LPWAN (LTE & LoRa) IoT Solutions from ST

Time: 9:30 – 10:10

Speaker: Marc Hervieu, STMicroelectronics

This session will show ST’s LPWAN IoT Ecosystem for low power, low bit-rate cloud connectivity that is suitable for battery-powered devices. We will explore how ST based starter kits for Verizon^®, AT&T^® and MachineQ™ (a Comcast^® company) simplify IoT embedded development and speed time-to-market. The LPWAN technologies covered will be LTE Cat-M / NB-IoT (4G and 5G technologies) and LoRa^® with use cases including sensor-to-cloud connectivity and GNSS tracking.

MachineQ OTA Updates – LoRaWAN Quick and Simple!

Time: 10:20 – 11:00

Speaker: Maggie Bosak - Product Technology Lead, MachineQ – a Comcast Company

MachineQ enables the easiest process for updating a LoRaWAN device’s software/configuration updates over-the-air (OTA) ensuring deployed devices are at their peak performance. During this talk we’ll discuss how MachineQ uses multicast functionality to deliver OTA updates by making use of different device operation classes to balance efficient packet delivery and power consumption.

Artificial Neural Network Mapping Made Simple with the STM32Cube.AI

Time: 11:10 – 11:50

Speaker: Markus Mayr, STMicroelectronics

This session will focus on the new STM32Cube.AI software tool and its ecosystem. The STM32Cube.AI toolbox generates optimized code to run neural networks on STM32 microcontrollers. It brings AI to microcontroller-powered intelligent devices at the edge, on the nodes, and to deeply embedded devices across IoT, smart building, industrial, and medical applications. With STM32Cube.AI, developers can now convert pre-trained neural networks into C-code that calls functions in optimized libraries that can run on STM32 MCUs.

The comprehensive toolbox consisting of the STM32Cube.AI mapping tool, application software examples running on small-form-factor, battery-powered SensorTile hardware, together with the partner program and dedicated community support offers a fast and easy pathway to neural-network implementation on STM32 devices.

Enhancing the User Experience with TouchGFX Advanced Graphics on the STM32

Time: 12:30 – 1:10

Speaker: Mike Hartmann, STMicroelectronics

During this session, you will be introduced to STM32 devices with advanced graphics capabilities and the TouchGFX software framework. TouchGFX is optimized for STM32 and includes an easy-to-use GUI builder, TouchGFX Designer. This drag and drop tool seamlessly integrates into your TouchGFX development, moving you quickly from idea to product.

Introduction to the STM32MP1 Microprocessor Series

Time: 1:20 – 2:00

Speaker: Mike Hartmann, STMicroelectronics

Leveraging the unparalleled success of the STM32, ST recently announced the newest addition to the family, the STM32MP1. This general purpose multicore microprocessor series will facilitate development of high-performance solutions for Industrial, Consumer, Medical and Smart Home applications. This session will introduce attendees to the STM32MP1, its features and capabilities, the available tools, and the ecosystem around it.

Overview of BlueNRG-Mesh SDK for ST Bluetooth Low Energy SOCs

Time: 2:10 – 2:50

Speaker: Francesco Doddo & Salvo Bonina, STMicroelectronics

This session will explore Bluetooth low energy mesh technology and talk about BlueNRG-Mesh, a certified and qualified ST software development kit implementation of the Bluetooth SIG specs. This solution targets applications such as lighting, smart home and building automation, smart industry, wireless sensor networks.

During the class, attendees will learn about the Bluetooth Low Energy mesh architecture and its main functionalities such as the “models” for lighting and sensors, the “low power nodes” and “friend nodes” capabilities for low power applications, the “elements” to enhance the end application functionalities, the “Mesh Addressing concept” and the “mesh Publish and Subscribe messaging model” to exchange information over the mesh network.

Security and provisioning of new devices within Bluetooth low energy mesh will be also explored.

Finally, the class will receive an overview of the BlueNRG-Mesh SDK for the ST Bluetooth low energy SOCs and the companion mobile App for both Android and iOS.

Simplify the Integration of Sensors and Bluetooth Low Energy (BLE) Connectivity using the BlueNRG-Tile Eval Kit

Time: 3:30 – 5:00

Speaker: Francesco Doddo & Raffaele Riva, STMicroelectronics

During this session, you will be introduced to BlueNRG-Tile: a Bluetooth low energy (BLE) enabled sensor node development kit. Details on the hardware platform and its companion software development kit for the BlueNRG-Tile will be presented, including application examples as sensor data streaming over BLE, HID peripheral, Beacon.

