Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The company excels in providing customer-driven memory solutions, supported by its expertise in product design, research and development (R&D), manufacturing, and sales services. Winbond’s diverse product portfolio includes Specialty DRAM, Mobile DRAM, Code Storage Flash memory, and TrustME® Secure Flash memory. These products are widely utilized by tier-1 customers across various markets, including communication, consumer electronics, automotive, industrial, and computer peripherals.
Winbond Products
Winbond’s DRAM roadmap includes a wide range of products to meet diverse application needs:
- DDR4: 4Gb
- DDR3: 1Gb-8Gb
- DDR2: 128Mb-2Gb
- LP-DDR2: 512Mb-2Gb
- LP-DDR4/4x: 1Gb-8Gb
- LP-DDR3: 512Mb-1Gb
- LP-DDR: 256Mb-1Gb
- SDRAM Interfaces: 64Mb-256Mb
- HYPERRAM: 64Mb-512Mb (major for ST MCU purpose, like STM32U5, STM32N6, STM32H7RS)
These products cater to applications requiring DRAM densities of 4Gb or below, such as AI accelerators, IoT devices, automotive systems, industrial equipment, telecommunication infrastructure, WiFi-6 and WiFi-6e devices, xDSL and fiber-optical networks, smart TVs, set-top boxes, IP cameras, and more.
Manufacturing and Market Growth: Since Q4 2022, Winbond has expanded its wafer capacity with a new fabrication facility in Kaohsiung, Taiwan, which employs advanced manufacturing technologies. This expansion supports the increasing demand for DRAM products. Currently, DDR3 shipments constitute 30% of Winbond's total DRAM revenue, with projections to rise to 50% by 2024.
Winbond continues to innovate and expand its product offerings to meet the evolving needs of its customers, solidifying its position as a key player in the semiconductor memory solutions market.
Products and Services offered:
• Companion Devices
Company Head Office address:
No. 8, Keya 1st Rd., Daya Dist., Central Taiwan Science Park, 42881, Taichung City, Taiwan
Company primary contact:
Tetsu Ho
Company website:
www.winbond.com
Partner Product | Description | Associated ST Products |
---|---|---|
Winbond HYPERRAMs | 256Mb 1.8V x16 and x8 HYPERRAMs | STM32U5 Series |
Winbond 4Gb DDR3L SDRAM | W634GU6RB 4Gb DDR3L SDRAM 1.35V x16 VFBGA96 | STM32MP135 STM32MP157 STM32MP257 |
Winbond 4Gb DDR4 SDRAM | W664GG6RB 4Gb DDR4 SDRAM 1.2V x16 VFBGA96 | STM32MP257 |
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