STSW-IDP4PREDMNT

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Design Win

Predictive maintenance evaluation kit firmware

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Product overview

Description

The kit consists of the STEVAL-IDP004V1 or STEVAL-IDP004V2 IO-Link master, the STEVAL-BFA001V1B sensor node kit and an edge node based on the STM32MP157C-DK2 to form a comprehensive solution for predictive maintenance and condition monitoring applications.

Asynchronous serial communication is implemented to manage data exchange between the sensor node and the edge node, using custom communication protocols specifically suited to the application requirements. Standard protocols such as the IO-Link stack have not been included.

A set of commands have been implemented to enable communication between the gateway and the sensor node and allow the transfer of environmental data and vibration data in the time and frequency domains.

This binary for the master node is compatible with the STEVAL-IDP004V1 and STEVAL-IDP004V2 IO-Link masters.

The IO-Link master and the STEVAL-BFA001V1B sensor boards must be programmed with dedicated binaries that are available for download on www.st.com.

The scenario can be further extended so that the data transmitted from the sensor node via the IO-Link master can be further processed at the edge gateway consisting of an STM32MP157C-DK2 Discovery kit running the X-LINUX-PREDMNT software, which includes the AWS Greengrass service for gathering all the data on the official ST cloud dashboard service.

  • All features

    • Firmware package developed for STM32 microcontroller ARM Cortex-M3
    • Dedicated protocol designed for data exchange with WireST SDK embedded on MP1 gateway
    • Firmware released in binary format manages communication between edge node (STM32MP157C-DK2) to sensor node (STEVAL-BFA001V1B), to enable data transfer to the cloud
    • PC interface based on RS-485 communication

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