Attendees will learn how to design an efficient BLE protocol, starting from the ST Blue protocol, for interacting with a mobile client, the ST BLE Sensor mobile App for both Android and iOS.

Finally, the capabilities of the ARM Cortex-M0 System-On-Chip along with the advanced set of MEMS sensors will be exploited, introducing real-time embedded sensor data fusion and streaming of voice over the BLE link.

Predictive Maintenance: Use of Advanced Sensors in Smart Industry Applications

Time: 9:30 – 10:10

Speaker: Manuel Cantone, STMicroelectronics

In this session we’ll discuss the use of various sensing technologies applied to Condition Monitoring of an asset: vibration analysis, environmental sensing, use of ultrasound. We’ll present the development kits available from ST and a development path from Condition Monitoring to Predictive Maintenance using an end to end platform Sensors to Cloud.

Designing a Predictive Maintenance Application

Time: 10:20 – 11:00

Speaker: Martin Bernier - Director of Engineering Support Group & System Design Centre, Future Electronics

Predictive maintenance is becoming more important than ever. MEMS and Digital Sensors facilitate the monitoring of machine conditions, cloud storage enabled archiving and analysis of machine data for diagnostic and maintenance purposes. Our course will outline the importance of predictive maintenance, and how STMicroelectronics can facilitate the development of a multisensory platform capable of performing local and cloud computing analysis. During our session, we will demonstrate our approach on developing a predictive maintenance system, using the new STM32G4 MCU, the STM32WB MCU and STMicroelectronics’ industrial sensors.

How to Eliminate Wires and Connectors with the new ST60 for Contactless Gb/s Connectivity

Time: 11:10 – 11:50

Speaker: Mark Hopkins, STMicroelectronics

During this session, you will be introduced to the latest addition to ST’s connectivity product portfolio: ST60 - 60GHz: Ultra Low Power - High Data Rate Transceiver. This device is ideally positioned for industrial, consumer and medical applications in need of replacing connectors, cables and other types of wired interfaces. In application segments where accessibility and size are limiting factor as well as low power requirement, this device offers alternative to existing high bandwidth communication links such as: Ethernet, DP and USB.

The attendees will be given an overview of the ST60 features as well as live demo of the product including implementation cases covering data rates from 1 Mb/s - 6 Gb/s.

Augmented Reality Symposium

Time: 12:30 – 3:00

Speakers confirmed: (in order of presentation)

• Michael Palma - Research Director, Enabling Technologies and Semiconductors, IDC
  Michael Palma is a Research Director for IDC’s Enabling Technologies team. Michael leads IDC's Sensor and Systems intelligence program, examining the intersection of sensors and AI processing at the edge. His research also includes computer vision, video analytics, voice interaction and speech recognition, new power technologies, and other advanced technologies. Mr. Palma is also responsible for IDC's consumer semiconductor coverage and research in the embedded and IoT market, centered on video surveillance, smart home, and the retail market. Formerly, Mr. Palma was responsible for IDC's research in the Electronics Manufacturing Services (EMS) and Original Design Manufacturer (ODM) industries. During his tenure with IDC, Mr. Palma has also worked on projects covering the electronics supply chain, PC motherboards, and several areas in the Embedded computing market, including automotive, industrial, and medical systems.
  
  
• Amar Dhaliwal – CEO, Atheer
  Amar Dhaliwal has worked at companies across three countries and has been directly involved in founding five businesses along the way. It was his third idea that would make him a sought after expert in enterprise software when he co-founded THINQ and helped create the category of Enterprise Learning Management. Today, as CEO of Atheer, he is creating the next essential category of enterprise software - The Augmented Reality Management Platform. As an advisor to Nugg, TeamFit, Obie, EdCast, GrowTech Labs, and Digital Cues, Amar has provided senior strategic counsel and business development expertise to businesses across Canada, U.K, and the U.S., helping mentor entrepreneurs as they undertake their own journeys. Amar is also a member of Google's Immersive Wearable Advisory Council.
  
  
• Stefan Alexander – Vice President, North
  Stefan Alexander is North’s Vice President of Advanced R&D. Notably, Stefan was the first to work on North’s nascent smart glasses project in 2014. Since then, he has led a team in the development of Focals, overcoming countless obstacles to bring the device from prototype to consumer-ready product. Today, Stefan is one of North’s most visionary team members, paving the way for the future of the smart glasses category. Prior to joining the team at North, Stefan led the creation of state-of-the-art display prototypes at IGNIS Innovation. Stefan’s proclivity for research follows him outside of work as well. He is a published board game designer, and experiments with coffee brewing and roasting techniques.
  
  
• Prince Gupta – Sr. Manager, Qualcomm
  Prince Gupta is a Senior Product Manager of XR product management for Qualcomm Technologies, Inc. where he drives the development of next generation augmented and virtual reality software and hardware, leads competitive analysis for the XR industry and manages strategic partnerships with XR technology partners. Prince has more than 10 years of experience working on computer vision and deep learning technologies applied to augmented and virtual reality, which resulted in world-class device launches including Oculus GO and Quest, Lenovo Mirage Solo, and HTC Vive Focus. Prince has commercialized computational photography camera features in Qualcomm Snapdragon camera that have launched in 100+ million smartphones. He is the author of more than 10 patents in this space and has given talks around the world to academic and commercial audiences.
  
  
• Ann Russell-El Demery – Senior Applications Engineer, OSRAM
  Dr. Ann Russell-El Demery is a Senior Application Engineer at Osram Opto Semiconductors North America, where she specializes in near-to-eye, RGB laser light engines. She received her PhD in Electrical Engineering from the University of Cincinnati.

Significant investments, technological advances and marketing excitement surround augmented reality. AR has the potential and promise to provide compelling and powerful user experiences across markets including consumer, enterprise, industrial and automotive. In this symposium, thought leaders from across the industry will discuss the state of the market and where it is headed, review the technologies, challenges and opportunities, including key requirements necessary to deliver compelling user experiences, share lessons learned from developing products and solutions, and conclude with the key technology piece that is central to the experience, namely, solutions to enable compact and efficient near-to-eye displays.

Secure Bluetooth Pairing Made Easy with NFC

Time: 3:30 – 4:10

Speaker: Keith Walters, STMicroelectronics

Learn how Near Field Communication (NFC) capabilities in mobile devices with both Android and iOS can be used to enhance the Bluetooth pairing experience. The pairing method offering the highest level of security and ease of use is the out of Band (OOB) pairing over near field communications (NFC). With NFC, security credentials and devices capabilities can be exchange privately with just a simple tap – no user input is required. This lecture will cover NFC technology and capabilities, methods of Bluetooth pairing, how NFC works and benefits, handover terms / type / security, NFC development tools.

How to Design an NFC Reader Application: a Step-by-Step Approach

Time: 4:20 – 5:00

Speaker: Dan Merino, STMicroelectronics

This presentation will focus on the key challenges of designing an NFC reader application. Product selection, antenna tuning, layout optimization, read range, noise reduction, power consumption optimization, testing and certification are among the most important aspects in this application design space. Participants will learn how to develop an NFC reader application leveraging ST high performance reader ICs and evaluation tools.

A Breakthrough Innovation in MEMS Sensors: Introducing LSM6DSOX, iNEMO 6DoF inertial measurement unit (IMU), with Machine Learning Core

Time: 9:30 – 10:10

Speaker: Edoardo Gallizio, STMicroelectronics

Machine Learning Core is a unique, revolutionary approach ST IMUs are offering; Decision trees are predictive model built from training data: can be configured and tuned based on data-log collected by developers and users, enabling to have classification algorithms running at sensor level, by reducing the MCU or AP power consumption; This innovative pattern classification approach of events will enable a new wave of consumer, Industrial or IoT applications by reducing the computation requirements and offering the capability of generating Meta-data at Intelligent nodes level directly at extremely low power consumption, with additional positive effects of reducing the amount of data to be transmitted to the cloud.

Applications Enabled by ST’s Time-Of-Flight Technology

Time: 10:20 – 11:30

Speaker: John Kvam, STMicroelectronics

Based on a simple concept, ST FlightSense™ technology enables a large variety of applications. This session will present several different applications enabled by ST technology.

Eval kits and Development Platforms for MEMS Sensors: A Comprehensive Environment for Fast Go-to-Market

Time: 12:30 – 1:10

Speaker: Thiago Reis, STMicroelectronics

With the fast expansion of the adoption of MEMS & Sensors into new markets and applications such as wearables, industrial, smart home and building automation, and smart speakers, ST has prepared a full set of development platforms capable of enabling complex system-level designs by bridging multiple key application building blocks (hardware and software) within its Open Development Environment.

This session will introduce and detail platforms with unique features that will allow testing, prototyping and developing a final product around ST Sensors. This session will explore:

• IoT Discovery Kit: STM32L4 Discovery kit IoT node, low-power wireless, BLE, NFC, Sub-GHz, Wi-Fi
• Sensor Tile Development Kit
• BlueNRG-Tile: Bluetooth LE enabled sensor node development kit
• STM32 Nucleo Expansion boards
• Professional MEMS tool: ST MEMS adapter motherboard

Creation of a Custom Product Based on SensorTile.box Technology in Real Time-to-Market Mode

Time: 1:20 – 2:00

Speaker: Christian Raineri - CTO, FAE Technology

The creation of an IoT product is complex and requires several competences, from electronics to mechanics and takes often great effort on time and investment. Thanks to SensorTile.box evaluation kit and FAE Technology proven experience and capabilies, the creative process of and IoT product can be done in “real time to market” mode: sure minimum time and safe result.

Microsoft Azure IoT & the Intelligent Edge

Time: 2:10 – 3:10

Speaker: Jennifer Skinner-Gray, Microsoft

Microsoft is leading in IoT because we’re passionate about simplifying IoT so any company can benefit from it quickly and securely. IoT is transforming every business on the planet, and that transformation is accelerating. Companies are harnessing billions of IoT devices to help them find valuable insights into critical parts of their business that were previously not connected.

Using Stepper Motor Drivers in Voltage and Current Mode

Time: 3:30 - 5:00

Speakers: Dennis Nolan, STMicroelectronics

This session will focus on the PowerSTEP01, a system-in-package integrating 8 N-channel 16 mΩ MOSFETs for stepper applications up to 85 V with an SPI programmable controller, providing a full digital control of the motion through a speed profile generation and positioning calculations. The device can operate with both voltage mode driving and advanced current control fitting different application needs. The digital control core can generate user’s defined motion profiles with acceleration, deceleration, speed or a target position easily programmed through a dedicated register set. The technical session will illustrate how to properly configure the device and how to solve typical challenges of a stepper motor design.

The concepts demonstrated here apply also apply to L6470 STSpin family of products.

STM32G4 Mixed Signal MCU – Hands-on Training

Time: 9:30 – noon

Speaker: STMicroelectronics team

The new STM32G4 mixed signal MCU is ideal for todays advanced control and measurement applications such as three-phase brushless motor control, instrumentation and digital switch-mode power supplies with its rich set of analog peripherals, mathematical accelerators and high resolution timers. This one-day hands-on workshop will introduce embedded engineers to the new STM32G4 features through hands-on exercises. The hands-on exercises will be on the STM32G474 Discovery board that features the STM32G474RET6 MCU based on Arm^® Cortex^®-M4 core operating up to 170 MHz with 512 Kbytes of Flash memory, 128 Kbytes of SRAM in a LQFP64 package along with several application circuits including a digital power buck-boost converter and RGB power LED.

This training was developed for embedded engineers working with microcontroller for digital control applications.  You will learn:

• The new features and peripherals on the STM32G4 microcontroller series
• How to get started with the STM32G474 Discovery kit (B-G474E-DPOW1), STM32CubeMX and Keil MDK
• How to configure and use the new features of the STM32G4 through hands-on exercises

This is a working session. You will need a laptop with a Type A USB port and a Type C USB port and administrator rights running Windows 7 or later, or a MacBook running Windows (Parallels, VM Fusion, etc.), with a minimum 2 GHz processor, 4 GBs of RAM and 10 GBs of free disk space. For laptop with only USB Type C ports, please bring a Type A (Female) to Type C (Male) adapter. ST will provide the development kit and all software.

SPACE IS LIMITED FOR THIS SESSION – FIRST COME, FIRST SEATED. Must be present and stay for training to receive the free kit.

