VD55G0

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Education

Compact and high-sensitivity 0.38 megapixel monochrome global shutter image sensor

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Product overview

Description

The VD55G0 is a global shutter image sensor with high BSI performance which captures up to 210 frames per second in a 644 x 604 resolution format. The pixel construction of this device minimizes crosstalk while enabling a high quantum efficiency (QE) in the near infrared spectrum.

  • All features

    • Global shutter technology, STMicroelectronics proprietary single layer
    • 3D stacked sensor 40 nm/65 nm
    • 2.61 µm x 2.61 µm BSI pixel with full CDTI (capacitive deep trench)
    • High performance with excellent
      • QE (quantum efficiency)
      • MTF (modulation transfer function) up to near IR
      • Perfect PLS (shutter efficiency)
    • Smallest sensor on market with:
      • Compact die size: 2.6 mm x 2.5 mm
      • 640 pixel x 600 pixel resolution
      • Very small pixel array, 1.67 mm x 1.57 mm
      • Optical format between 1/9 inch
    • Operating junction temperature: -30°C to 85°C
    • Single lane transmitter MIPI CSI-2 (copyright© 2005-2010 MIPI Alliance, Inc. Standard for camera serial interface 2 (CSI-2) version 1.0) version 1.3, 1.2 Gbps per lane
    • Fast mode+ I²C control interface
    • Integrated temperature sensor
    • Up to 210 fps (frames per second) at full resolution and 260 fps with VGA resolution
    • Programmable sequences of 4-frame contexts, including frame parameters
    • Automatic dark calibration
    • Dynamic defective correction
    • Embedded auto-exposure
    • 4 multiple function IO, dynamically programmable with frame contexts (GPIO, strobe pulse, pulse-width modulation, V sync)
    • Up to 4 illumination control outputs, synchronized with sensor integration periods and leader or follower external frame start
    • Mirror/flip readout
    • Fully sequenceable with frame contexts
    • Crop
    • Binning (x2 and x4)
    • Analog binning: 320x240 @ 500 fps, 320x252 @ 480 fps, 320x300 @ 414 fps
    • Subsampling (x2 and x4)

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      VD55G0 Camera Module

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      Camera module based on the VD55G0 compact and high-sensitivity 0.38-megapixel monochrome global shutter image sensor

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      VD55G0 Camera Module

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      Camera module based on the VD55G0 compact and high-sensitivity 0.38-megapixel monochrome global shutter image sensor

      VD55G0 PLCC

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      VD55G0 is a global shutter image sensor with high BSI performance which captures up to 210 frames per second in a 644 x 604 resolution format

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      VD55G0 PLCC

      Description:

      VD55G0 is a global shutter image sensor with high BSI performance which captures up to 210 frames per second in a 644 x 604 resolution format

      iND880 CVP

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      Scalable & adaptable platform of Camera Video Processors (CVPs) for automotive, robotics, and industrial applications

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      STSW-IMG501

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      PC evaluation software for all ST BrightSense image sensors

      Imaging software ST
      STSW-IMG501

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      PC evaluation software for all ST BrightSense image sensors

      STSW-IMG505

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      Linux drivers for VD55G0 image sensor and its derivative camera modules

      Imaging software ST
      STSW-IMG505

      Description:

      Linux drivers for VD55G0 image sensor and its derivative camera modules
    • Part number
      Status
      Description
      Type
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      CAM-55G0

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      CAM-55G0 promodules: evaluation camera modules for VD55G0 image sensor

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      CAM-55G0

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      CAM-55G0 promodules: evaluation camera modules for VD55G0 image sensor

      STEVAL-55G0MBI

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      VD55G0 S-Board: Hardware MIPI CSI-2 kit for integrating VD55G0 sensor on embedded processing platforms

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      STEVAL-55G0MBI

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      VD55G0 S-Board: Hardware MIPI CSI-2 kit for integrating VD55G0 sensor on embedded processing platforms

      STEVAL-CAM-M0I

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      P-Board: Hardware MIPI CSI-2 kit for integrating promodules on embedded processing platforms

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      STEVAL-CAM-M0I

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      P-Board: Hardware MIPI CSI-2 kit for integrating promodules on embedded processing platforms

      STEVAL-EVK-U0I

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      EVK Main: Hardware USB kit for evaluating ST BrightSense image sensors on a computer
    • Part number
      Status
      Description
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      Sensor+ISP integration

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      Tuning of image signal processor to be able to interface with and control image sensor and process the RAW image coming from the image sensor.

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      Tuning of image signal processor to be able to interface with and control image sensor and process the RAW image coming from the image sensor.

EDA Symbols, Footprints and 3D Models

STMicroelectronics - VD55G0

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
VD55G0CCA1/RW
Active
DIE Industrial N/A

VD55G0CCA1/RW

Package:

DIE

Material Declaration**:

PDF XML

Marketing Status

Active

Package

DIE

Grade

Industrial

RoHS Compliance Grade

N/A

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

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Budgetary Price (US$)*/Qty
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ECCN (US)
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VD55G0CCA1/RW
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Distributor availability of VD55G0CCA1/RW

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Distributor reported inventory date:

No availability of distributors reported, please contact our sales office
DIE Tape Mounted FRANCE EAR99 NEC -30 85

VD55G0CCA1/RW Active

Budgetary Price (US$)*/Qty:
-
Package:
DIE
Packing Type:
Tape Mounted
RoHS:
Country of Origin:
FRANCE
ECCN (US):
EAR99
ECCN (EU):
NEC

Part Number:

VD55G0CCA1/RW

Operating Temperature (°C)

Min:

-30

Max:

85

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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors