Product overview
Description
The STM32F732xx and STM32F733xx devices are based on the high-performance Arm® Cortex®-M7 32-bit RISC core operating at up to 216 MHz frequency. The Cortex®-M7 core features a single floating point unit (SFPU) precision which supports Arm® single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances the application security.
The STM32F732xx and STM32F733xx devices incorporate high-speed embedded memories with a Flash memory up to 512 Kbytes, 256 Kbytes of SRAM (including 64 Kbytes of data TCM RAM for critical real-time data), 16 Kbytes of instruction TCM RAM (for critical real-time routines), 4 Kbytes of backup SRAM available in the lowest power modes, and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses, a 32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memories access.
All the devices offer three 12-bit ADCs, two DACs, a low-power RTC, thirteen general-purpose 16-bit timers including two PWM timers for motor control, two general-purpose 32-bit timers, a true random number generator (RNG). They also feature standard and advanced communication interfaces.
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All features
- Core: Arm® 32-bit Cortex®-M7 CPU with FPU, adaptive real-time accelerator (ART Accelerator) and L1-cache: 8 Kbytes of data cache and 8 Kbytes of instruction cache, allowing 0-wait state execution from embedded Flash memory and external memories, frequency up to 216 MHz, MPU, 462 DMIPS/2.14 DMIPS/MHz (Dhrystone 2.1) and DSP instructions.
- Memories
- Up to 512 Kbytes of Flash memory with protection mechanisms (read and write protections, proprietary code readout protection (PCROP))
- 528 bytes of OTP memory
- SRAM: 256 Kbytes (including 64 Kbytes of data TCM RAM for critical real-time data) + 16 Kbytes of instruction TCM RAM (for critical real-time routines) + 4 Kbytes of backup SRAM (available in the lowest power modes)
- Flexible external memory controller with up to 32-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND memories
- Dual mode Quad-SPI
- Clock, reset and supply management
- 1.7 V to 3.6 V application supply and I/Os
- POR, PDR, PVD and BOR
- Dedicated USB power
- 4-to-26 MHz crystal oscillator
- Internal 16 MHz factory-trimmed RC (1% accuracy)
- 32 kHz oscillator for RTC with calibration
- Internal 32 kHz RC with calibration
- Low-power
- Sleep, Stop and Standby modes
- VBAT supply for RTC, 32×32 bit backup registers + 4 Kbytes of backup SRAM
- 3×12-bit, 2.4 MSPS ADC: up to 24 channels and 7.2 MSPS in triple interleaved mode
- 2×12-bit D/A converters
- Up to 18 timers: up to thirteen 16-bit (1x low- power 16-bit timer available in Stop mode) and two 32-bit timers, each with up to 4 IC/OC/PWMs or pulse counter and quadrature (incremental) encoder inputs. All 15 timers running up to 216 MHz. 2x watchdogs, SysTick timer
- General-purpose DMA: 16-stream DMA controller with FIFOs and burst support
- Debug mode
- SWD and JTAG interfaces
- Cortex®-M7 Trace Macrocell™
- Up to 140 I/O ports with interrupt capability
- Up to 136 fast I/Os up to 108 MHz
- Up to 138 5 V-tolerant I/Os
- Up to 21 communication interfaces
- Up to 3× I2C interfaces (SMBus/PMBus)
- Up to 4 USARTs/4 UARTs (27 Mbit/s, ISO7816 interface, LIN, IrDA, modem control)
- Up to 5 SPIs (up to 54 Mbit/s), 3 with muxed simplex I2Ss for audio class accuracy via internal audio PLL or external clock
- 2 x SAIs (serial audio interface)
- 1 x CAN (2.0B active)
- 2 x SDMMCs
- Advanced connectivity
- USB 2.0 full-speed device/host/OTG controller with on-chip PHY
- USB 2.0 high-speed/full-speed device/host/OTG controller with dedicated DMA, on-chip full-speed PHY and on-chip Hi-speed PHY or ULPI depending on the part number
- AES: 128/256-bit key encryption hardware accelerator
- True random number generator
- CRC calculation unit
- RTC: subsecond accuracy, hardware calendar
- 96-bit unique ID
Circuit Diagram
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EDA Symbols, Footprints and 3D Models
All resources
Resource title | Version | Latest update |
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System View Description (1)
Resource title | Version | Latest update | ||
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ZIP | 1.0 | 22 Mar 2023 | 22 Mar 2023 |
IBIS models (1)
Resource title | Version | Latest update | ||
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ZIP | 3.0 | 13 Jan 2016 | 13 Jan 2016 |
BSDL files (1)
Resource title | Version | Latest update | ||
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ZIP | 3.2 | 13 Nov 2024 | 13 Nov 2024 |
Quality and Reliability
Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
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STM32F732RET6 | Active | LQFP 64 10x10x1.4 mm | Industrial | Ecopack2 | |
STM32F732RET7 | Proposal | - | Industrial | - | |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | D/A Converters (typ) (12-bit) | Timers (typ) (16-bit) | Timers (typ) (32-bit) | Number of Channels (typ) | SMPS | Number of Channels (typ) | UART (typ) | I/Os (High Current) | Integrated op-amps | Comparator | SPI (typ) | USART (typ) | Number of Channels (typ) | I2S (typ) | Advanced Motor Control Timers | CAN (2.0) | CAN (FD) | Ethernet | ||
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STM32F732RET6 | | | distributors No availability of distributors reported, please contact our sales office |
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STM32F732RET7 | | | distributors No availability of distributors reported, please contact our sales office |
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STM32F732RET6 Active
STM32F732RET7 Proposal
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors