 Nov 2024 | ||
| 1.3 | 03 Oct 2013 | 03 Oct 2013 | ||
| 18.0 | 11 Mar 2025 | 11 Mar 2025 | ||
| 2.0 | 28 Feb 2025 | 28 Feb 2025 | ||
| 1.7 | 03 Aug 2022 | 03 Aug 2022 | ||
| 2.4 | 15 Sep 2022 | 15 Sep 2022 | ||
| 2.0 | 02 Apr 2015 | 02 Apr 2015 | ||
| 2.6 | 28 Jul 2022 | 28 Jul 2022 | ||
| 3.0 | 12 Dec 2017 | 12 Dec 2017 | ||
| 1.5 | 13 Sep 2018 | 13 Sep 2018 | ||
| 1.0 | 14 Jan 2020 | 14 Jan 2020 | ||
| 2.0 | 13 Sep 2018 | 13 Sep 2018 | ||
| 1.5 | 15 Sep 2022 | 15 Sep 2022 | ||
| 1.0 | 22 Oct 2021 | 22 Oct 2021 | ||
| 1.2 | 02 Sep 2015 | 02 Sep 2015 | ||
| 4.0 | 09 Mar 2023 | 09 Mar 2023 | ||
| 3.0 | 28 Feb 2023 | 28 Feb 2023 | ||
| 2.0 | 17 Jul 2017 | 17 Jul 2017 | ||
| 1.0 | 30 Nov 2021 | 30 Nov 2021 | ||
| 2.7 | 03 Aug 2022 | 03 Aug 2022 | ||
| 8.5 | 03 Aug 2022 | 03 Aug 2022 | ||
| 4.7 | 16 Dec 2022 | 16 Dec 2022 | ||
| 2.7 | 03 Aug 2022 | 03 Aug 2022 | ||
| 1.8 | 04 Jun 2023 | 04 Jun 2023 | ||
| 1.6 | 03 Mar 2023 | 03 Mar 2023 | ||
| 1.7 | 03 Mar 2023 | 03 Mar 2023 | ||
| 6.0 | 04 Jan 2016 | 04 Jan 2016 | ||
| 2.6 | 03 Aug 2022 | 03 Aug 2022 | ||
| 1.1 | 13 Sep 2018 | 13 Sep 2018 | ||
| 4.2 | 05 Mar 2014 | 05 Mar 2014 |
Presentations (5)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 16 Sep 2024 | 16 Sep 2024 | ||
| 1.0 | 19 Feb 2025 | 19 Feb 2025 | ||
| 1.0 | 20 Jun 2023 | 20 Jun 2023 | ||
| 1.0 | 21 Mar 2024 | 21 Mar 2024 | ||
| 1.1 | 02 Dec 2024 | 02 Dec 2024 |
Flyers (3)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 18 Nov 2020 | 18 Nov 2020 | ||
| 20.0 | 21 Dec 2020 | 21 Dec 2020 | ||
| 1.0 | 09 Jul 2024 | 09 Jul 2024 |
Brochures (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 06 Mar 2023 | 06 Mar 2023 |
Product Certifications (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 01 Aug 2015 | 01 Aug 2015 | ||
| 1.0 | 01 Aug 2015 | 01 Aug 2015 |
Security Bulletin (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 28 Jan 2025 | 28 Jan 2025 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - STM32F103RE
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :
Symbols
Footprints
3D models
All resources
| Resource title | Version | Latest update |
|---|
System View Description (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.2 | 03 Nov 2017 | 03 Nov 2017 |
IBIS models (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 2.0 | 13 Aug 2024 | 13 Aug 2024 |
BSDL files (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 2.0 | 13 Jan 2016 | 13 Jan 2016 |
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| STM32F103RET6 | Active | LQFP 64 10x10x1.4 mm | Industrial | Ecopack2 | |
| STM32F103RET6TR | Active | LQFP 64 10x10x1.4 mm | Industrial | Ecopack2 | |
| STM32F103RET7 | Active | LQFP 64 10x10x1.4 mm | Industrial | Ecopack2 | |
| STM32F103REY6TR | Active | WLCSP 64 4.5x4.4x0.6 P 0.5 mm | Industrial | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
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| Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | D/A Converters (typ) (12-bit) | Timers (typ) (16-bit) | Timers (typ) (32-bit) | Number of Channels (typ) | SMPS | Number of Channels (typ) | UART (typ) | I/Os (High Current) | Integrated op-amps | Comparator | SPI (typ) | USART (typ) | Number of Channels (typ) | I2S (typ) | Advanced Motor Control Timers | CAN (2.0) | CAN (FD) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | ||||||||||||||||||||||||||||||
| STM32F103RET6 | Active | 5.0587 / 10k | 5 distributors | LQFP 64 10x10x1.4 mm | Tray | MALAYSIA | 3A991.a.2 | NEC | -40 | 85 | 2 | 8 |
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| 1 |
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| STM32F103RET6TR | Active | 5.0587 / 10k | 4 distributors | LQFP 64 10x10x1.4 mm | Tape and Reel | MALAYSIA | 3A991.a.2 | NEC | -40 | 85 | 2 | 8 |
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| 51 |
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| 3 | 5 | 16 | 2 |
| 1 |
| ||||
| STM32F103REY6TR | Active | 4.9381 / 10k | 2 distributors | WLCSP 64 4.5x4.4x0.6 P 0.5 mm | Tape and Reel | SINGAPORE | 3A991.a.2 | NEC | -40 | 85 | 2 | 8 |
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| 51 |
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| 3 | 5 | 16 | 2 |
| 1 |
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| STM32F103RET7 | Active | 5.4128 / 10k | 3 distributors | LQFP 64 10x10x1.4 mm | Tray | MALAYSIA | 3A991.a.2 | NEC | -40 | 105 | 2 | 8 |
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| 3 | 5 | 16 | 2 |
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STM32F103RET6 Active
Budgetary Price (US$)*/Qty:
5.0587 / 10k
Package:
LQFP 64 10x10x1.4 mm
Packing Type:
Tray
Country of Origin:
MALAYSIA
ECCN (US):
3A991.a.2
ECCN (EU):
NEC
STM32F103RET6TR Active
Budgetary Price (US$)*/Qty:
5.0587 / 10k
Package:
LQFP 64 10x10x1.4 mm
Packing Type:
Tape and Reel
Country of Origin:
MALAYSIA
ECCN (US):
3A991.a.2
ECCN (EU):
NEC
STM32F103REY6TR Active
Budgetary Price (US$)*/Qty:
4.9381 / 10k
Package:
WLCSP 64 4.5x4.4x0.6 P 0.5 mm
Packing Type:
Tape and Reel
Country of Origin:
SINGAPORE
ECCN (US):
3A991.a.2
ECCN (EU):
NEC
STM32F103RET7 Active
Budgetary Price (US$)*/Qty:
5.4128 / 10k
Package:
LQFP 64 10x10x1.4 mm
Packing Type:
Tray
Country of Origin:
MALAYSIA
ECCN (US):
3A991.a.2
ECCN (EU):
NEC
Don't show this again
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors