STA1385

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Telemaco3P automotive family of telematics and connectivity microprocessor

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Product overview

Description

STA1385 is a fully automotive, power efficient System-On-Chip, targeting cost effective processing solutions for innovative Telematics and Connectivity applications including Cyber-security protection.

It features a powerful Dual ARM Cortex-A7 processor, an embedded and independent Hardware Security Module (HSM), an isolated sub-system based on ARM Cortex-M3 for vehicle CAN interface and a full set of standard connectivity interfaces, including a dual Gbit ETH AVB controller and Flexray.

  • All features

    • AEC-Q100 qualified Grade 2 Core and Infrastructure
    • Dual ARM CortexA7 up to 600 MHz, withMMU, FPU and NEON support
    • Memory organization:Embedded Vehicle Interface
      • L1 Cache: 32 KB I, 32 KB D
      • L2 Cache: 256 KB
      • Total embedded SRAM: 768 KB
    • Isolated Cortex-M3 core
      • L1 Cache: 8 KB I
    • 256 KB reserved embedded SRAM (extendible to 768 KB)
    • 1x CAN Standard (C_CAN)
    • 2x CAN FD (M_CAN)
    • 1x Flexray
    • 1x SD/MMC/SDIO SDR50 (SD/MMC0)
    • 1x SD/MMC/SDIO SDR25 (SD/MMC1)
    • 1x USB 2.0 DR with HS PHY and HSIC
    • 1x USB 2.0 DR with HS PHY
    • 2x ETH AVB MAC with RMII/RGMII
    • HIS SHE/SHE+ Service Set with extensions for PKC (SHE_EXT)
    • Cryptographic Functions Accelerators
      • Symmetric keys: MP AES
      • Public keys: RSA, ECC
      • Hash: MD5, SHA1, SHA2
    • True Random Number Generator
    • User pogrammable OTP memory (eHSM OTP)
    • 16-bit DDR3L-1066 (533 MHz)
    • 16-bit LPDDR2-800 (400 MHz)
    • SQI Interface
    • 8-bit Parallel NAND (1 chip select)
    • 1x 6-channel 10-bits ADC
    • 3x I2C multi-master/slave interfaces
    • 6x UART controller
    • 3xI2S audio interfaces
    • 3x Synchronous Serial Port (SSP/SPI)
    • 5x 32-bit GPIO ports
    • JTAG based in-circuit emulator (ICE) with Embedded Trace Module
    • VDD, VDD_ARM: 1.14 V-1.21 V
    • VDD_IO_3V3: 3.3 V ±10%
    • VDD_IO_SDMMC0: 1.8 V-3.3 V ±10%
    • VDD_IO_BOOT: 1.8 V/3.3 V ±10%
    • VDD_IO_ON: 3.3 V ± 10%
    • VDDQ: 1.35 V ± 5% (DDR3L)
    • Junction temperature range: -40 C/ +150 C

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STMicroelectronics - STA1385

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
STA1385EOAS2
Active
LFBGA 361 16x16x1.7 Automotive Ecopack2
STA1385EOAS2TR
Active
LFBGA 361 16x16x1.7 Automotive Ecopack2

STA1385EOAS2

Package:

LFBGA 361 16x16x1.7

Material Declaration**:

PDF XML

Marketing Status

Active

Package

LFBGA 361 16x16x1.7

Grade

Automotive

RoHS Compliance Grade

Ecopack2

STA1385EOAS2TR

Package:

LFBGA 361 16x16x1.7

Material Declaration**:

PDF XML

Marketing Status

Active

Package

LFBGA 361 16x16x1.7

Grade

Automotive

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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STA1385EOAS2 Active

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-
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Packing Type:
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ECCN (EU):

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STA1385EOAS2

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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors