Product overview
Description
The STDES-SICGP4 reference design allows evaluating the switching and thermal performance of power SiC MOSFETs in an HiP247-4 (four-lead) package in a half-bridge topology.
The MOSFETs are controlled by isolated gate drivers. Drivers are supplied by isolated DC-DC converters.
The system requires the connection of an external inductor, a source, a load, an auxiliary supply, and PWM signals. It can be used to test operation in buck or boost configuration.
It is possible to use a low inductance shunt or to assemble a coaxial shunt to measure current through the low side MOSFET. In this perspective, the board can be used as a tool for double pulse test (DPT), to measure overshoot (voltage and current), speed (di/dt; dv/dt), and switching energy (EON; EOFF; ERR).
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All features
- Half-bridge structure assembled with power SiC MOSFETs in an HiP247-4 package
- Half-bridge driven by the STGAP2HS galvanic isolated gate driver optimized for SiC MOSFETs
- Isolated gate drivers supplied by an isolated fly-buck converter based on the L6986I
- Preset +18 V/-3 V supply voltage for output stage of isolated gate drivers
- Possibility to set a specific gate voltage, positive and negative level
- Possibility to set the gate resistor
- Low inductance sense resistor
- Prepared for a coaxial shunt resistor for a higher bandwidth of current measurement
- Specifications:
Max. DC input/output voltage: 1 kV Input current level peak (duration up to 100 μs): 69 A
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All resources
| Resource title | Version | Latest update |
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Board Manufacturing Specifications (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.0 | 13 Dec 2022 | 13 Dec 2022 |
Bill of Materials (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 13 Dec 2022 | 13 Dec 2022 |
Schematic Pack (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 13 Dec 2022 | 13 Dec 2022 |
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | WEEE Compliant | Material Declaration** |
|---|---|---|---|---|---|---|
| STDES-SICGP4 | Active | - | Industrial | - | Yes | |
STDES-SICGP4
Package:
-Material Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Supplier | Core Product | Board production status | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| STDES-SICGP4 | | | distributors No availability of distributors reported, please contact our sales office |
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STDES-SICGP4 Active
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors