Product overview
Description
The ASM330LHHXG1 is a 6-axis IMU featuring a 3-axis digital accelerometer and a 3-axis digital gyroscope with an extended temperature range up to +125°C, designed to address automotive nonsafety applications.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes to serve both the automotive and consumer markets. The ASM330LHHXG1 is AEC-Q100 compliant and industrialized through a dedicated MEMS production flow to meet automotive reliability standards. All the parts are fully tested with respect to temperature to ensure the highest quality level.
The sensing elements are manufactured using ST’s proprietary micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit, which is trimmed to better match the characteristics of the sensing element.
The ASM330LHHXG1 has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps that enables its usage in a broad range of automotive applications.
The device supports dual operating modes: high-performance mode and low-power mode.
All the design aspects of the ASM330LHHXG1 have been optimized to reach superior output stability, extremely low noise, and full data synchronization to the benefit of sensor-assisted applications like dead reckoning and sensor fusion.
The ASM330LHHXG1 is available in an overmolded 14-lead plastic, land grid array (LGA) package.
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All features
- AEC-Q100 qualified
- Android Auto™ compliant and CarPlay® compliant
- Extended temperature range from -40 to +125°C
- Embedded compensation for high stability over temperature
- Accelerometer user-selectable full scale up to ±16 g
- Extended gyroscope range from ±125 to ±4000 dps
- Dual operating modes: high-performance and low-power mode
- I²C, MIPI I3C℠, and SPI serial interfaces
- Six-channel synchronized output to enhance the accuracy of dead-reckoning algorithms
- Programmable finite state machine
- Machine learning core
- Smart programmable interrupts
- Embedded 3 KB FIFO available to underload host processor
- ECOPACK and RoHS compliant
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STMicroelectronics - ASM330LHHXG1
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Quality and Reliability
| Part Number | Marketing Status | Package | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| ASM330LHHXG1TR | Active | LGA 14L 2.5x3x0.86 mm | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||||
| ASM330LHHXG1TR | | | distributors No availability of distributors reported, please contact our sales office | |||||||||||
ASM330LHHXG1TR Active
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors