VL53L9CA

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3D dToF all-in-one LiDAR module with on-chip processing

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Product overview

Description

The VL53L9CA is a state of the art, dToF 3D lidar (light detection and ranging) module with market leading resolution of up to 2.3k zones enhancing the ST FlightSense product family. Housed in a miniature reflowable package, it integrates all necessary components to make it a true all-in-one and easy to integrate module. The VL53L9CA includes a SPAD array, postprocessing SoC, two VCSELs powered by a dedicated BCD VCSEL driver providing a flood illumination, physical infrared filters, metasurface optical elements (MOE), and an embedded PMIC. The module is Class 1 laser safe, offering skin protection in addition.

The use of a MOE above the VCSELs allows to project an optimized rectangular FoV onto the scene. The receiver lens focuses the reflection of this light onto the SPAD array.

Unlike conventional IR sensors, the VL53L9CA uses ST's latest generation BSI stacked direct ToF technology, which allows absolute distance measurement whatever the target color and reflectance. It provides accurate ranging from below 5 cm up to 10 m. The VL53L9CA can stream processed data at maximum frame rate (60Hz), which makes it the fastest, truly integrated 3D lidar camera module on the market. Available output data: depth, 2D IR with active illumination, 2D IR without active illumination, reflectance, and confidence.

The VL53L9CA achieves the best ranging performance, including under strong ambient light conditions, with a range of cover glass materials. Multizone distance measurements are possible up to 54 x 42 zones with a wide 54°x42° FoV, which can be reduced by software.

  • All features

    • Fast and accurate 3D direct Time-of-Flight (dToF) camera module
      • Multizone ranging output with up to 54 x 42 separate zones and binning options
      • On-chip processing streaming 2D IR image, depth and ambient maps
      • Confidence level and reflectance maps generated in postprocessing
      • Ranging from <5 cm up to 10 m
      • Up to 60 Hz frame rate capability
      • On-chip histogram processing and algorithmic compensation minimize or remove the impact of cover glass crosstalk and veiling glare
    • Fully integrated miniature module with wide field of view (FoV)
      • Scan by two vertical-cavity surface-emitting lasers (VCSEL) flood illumination940 nm invisible light and integrated analog driver
      • 71° diagonal FoV using metasurface optical elements (MOE) on both transmitter and receiver
      • Receiving array of single photon avalanche diodes (SPADs)
      • Size: 12.8 x 6.1 x 4.6 mm
    • Easy integration
      • True all-in-one module with integrated SPAD sensor and VCSEL PMIC
      • Single reflowable component
      • Flexible power supply options:Supports dual power supply operation: 1.2 V & 3.3 V
      • Compatible with a wide range of cover glass materials

The current status of a product:
Active: Product is in volume production
Evaluation: Product is under characterization. Limited Engineering samples available
Preview: Product is in design stage
Target: Product is in design feasibility stage.No commitment taken to produce
Proposal: Marketing proposal for customer feedback.No commitment taken to design or produce
NRND: Not Recommended for New Design.Product is in volume production only to support customers ongoing production.
Marketing description of the package type.Compliancy of the device with industry requirement domains (IRD)The RoHS status of a product:
ECOPACK 1: Initial grade to identify European RoHS compliant products.
ECOPACK 2: New grade to identify brominated chlorinated and antimony oxide flame retardant free products.
ECOPACK 3: Halogen free RoHS exemptions free products.
(*): ECOPACK 2 version available upon request.
(**): Some versions still existing in ECOPACK 1 or not compliant.
The current status of a product:
Active: Product is in volume production
Evaluation: Product is under characterization. Limited Engineering samples available
Preview: Product is in design stage
Target: Product is in design feasibility stage.No commitment taken to produce
Proposal: Marketing proposal for customer feedback.No commitment taken to design or produce
NRND: Not Recommended for New Design.Product is in volume production only to support customers ongoing production.
Budgetary PriceMarketing description of the package type.Storage method used to contain product.Main country of assembly or fabrication of the product.ECCNs are five character alpha-numeric designations used on the Commerce Control List to identify dual-use items for export control purposes. ECCNs are five character alpha-numeric designations used on the Commerce Control List to identify dual-use items for export control purposes.The value as specified by level (minTypMax) of the ambient temperature (in Cel) in which this item was designed to operate.The value as specified by level (minTypMax) of the ambient temperature (in Cel) in which this item was designed to operate.The value as specified by level (minTypMax) of the ambient temperature (in Cel) in which this item was designed to operate.