How to Connect to AWS IoT Core using Amazon FreeRTOS for Embedded Devices – Hands-on Workshop using STM32L4 Discovery Kit IoT Node

Connect your STM32 Dev Kit to IBM Watson IoT and build your Cloud Application using Node-RED

Time: 3:30 – 5:30

Speakers: John Walicki, IBM

During this hands-on workshop presented by IBM, attendees with use a STM32 Dev Kit to connect to IBM Watson IoT, stream live sensor data to the Cloud and learn how build their application using Node-RED.

This a working session. Participants will need their own laptop running either Windows 7 or later, Ubuntu Linux 18.04 or equivalent, MacBook with MacOS 10.11.6 or later. Participants should have a basic understanding of the “C” programming language or equivalent. Note: Administrator rights are needed for software and driver installation. ST will provide the development kit and all software.

SPACE IS LIMITED FOR THIS SESSION – FIRST COME, FIRST SEATED.

Simplifying Wireless IoT application Development using the SensorTile.Box kit (Hands-on Workshop)

Time: 9:30 – noon

Speaker: STMicroelectronics team

Looking to develop applications that use Motion and Environmental MEMS sensors? This workshop will show you how to use the STEVAL-MKSBOX1V1 (SensorTile.Box), a ready-to-use kit for wireless IoT applications.

The SensorTile.Box features ST newest sensors including LSM6DSOX – IMU with Finite State Machine and Machine Learning Core, LIS2DW12 – ultra low-power Accelerometer, LIS3DHH ultra low-noise Accelerometer, LIS2MDL – wide dynamic range Magnetometer, LPS22HH – improved accuracy barometric Pressure sensor, HTS221 – Relative Humidity and ambient Temperature sensor, STTS751 – on-board Temperature sensor to support temperature compensation, and MP23ABS1 – high performance analog Microphone. The ultra low-power Cortex-M4F STM32L4 provides all the processing capabilities that may be required by the application, while the Bluetooth low-energy module SPBTLE-1S provides the connectivity capabilities to interact with and stream to mobile phones.

The workshop will show how to use the SensorTile.Box out of the box (entry level mode) with many read-to-use applications to set up sensors, log sensor data, leverage embedded smart sensor functions (pedometer), and perform high-level processing (sensor fusion); the workshop will also show how to build a custom application (expert mode) using the GUI in the ST BLE Sensor app to build the data and control flow; and finally it will show how to develop a custom firmware (pro mode) starting from the examples available in the Function Pack FP-SNS-STBOX1.

Join us and learn how the SensorTile.Box wireless IoT kit can simplify your next application development.

This a working session. For the training on the entry-level and expert mode, participants will need their mobile phone, Android or iOS, with the ST BLE Sensor app installed. For the training on pro mode, participants will need their own laptop running Windows 7 or later, or a MacBook running Windows (Parallels, VM Fusion, etc.); participants should have a basic understanding of the “C” programming language or equivalent. Note: Administrator rights are needed for software and driver installation. ST will provide the development kit and all software.

SPACE IS LIMITED FOR THIS SESSION – FIRST COME, FIRST SEATED. Must be present and stay for training to receive the free kit.

Simplifying Motion MEMS and Environmental Sensors Design Using the STM32CubeMX and the X-CUBE-MEMS1 Software Pack (Hands-On Workshop)

Time: 12:30 – 3:00

Speaker: STMicroelectronics team

Looking to add motion and environmental sensors to your next product? This workshop will show you how to use an X-Nucleo IKS01A3 Sensor Board with an STM32L4 Nucleo Board and the X-CUBE-MEMS1 software pack for STM32CubeMX to get started on a new sensor project. The X-Nucleo IKS01A3 Sensor Board features ST newest sensors including LSM6DSO - IMU, LIS2DW12 - Accelerometer, LPS22HH - Pressure Sensor for lower power and improved accuracy and STTS751 – Digital Temperature sensor for on-board temperature calibration in the final application. The Workshop will show how the STM32CubeMX can be used to set up the sensors, log sensor data, optimize sensor configurations and leverage embedded smart sensor functions. Join us and learn how the ST32CubeMX ecosystem can simplify your next sensor design.

This a working session. Participants will need their own laptop running Windows 7 or later, or a MacBook running Windows (Parallels, VM Fusion, etc.). Participants should have a basic understanding of the “C” programming language or equivalent. Note: Administrator rights are needed for software and driver installation. ST will provide the development kit and all software.

