On-demand Webinar: Advanced IO-Link Chips for Intelligent Sensor Networks
We will present our solutions for implementing IO-Link Master and Device nodes in smart industrial sensor and actuator networks, with key focus on the new L6364 physical layer transceiver and related ST IO-Link products. We will also discuss the relevant hardware and software evaluation ecosystem for developers, with evaluation boards based on STM32 running the IO-Link stack provided by TEConcept.
Our ICs offer highly robust and efficient power stages for minimal power dissipation, and come with a rich set of widely programmable features and embedded protections to enable highly integrated and compact solutions.
This on-demand session covers the following:
- IO-Link Technology introduction and market overview, advantages vs. conventional busses
- New ST Master and Device transceivers, key features and benefits
- Evaluation kits based on STM32 MCUs, firmware and graphical user interface
Bonus: live Q&A session included with feedback from ST’s experienced speakers.
Our speakers: Milos Hofman | Technical Marketing Manager responsible for ST Factory Automation Vertical Program. He focuses on smart industrial networks and digital I/O systems. Milos has 17 years’ experience in industrial automation field and is behind the specification of several ST integrated circuits. |
Our speaker: Vojtech Elias | Application Engineer with ten years' experience in STMicroelectronics. As a member of the Power Application Laboratory in Prague, Vojtech focuses particularly on integrated solutions for Industrial Automation applications. His technical knowledge covers smart power & protection components for Industrial Automation and IO-Link communication. |