Our strategic programs
R&D investment. 16% of our revenues in 2024.
Facilities. 14 main manufacturing sites.
Capex expenditure. ~$2.5B in 2024.
We are continuously investing in our proprietary technologies and sustainable manufacturing facilities.
A key enabler for your innovation
We are investing in competitive proprietary technologies and in-house manufacturing to deliver a unique portfolio of differentiated solutions supported by a robust and flexible supply chain.
300 mm wafer capacity expansion
Agrate, Crolles
We are strengthening our unique 300 mm wafer digital manufacturing capacity in Crolles (France) and expanding our 300 mm capability to analog with a new facility in Agrate (Italy). These investments support our customers worldwide as they transition to digitalization and decarbonization.
Target for H2 2026
20%
capacity output increase in Crolles.
Advanced BCD capacity
9,000
wafers per week in Agrate at full build out.
Wide bandgap capacity expansion
Catania, Singapore, Norrköping, Tours, Chongqing
We are significantly expanding the silicon carbide (SiC) capacity in our Catania (Italy) and Singapore fabs, as well as through our Joint Venture in Chongqing, China. We are also accelerating our vertical integration through our Silicon Carbide Campus in Catania, integrating all steps in the production flow. We are investing in gallium nitride (GaN) technology, building capabilities, and capacity to support our business ambitions.
Silicon carbide
x2
capacity between 2024 and 2027-2028
200 mm SiC capacity
15,000
wafers per week in Catania at full build out
Collaboration with leading foundries and OSAT partners.
We collaborate with leading foundries and outsourced semiconductor assembly and test (OSAT) partners to enable access to selected technologies such as leading-edge digital technologies and packages to complement our portfolio. Examples include TSMC for FinFET technology, Samsung Foundries and GlobalFoundries for the FD-SOI ecosystem, HHGrace for China-for-China business, and ASE and AMKOR for advanced BGA and WLCSP packages.
Front-end 
Back-end 