SPACE IS LIMITED FOR THIS SESSION – FIRST COME, FIRST SEATED. Must be present and stay for training to receive the free kit.

Verizon ThingSpace – Simplifying your IoT Cellulare Journey

Time: 3:30 – 5:15

Speaker: Michael Arenas, Verizon

This session will talk about Verizon’s IoT solutions and how we help simplify your cellular experience from prototype to final product.  Verizon offers a variety of certified modules, developer kits and finished products such as our Critical Asset Sensor (CAS) along with our ThingSpace Ready program to help you accelerate your development process. ThingSpace provides you the tools to manage your solution in a single platform and our LTE-M and Narrowband IoT (NB-IoT) networks give you complete flexibility to build out your solution leveraging the benefits of a secure, scalable, and reliable cellular LTE network.

Wireless Charging in Consumer Applications

Time: 9:30 – 10:10

Speakers: Paolo Battezzato, STMicroelectronics

Inductive-based Qi wireless charging has become a standard feature in many mobile phones in the last few years, allowing users to cut “the last cord” and go completely wireless. It is now finding its way in personal electronics, wearables, industrial and medical applications. This segment will offer an overview of wireless charging basics and focus on the key aspects of the WPC (Wireless Power Consortium) Qi standard. It will cover the solutions ST offers for both Transmitter and Receiver applications, illustrating how they can be used to implement complete wireless charging systems in the power range from 1W up to 15W, including the support of proprietary fast charging methods for mobile phones.

Magnetics Efficiency and Component Selection for the USB Type-C Development Kit

Time: 10:20 – 11:00

Speaker: Hebberly Ahatlan, Wurth Electronics

During this presentation, Wurth Electronics will discuss in depth why some specific magnetic constructions could be more beneficial depending on your DC/DC application. Additionally, learn about some of the passives used in these kits and the benefits they bring into the design.

USB Type-C PD

Time: 11:10 – 11:50

Speaker: Paolo Battezzato, STMicroelectronics

USB standard has evolved from a data interface capable of supplying limited power to a primary provider of power with a data interface. The new USB Type-C PD is now enabling a new ecosystem. Different use cases will be explained, showing implementations and major products involved.

Efficient Power Delivery for Modern Data Centers

Time: 12:30 – 1:10

Speaker: Paolo Sandri, STMicroelectronics

Modern Data Centers power consumption is skyrocketing driven by usage of digital ASICs whose continuous power can reach hundreds of watts. An effective way to improve power delivery is to move from the traditional 12V distribution bus to 48V bus. However, 48V DC bus power distribution poses various challenges in terms of conversion efficiency, power density and total BOM optimization. ST offers a wide set of architectures to better fit, virtually, any need when converting from 48V to either an intermediate bus or directly to POL (i.e. CPU, DDR, GPU, Networking ASIC, etc.).

The architectures proposed for the intermediate bus conversion can either provide a regulated output (for example 12V) or an unregulated bus linked to the input voltage by a defined conversion ratio (for example if conversion ratio is 4:1 the Vout will be Vin/4). For both the architectures, challenges on efficiency and power density are addressed with solutions that can deliver from few hundreds watts to few KW.

The other branch of conversion from the 48V DC bus is the direct conversion to POL, where the architectures are designed to deliver power directly to the Digital ASIC whose core typically requires several hundred Watts. For the direct conversion power delivery, besides the above aspects of efficiency and power density optimization, few other key challenges need to be addressed such as the compliance with the specific ASIC power needs that, usually, requires a certain degree of sophistication in term of accuracy and mode of operations (sink and source capability, dynamic voltage positioning, PMBus requirements, dedicated communication bus requirements, etc.).

The session will go over a series of architectures that successfully address the above challenges for both classes of conversions (intermediate bus or direct conversion).

Designing Low Power SMPSs with ViperPlus Family of Products

Time: 1:20 – 2:00

Speaker: Ivan Ivanov, STMicroelectronics

ST’s ViperPlus series of high voltage PWM switchers with embedded 800V avalanche rugged power MOSFET targets a wide variety of low power (<15 W) Switch Mode Power Supply (SMPS) topologies found in power adapters, home appliance, home automation, Internet of things (IoT) and many other industrial applications.

The presentation introduces the family of ViperPlus products and provides detailed information about how to select the most suitable Viper IC based on the available specifications. Two design examples are provided to the audience to show how to effectively use Viper products in sensitive use cases where efficiency and low electromagnetic interference are paramount. The last part of the presentation focuses on E-Design Suite: our online software tool for SMPS design that greatly helps to speed up the design workflow and optimization process of power supply applications.

Ultra-low Power, Zero Drift Operational Amplifiers for Industrial and Remote Analog Sensors

Time: 2:10 – 2:50

Speaker: Gregory Gosniak, STMicroelectronics

Sensors in today’s world are extensively used to measure weight, read temperature, evaluate gas concentration, identify VOC, control speed and more. Even though we live in an increasingly digital world, many sensors today are bound to operate in the analog domain. And most of them provide an extremely small signal that needs to be amplified, before being converted into bits of digital information for processing and visualization. Precision operational amplifiers are the primary link between these analog sensors and the digital world.

In this presentation, the theoretical foundations of precision in operational amplifiers will be explored, the fundamentals of the four underlying parameters affecting precision will be presented, and the theoretical and practical explanation of a gas sensor operation with ST’s TSZ121 zero drift operation amplifier will be presented.

Ultrasound Pulsers for Non-Destructive Testing and Medical Imaging Applications

Time: 3:30 – 4:10

Speaker: Steffan Grahlmann, STMicroelectronics

Ultrasound can be used to measure distance, identify direction, and evaluate size, speed and movement of objects. In this presentation, the theoretical foundations of ultrasound imaging will be explored, the fundamentals of the underlying physics will be presented, and the theoretical and practical explanation of the basics of Ultrasound Imaging on the medical and industrial field will be described together with an introduction to ST portfolio of application specific standard products.

Smart Automotive Domain Gateways

Time: 9:30 – 10:10

Speaker: Khaldoun Albarazi, STMicroelectronics

The vastly increasing demand of vehicle connectivity and infotainment as well as the rapid growth in vehicle autonomy, as in autonomous driving and ADAS (Advance Driver-Assistance System), demands a transformation in the vehicle architecture.

Today’s architectures are mostly flat relying on peer-to-peer, distributed electric and electronic control systems resulting in unmanageable complexities, degradation in scalability, in adequate response time, cost inefficiencies, and implementation challenges for safety and security.

A centralized, hierarchical architecture that integrates multiple functions into stackable controllers offers a consolidated decision-making while increasing the standardization and flexibility and simplifying the development effort. Domain controllers, also called domain gateways, are powerful computing platforms that coordinate the operation of multiple functions across one or more traditional application. The concept; however, necessitates high performance processing units capable of handling multiple tasks in real-time while maintaining strict separation of tasks to guarantee safe and secure execution.

The purpose of this presentation is to provide an overview of the evolution of vehicle architecture towards a domain-driven partitioning.

Discover ST’s Unique GNSS Modules: Best-in-Class Performance, Competitive Price and Easy-to-Design Teseo-LIV3x Family

Time: 10:20 – 11:00

Speaker: Sara Mattioli, STMicroelectronics

Teseo-LIV3x Global Navigation Satellite System (GNSS) standalone modules embed ST’s TeseoIII single die standalone positioning receiver IC, working simultaneously on multiple constellations (GPS/Galileo/Glonass/BeiDou/QZSS).

With these products ST is offering a technological breakthrough for all GNSS IoT applications.

This presentation will give an overview of the available GNSS modules family and roadmap, their best-in-class features and unique benefits, our easy-to-use HW/SW Evaluation and Development Tools, including ST’s LoRa IoT Reference Design with STM32.

How to Efficiently Separate Automotive Functions within a Multi-core System with EB tresos AutoCore Hypervisor

Time: 11:10 – 11:50

Speaker: Khaldoun Albarazi, STMicroelectronics and Christoph Dietachmayr, Elektrobit

The architecture of new vehicles continues to evolve, and is resulting in the consolidation of functions across the entire vehicle. Such evolution has led to the development of necessary concepts to realize virtual electronic control units (ECUs). The separation of functional components within one ECU must be guaranteed, and can be enabled via a multi-core system. Additionally, the interaction of safety requirements must be considered and applied.

EB tresos AutoCore Hypervisor is a virtual ECU concept that enables at least two software instances on separated cores, and is a perfect solution for the separation of functions within a multi-core system. It is a well-suited solution, and supports use cases with features for cross-core communication, inter-core notification, and core resource management.

In this presentation we will look at a number of use cases for EB’s hypervisor concept, its value to stakeholders and its importance in handling complex software systems.

We will also discuss the separation of functions within a multi-core system, the high level of complexity due to increased functional consolidation, and how to enable complex project execution.

Moreover, an introduction to ST’s approach to enable a high performance, real-time, and deterministic virtualization on the next generation MCUs will be presented.

Precise Vehicle Positioning Enabled by ST's 6-axis IMU

Time: 12:30 – 1:10

Speaker: Stuart Ferguson, STMicroelectronics and Mike Horton – CTO, Aceinna

Autonomous driving, V2X (Vehicle to Everything) and basic vehicle navigation relies heavily on the system’s ability to track the position of a vehicle at any moment. Satellite data is not always accurate when driving between tall buildings, or available, when in a tunnel or parking structure. The car, however, must still be able to update its position until the signal is available. Hence, inertial sensors, when used in conjunction with ST GNSS solutions (Teseo III and Teseo V), offer amazingly affordable and precise solutions to implement dead-reckoning algorithms and other corrections that can keep track of the vehicle’s position and movements. STMicroelectronics is today the leading supplier of 3 Axes gyros for Dead Reckoning (A3G4250D), and is continuing its market leadership with the recent launch of the new high accuracy, high stability 6 Axes IMU, the ASM330LHH. We will also feature module solutions from ST partner Aceinna, such as the OpenRTK330 high-performance GNSS receiver with built-in, triple redundant inertial sensors.

Overview of Advanced Driver Assistance Systems (ADAS): Active Safety and Autonomous Driving

Time: 1:20 – 2:00

Speaker: Raed Shatara, STMicroelectronics

Advanced Driver Assistance Systems (ADAS) include many sensors and processing units that collects critical information to be utilized to alert the drivers of dangerous situation so they take action to correct it. Lane Departure Warnings (LDW) and Forward Collision Warnings (FCW), for example, alert the driver to impending danger, so the driver can take action. In contrast, fully active safety systems take action directly, with examples being Automatic Emergency Braking (AEB), Adaptive Cruise Control (ACC), Lane-Keeping Assist (LKA), Lane Centering (LC), and Traffic-Jam Assist (TJA).

To “assist” drivers, and in the future to become fully autonomous, cars require very advanced technologies and a multi-faceted approach with redundancy. The key building blocks required to achieve that goal are Machine Vision, Radar(s); Infrared, Lidar; V2X and precise positioning. In addition, vehicles will need high-speed interconnect and secure connectivity with the rest of the world (cloud services, infrastructure etc.).

This presentation will give an overview of the key building blocks of ADAS systems.

Power Semiconductors for New Energies

Time: 2:10 – 2:50

Speaker: Alfredo Arno, STMicroelectronics

Efficiency in power conversion is critical for the deployment and adoption of new energies which include solar and battery powered applications. ST power semiconductors technologies and packages are developed to surpass efficiency targets. The presentation will provide an overview of the ST power product offering in silicon and new wide band gap materials with focus on SiC discrete products and modules. Examples of the benefits of these new materials will be provided in rapidly growing electric vehicles.

Technology Advancements Enabling True Real-time Automotive ARM R52 Core Microcontrollers: Introducing ST’s Next-Gen Automotive Domain MCU

Time: 3:30 – 4:30

Speaker: Roger Forchhammer, STMicroelectronics

Technological breakthroughs are advancing automotive microcontrollers into unprecedented domains, providing advanced connectivity and security to support the transition to service oriented automotive system architectures. The advantages of 28nm FD-SOI and embedded Phase Change Memory (PCM) are fundamental for the development of next generation vehicle architectures as they support the need for real-time update (OTA), power efficiency and robustness (safety). With these building blocks ST has developed and introduced the 1st real-time, multicore, ASIL-D ARM^® Cortex^® - R52 automotive microcontroller family with on-chip non-volatile memory for real-time multi-core performance; With full ISO26262 ASIL-D coverage and hypervisor providing new industry reference for functional safety.

This presentation will give an overview of the technology advancements of FD-SOI and PCM, leading to the development and introduction of the Stellar MCU family.