ACEPACK SMIT: automotive-grade isolated top-side cooling package
Flexible design for multiple power devices
The automotive-grade ACEPACK SMIT features a Direct Bond Copper (DBC) metal-isolation-metal substrate on the top side, enhancing thermal coupling with heatsinks. This design reduces silicon dissipation on the PCB, enabling lower temperatures and greater design flexibility. With low electrical parasitic inductance and thermal resistance, it supports various electrical circuit solutions suitable for e-mobility applications as well as industrial ones.
| トポロジ | Discover more | Start your design |
---|---|---|---|
IGBTs | Half bridge/ | ||
Si MOSFETs | Half bridge | ||
SiC MOSFETs | Half bridge | ||
ダイオード | Ultrafast bridge | ||
Thyristors (SCRs) | Half bridge/ |
This easy-to-use design aid offers comprehensive power and thermal analysis, predicting device performance to shorten the design cycle and save time and resources. Additionally, the tool assists users in selecting the best device for a specific application mission profile.
Ready-to-use reference design featuring a pulse transformer for 60 A 1200 V industrial switching applications based on a top-side-cooled ACEPACK SMIT package.