Automotive-grade top-side-cooling power packages and module
HU3PAK, ACEPACK SMIT and ACEPACK DMT-32
Optimized for power density and
thermal management
To meet today's stringent market demands, our HU3PAK and ACEPACK SMIT SMD packages, along with the ACEPACK DMT-32 through-hole power module, all feature top-side cooling (TSC) and are specifically designed to deliver higher power density, improved thermal management, and easy assembly. These features make them ideal for high-power automotive and industrial applications.
Electro-mobility
Energy generation and distribution
Industrial power supply
Motor control
Meet your design performance
challenges with....
Selecting the optimal top-side cooling solution can be a complex decision, influenced by various factors such as power density, thermal management needs, PCB and cooling system design considerations, and specific application requirements to meet efficiency and cost targets.
To help you make an informed choice from among the three package and module options below, we invite you to take part in our upcoming webinar.
HU3PAK discrete package with top-side cooling for superior thermal performance
The HU3PAK is designed for surface mounting on a printed circuit board, with its top side connected to an external heat sink. This design optimizes thermal performance, allowing the device to handle maximum power without needing to dissipate heat through the PCB, unlike H2PAK/D2PAK packages
Key features
Key features
- Low profile, surface-mount (SMD) package with top-side cooling
- AEC-Q101 qualified
- Voltage rating up to 1200 V
- Low thermal resistance
- Kelvin source pin for low-inductance designs
- Package height 3.5 mm and the tab is not isolated
Power devices available in an HU3PAK package:
ACEPACK SMIT power module package with isolated top-side cooling is a scalable solution
ACEPACK SMIT power modules feature a direct bonded copper (DBC) ceramic metal-isolation-metal substrate on the top side which improves thermal coupling with heatsinks. With low electrical parasitic inductance and thermal resistance, it supports various electrical circuit solutions from single-switch to multi-die topologies in the 1 to 50 kW power range. Its epoxy molding compound offers outstanding resistance to moisture and heat for automotive and industrial applications.
Key features
Key features
- Surface-mount (SMD) packages with isolated top-side cooling
- Backside insulated ceramic, UL recognized
- Semiconductor dice on Direct Bond Copper (DBC) substrate
- AQG-324 and AEC-Q101 qualified depending on the internal dice configuration
- Voltage rating up to 1200 V
- Kelvin source pin available
- Halogen-free molding compound
Power devices available in an ACEPACK SMIT package:
ACEPACK DMT-32 power module with top-side cooling for a highly integrated solution
ACEPACK DMT-32 is a dual in-line, molded, through-hole, 32-pin power module designed for BEV/HEV automotive and industrial applications. Leveraging ST's advanced SiC technology, it supports a wide range of power applications, including on-board chargers (OBC), DC/DC converters, fluid pumps, air conditioning, solar energy, and motor drives. The direct bonded copper (DBC) packaging based on aluminum nitride (AlN) ensures higher thermal conductivity, low thermal resistance, and high electrical isolation.
Key features
Key features
- Molded, electrically isolated with top-side cooling
- Dual-in-line & staggered, through-hole, 32-pin power module
- Optimal thermal performance thanks to AlN isolated substrate
- AQG-324 qualified;
- Voltage rating up to 1200 V
- Integrated NTC sensor
Live webinar
Optimizing car electrification applications with ST's advanced power and package technologies
Thursday, April 10, 2025
► 3:00 pm CEST | EMEA session
► 2:00 pm EDT | Americas session