Product overview
Description
The STM32MP257F-DK Discovery kit is designed as a complete demonstration and development platform for the STMicroelectronics STM32MP257FAK3 based on the Arm® Cortex® A35 and M33.
The product leverages the capabilities of STM32MP2 series microprocessors to allow users to develop applications using STM32 MPU OpenSTLinux Distribution software for the main processor (Arm® dual core Cortex®‑A35) and STM32CubeMP2 software for the coprocessor (Arm® Cortex®‑M33).
The product includes an ST-LINK embedded debug tool, LEDs, push-buttons, 1 Gbit/s Ethernet, one USB3 USB Type-C® PD, two stacked USB 2.0 HS Type-A, one LCD LVDS display connector, one HDMI connector, one camera connector, microSD™ card, Wi‑Fi® 802.11b/g/n, Bluetooth® Low Energy v4.1, and eMMC. To expand the functionality of STM32MP257F-DK, one GPIO expansion connector is also available for Raspberry Pi® shields.
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All features
- STM32MP257FAK3 microprocessor based on the Arm® dual‑core Cortex®‑A35 at 1.5 GHz and Cortex®‑M33 at 400 MHz in a VFBGA424 package
- STMicroelectronics power management STPMIC25
- 32‑Gbit LPDDR4 DRAM
- 64-Gbit eMMC v5.1
- 1‑Gbit/s Ethernet (RGMII)
- Two USB 2.0 high speed
- USB 3.0 SuperSpeed PD (DRP/DRD)
- Wi‑Fi® 802.11b/g/n
- Bluetooth® Low Energy v4.1
- Four user LEDs
- Two user, one tamper, and one reset push-buttons
- Wake-up button
- Four boot pin switches
- Board connectors:
- Ethernet RJ45
- Two stacked USB 2.0 HS Type-A
- USB 3.0 USB Type-C® PD
- microSD™ card holder
- Dual-lane MIPI CSI-2® camera module expansion connector
- HDMI®
- LVDS
- GPIO expansion connector
- VBAT for power backup
- On-board STLINK-V3EC:
- Debugger with USB re-enumeration capability: Virtual COM port and debug port
- Board power source through USB Type-C® (recommended to connect to 5 V/3 A USB host port)
- Mainlined open-source Linux® STM32 MPU OpenSTLinux Distribution and STM32CubeMP2 software with examples
- Linux® Yocto Project®, Buildroot, and STM32CubeIDE as development environments
All resources
Resource title | Version | Latest update |
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Board Manufacturing Specifications (2)
Resource title | Version | Latest update | ||
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ZIP | 1.0 | 17 Oct 2024 | 17 Oct 2024 | |
ZIP | 1.0 | 17 Oct 2024 | 17 Oct 2024 |
Bill of Materials (1)
Resource title | Version | Latest update | ||
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ZIP | 1.0 | 17 Oct 2024 | 17 Oct 2024 |
Schematic Pack (1)
Resource title | Version | Latest update | ||
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1.0 | 18 Oct 2024 | 18 Oct 2024 |
Quality and Reliability
Part Number | Marketing Status | RoHS Compliance Grade | Material Declaration** |
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STM32MP257F-DK | Active | Ecopack1 | |
STM32MP257F-DK
Package:
Ecopack1Material Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Supplier | Specific features | WEEE Compliant | Core Product | |
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STM32MP257F-DK | | | distributors No availability of distributors reported, please contact our sales office |
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STM32MP257F-DK Active
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors