1200 V ACEPACK DMT-32 power modules based on SiC MOSFET technology
Highly efficient and reliable solution with a flexible layout
High power density STPOWER ACEPACK modules minimize system room occupation
Combining the intrinsic features of silicon carbide technology with an optimized compact design, the ACEPACK DMT-32 ensures a flexible layout able to implement several topologies. This molded, through-hole, 32-pin power module is tailored for automotive applications like OBC, DC-DC and auxiliary supplies as well as industrial ones including solar and energy and motor drive applications.
ST's ACEPACK DMT-32 SiC-based module portfolio covers several converter topologies such as fourpack, sixpack and totem pole (coming soon) targeting a power up to 22 kW.
Designed for a wide range of applications
On-board chargers (OBC)
DC/DC converters for EV/HEV
Fluid pumps, HVAC and climate control
Industrial motor control
Energy generation and distribution
Power supplies and converters
Select your product
Fourpack topology
M1F45M12W2-1LA
Automotive‑grade ACEPACK DMT‑32 power module, fourpack topology, 1200V, 47.5mΩ typ. SiC power MOSFET with NTC
Sixpack topology
M1P45M12W2-1LA
Automotive-grade ACEPACK DMT-32 power module, sixpack topology, 1200V, 47.5mΩ typ. SiC power MOSFET with NTC
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STDES-BCBIDIR: 11 kW bidirectional battery charger based on three phase two level PFC and isolated DC-DC converter
STDES-BCBIDIR: 11 kW bidirectional battery charger based on three phase two level PFC and isolated DC-DC converter
A complete solution for high-voltage charging in both industrial and automotive fields. It consists of two power stages: a PFC and an isolated DC-DC stage. Based on the ACEPACK DMT-32 SiC power module, the solution runs on a STM32G474RE MCU.
*For order, please contact our sales office
STPOWER Studio: dynamic electro-thermal simulation software for ST power devices
STPOWER Studio: dynamic electro-thermal simulation software for ST power devices
The software provides comprehensive power and thermal analysis. It predicts the device performance shortening the design cycle and saving time and resources. Furthermore, the tool helps users to select the best device fitting a specific application mission profile..
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Improve design and performance with new ACEPACK package and SiC MOSFET technology