MTP-TC3P-DVK

Active
Save to myST

Evaluation Kit for Telemaco3P STA1385 Processor in Telematics Platform Application

Download databrief
Overview

Product overview

Description

The MTP (modular telematics platform) provides an open development environment for prototyping smart driving applications, including vehicle connectivity to cloud services, to infrastructure and to other vehicles.

At the core of the MTP there is the ST Telmo and a set of module that integrates the ST’s Telemaco3P (STA1385) ASIL-B processor for an extended set of the NVM and DDR memories. The STA1385 device is automotive qualified for extended thermal range up to +150 °C junction temperature and includes a dedicated and isolated hardware security module to provide state-of-the-art on-chip security against automotive cyber-attacks.

The MTP also integrates ST’s automotive-grade multi-constellation GNSS Teseo IC with dead-reckoning sensors and offers expansion connector for optional plug-in TeseoAPP precise positioning module.

The platform enables the direct connection of automotive buses such as CAN, FlexRay, and BroadR-Reach® (100Base-T1), and features expansion connectors for several wireless connectivity options including BLE, Wi-Fi, LTE modules as well as V2X modules based on Autotalks Craton2 / Pluton2 products.

The MTP is delivered with a comprehensive starter package including everything required for the users to get started quickly, e.g. hardware design files, Linux BSP SW based on Yocto, sample application SW, optimized GNSS firmware and software tools (Teseo Suite, Flash Loader, UART port drivers).

  • All features

    • Telemaco3P core processor module with 16x16 LFBGA (0.8 mm pitch) STA1385 Telemaco3P, 64 MB SQI NOR, 2 Gb NAND Flash, 2 8 GB EMMC, 512 MB DDR3L
    • Crash detection accelerometers
    • Teseo III multi-constellation GNSS system
    • 6-axis accelerometer, odometer and rear gear engaged circuit for dead reckoning
    • 2 Ethernet, compliant with IEEE-802.3-2002
    • 1 user and reset push-buttons
    • Backup battery circuit
    • MEMS microphone and class-D audio out
    • Board connectors:
      • 2 Ethernet RJ45
      • FlexRay and 100Base-T1 headers
      • 3 DB-9 CAN/CAN-FD
      • 2 mini-B USB
      • mini-B USB-UART debug port
      • SD™ card slot
      • RCA amplified audio out
      • SMA external GNSS antenna
      • JTAG connector
    • Board expansion connectors:
      • LTE modem module
      • Wi-Fi module
      • V2X module
      • Solder on ST33 e-SIM / HSM
      • Alternative MEMS sensors module
      • Precise positioning with dual-band Teseo-APP and L-Band Teseo –L modules
Products

Search History

Bookmark

Please log in  to show your saved searches.

▼

Did you know?

Please provide email

Please enter code

Congratulations!

Simple subscription

Congratulations!

x

You can start following this product to receive updates when new Resources, Tools and SW become available. It's easy and takes only 1 minute.

You can start following this product to receive updates when new Resources, Tools and SW become available. It's easy and takes only 1 minute.

You can start following this product to receive updates when new Resources, Tools and SW become available. It's easy and takes only 1 minute.

Invalid code, please check the code sent to your email address and validate again. In case you did not receive any code please select 'I did not receive code'

You can start following this product to receive updates when new Resources, Tools and SW become available. It's easy and takes only 1 minute.

Please review our Privacy Statement that describes how we process your profile information and how to assert your personal data protection rights

You are now subscribed to
- MTP-TC3P-DVK

You can re-use the validation code to subscribe to another product or application.

Sorry, there was a problem on our servers. Please try again.
The current status of a product:
Active: Product is in volume production
Evaluation: Product is under characterization. Limited Engineering samples available
Preview: Product is in design stage
Target: Product is in design feasibility stage.No commitment taken to produce
Proposal: Marketing proposal for customer feedback.No commitment taken to design or produce
NRND: Not Recommended for New Design.Product is in volume production only to support customers ongoing production.The RoHS status of a product:
ECOPACK 1: Initial grade to identify European RoHS compliant products.
ECOPACK 2: New grade to identify brominated chlorinated and antimony oxide flame retardant free products.
ECOPACK 3: Halogen free RoHS exemptions free products.
(*): ECOPACK 2 version available upon request.
(**): Some versions still existing in ECOPACK 1 or not compliant.The current status of a product:
Active: Product is in volume production
Evaluation: Product is under characterization. Limited Engineering samples available
Preview: Product is in design stage
Target: Product is in design feasibility stage.No commitment taken to produce
Proposal: Marketing proposal for customer feedback.No commitment taken to design or produce
NRND: Not Recommended for New Design.Product is in volume production only to support customers ongoing production.Budgetary PriceMain country of assembly or fabrication of the product.ECCNs are five character alpha-numeric designations used on the Commerce Control List to identify dual-use items for export control purposes. ECCNs are five character alpha-numeric designations used on the Commerce Control List to identify dual-use items for export control purposes.