Product overview
Description
The LSM6DSV80X is a breakthrough in the world of wearable technology. Its ability to handle both high and low acceleration values, combined with its energy efficiency and advanced processing capabilities, makes it a sensor for anyone looking to acquire data for in-depth analysis and achieve better performance in high-intensity impact and tracking activities in sports such as volleyball, soccer, tennis, boxing, or explosive jumps, and so forth. This IMU is a comprehensive solution for wearables, high-intensity impact and activity tracking, offering a blend of accuracy, integration, and efficiency.
The LSM6DSV80X is the world's first IMU to combine high-g (80 g) and low-g capabilities in a single package, integrating advanced features (edge processing and sensor fusion) and delivering consistent performance and valuable data for tracking and high-intensity impact detection in sports wearables.
The LSM6DSV80X enables edge AI, leveraging on a finite state machine (FSM) for configurable motion tracking and a machine learning core (MLC) for context awareness with exportable AI features for wearable applications.
The device supports the adaptive self-configuration (ASC) feature, which allows automatically reconfiguring the device in real time based on the detection of a specific motion pattern or based on the output of a specific decision tree configured in the MLC, without any intervention from the host processor.
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All features
- Dedicated and independent gyroscope, low-g and high-g accelerometer channels, and data processing
- Smart FIFO up to 4.5 KB
- Dual accelerometer channels
- Low-g channel ±2/±4/±8/±16 g full scale
- High-g channel ±32/±64/±80 g full scale
- ±250/±500/±1000/±2000/±4000 dps full scale
- SPI / I²C & MIPI I3C® v1.1 serial interface with main processor data synchronization
- Programmable finite state machine for high-g and low-g accelerometer, gyroscope, and external sensor data processing with high rate @ 960 Hz
- Machine learning core with exportable features and filters for AI applications
- Embedded adaptive self-configuration (ASC)
- Embedded sensor fusion low-power (SFLP) algorithm
- Embedded temperature sensor
- Analog supply voltage: 1.71 V to 3.6 V
- Independent I/O supply (extended voltage range: 1.08 V to 3.6 V)
- Supply current
- 6-axis configuration @ 0.67 mA in combo high-performance mode
- 9-axis configuration @ 0.80 mA in combo high-performance mode
- Compact footprint: 2.5 mm x 3 mm x 0.83 mm
- ECOPACK and RoHS compliant
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All tools & software
All resources
| Resource title | Version | Latest update |
|---|
Product Specifications (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 23 Jan 2025 | 23 Jan 2025 |
Technical Notes & Articles (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 21 Jun 2024 | 21 Jun 2024 | ||
| 7.4 | 28 Jan 2025 | 28 Jan 2025 |
Design Notes & Tips (3)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.0 | 24 Jan 2022 | 24 Jan 2022 | ||
| 1.0 | 18 Dec 2024 | 18 Dec 2024 | ||
| 1.1 | 21 Jan 2021 | 21 Jan 2021 |
Presentations (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 20 Feb 2025 | 20 Feb 2025 | ||
| 1.0 | 13 Apr 2023 | 13 Apr 2023 |
Brochures (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.1 | 23 Jun 2020 | 23 Jun 2020 | ||
| 12.21 | 09 Dec 2021 | 09 Dec 2021 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - LSM6DSV80X
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Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| LSM6DSV80XTR | Active | LGA 14L 2.5x3x0.86 mm | Ecopack2 | |
LSM6DSV80XTR
Package:
LGA 14L 2.5x3x0.86 mmMaterial Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||||
| LSM6DSV80XTR | Active | 3.5858 / 1k | distributors No availability of distributors reported, please contact our sales office | LGA 14L 2.5x3x0.86 mm | Tape and Reel | PHILIPPINES | EAR99 | NEC | -40 | 85 | ||||
LSM6DSV80XTR Active
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors