Product overview
Description
The STM32F411xC/xE devices are based on the high-performance Arm® Cortex® -M4 32-bit RISC core operating at a frequency of up to 100 MHz. The Cortex®-M4 core features a floating-point unit (FPU) single precision, which supports all Arm single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU), which enhances application security.
The STM32F411xC/xE belongs to the STM32 Dynamic Efficiency product line (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing to save even more power consumption during data batching.
The STM32F411xC/xE incorporate high-speed embedded memories (up to 512 Kbytes of flash memory, 128 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB bus and a 32-bit multi-AHB bus matrix.
All devices offer one 12-bit ADC, a low-power RTC, six general-purpose 16-bit timers including one PWM timer for motor control, two general-purpose 32-bit timers. They also feature standard and advanced communication interfaces.
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All features
- Includes ST state-of-the-art patented technology
- Dynamic efficiency line with BAM (Batch acquisition mode)
- 1.7 V to 3.6 V power supply
- - 40°C to 85/105/125 °C temperature range
- Core: Arm® 32-bit Cortex®-M4 CPU with FPU, adaptive real-time accelerator (ART Accelerator) allowing 0-wait state execution from flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
- Memories
- Up to 512 Kbytes of flash memory
- 128 Kbytes of SRAM
- Clock, reset, and supply management
- 1.7 V to 3.6 V application supply and I/Os
- POR, PDR, PVD, and BOR
- 4-to-26 MHz crystal oscillator
- Internal 16 MHz factory-trimmed RC
- 32 kHz oscillator for RTC with calibration
- Internal 32 kHz RC with calibration
- Power consumption
- Run: 100 µA/MHz (peripheral off)
- Stop (Flash in Stop mode, fast wakeup time): 42 µA typical at 25 °C; 65 µA max at 25 °C
- Stop (Flash in Deep power down mode, slow wakeup time): down to 9 µA at 25 °C; 28 µA max at 25 °C
- Standby: 1.8 µA at 25 °C / 1.7 V without RTC; 11 µA at 85 °C at 1.7 V
- VBAT supply for RTC: 1 µA at 25 °C
- 1×12-bit, 2.4 MSPS A/D converter: up to 16 channels
- General-purpose DMA: 16-stream DMA controllers with FIFOs and burst support
- Up to 11 timers: up to six 16-bit, two 32-bit timers up to 100 MHz, each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window) and a SysTick timer
- Debug mode
- Serial wire debug (SWD) & JTAG interfaces
- CortexÒ-M4 Embedded Trace Macrocell™
- Up to 81 I/O ports with interrupt capability
- Up to 78 fast I/Os up to 100 MHz
- Up to 77 5 V-tolerant I/Os
- Up to 13 communication interfaces
- Up to 3 x I2C interfaces (SMBus/PMBus)
- Up to 3 USARTs (2 x 12.5 Mbit/s, 1 x 6.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control)
- Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI, or I2S audio protocol), SPI2 and SPI3 with muxed full-duplex I2S to achieve audio class accuracy via internal audio PLL or external clock
- SDIO interface (SD/MMC/eMMC)
- Advanced connectivity: USB 2.0 full-speed device/host/OTG controller with on-chip PHY
- CRC calculation unit
- 96-bit unique ID
- RTC: subsecond accuracy, hardware calendar
- All packages are ECOPACK2 compliant
Circuit Diagram
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All resources
| Resource title | Version | Latest update |
|---|
System View Description (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 2.0 | 12 Feb 2024 | 12 Feb 2024 |
IBIS models (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.0 | 13 Jan 2016 | 13 Jan 2016 |
BSDL files (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.0 | 01 Aug 2015 | 01 Aug 2015 |
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| STM32F411VEH6 | Active | UFBGA 100 7x7x0.6 P 0.5 mm | Industrial | Ecopack2 | |
| STM32F411VEH6TR | Active | UFBGA 100 7x7x0.6 P 0.5 mm | Industrial | Ecopack2 | |
| STM32F411VET6 | Active | LQFP 100 14x14x1.4 mm | Industrial | Ecopack2 | |
| STM32F411VET6TR | Active | LQFP 100 14x14x1.4 mm | Industrial | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | D/A Converters (typ) (12-bit) | Timers (typ) (16-bit) | Timers (typ) (32-bit) | Number of Channels (typ) | SMPS | Number of Channels (typ) | UART (typ) | I/Os (High Current) | Integrated op-amps | Comparator | SPI (typ) | USART (typ) | Number of Channels (typ) | I2S (typ) | Advanced Motor Control Timers | CAN (2.0) | CAN (FD) | Ethernet | ||
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| STM32F411VEH6 | | | distributors No availability of distributors reported, please contact our sales office |
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| STM32F411VEH6TR | | | distributors No availability of distributors reported, please contact our sales office |
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| STM32F411VET6 | | | distributors No availability of distributors reported, please contact our sales office |
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| STM32F411VET6TR | | | distributors No availability of distributors reported, please contact our sales office |
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STM32F411VEH6 Active
STM32F411VEH6TR Active
STM32F411VET6 Active
STM32F411VET6TR Active
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors