STM32H7B0AB

Active
Design Win Education

High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 128KBytes of Flash memory, 1376 KB SRAM, 280 MHz CPU, L1 cache, graphic accelerations, external memory interfaces, SMPS and large set of peripherals

Download datasheet

Product overview

Description

STM32H7B0xB devices are based on the high-performance Arm® Cortex®-M7 32-bit RISC core operating at up to 280 MHz. The Cortex® -M7 core features a floating point unit (FPU) which supports Arm® double-precision (IEEE 754 compliant) and single-precision data-processing instructions and data types. STM32H7B0xB devices support a full set of DSP instructions and a memory protection unit (MPU) to enhance application security.

STM32H7B0xB devices incorporate high-speed embedded memories with a flash memory of 128 Kbytes, around 1.4 Mbyte of RAM (including 192 Kbytes of TCM RAM, 1.18 Mbytes of user SRAM and 4 Kbytes of backup SRAM), as well as an extensive range of enhanced I/Os and peripherals connected to four APB buses, three AHB buses, a 32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memory access.

All the devices offer two ADCs, two DACs (one dual and one single DAC), two ultra-low power comparators, a low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, three low-power timers, a true random number generator (RNG), and a cryptographic acceleration cell and a HASH processor. The devices support nine digital filters for external sigma delta modulators (DFSDM). They also feature standard and advanced communication interfaces.

  • All features

    • Includes ST state-of-the-art patented technology
    • Core
      • 32-bit Arm® Cortex®-M7 core with double-precision FPU and L1 cache: 16 Kbytes of data and 16 Kbytes of instruction cache allowing to fill one cache line in a single access from the 128-bit embedded flash memory; frequency up to 280 MHz, MPU, 599 DMIPS/ 2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
    • Memories
      • 128 Kbytes of flash memory plus 1 Kbyte of OTP
      • ~1.4 Mbytes of RAM: 192 Kbytes of TCM RAM (inc. 64 Kbytes of ITCM RAM + 128 Kbytes of DTCM RAM for time critical routines), 1.18 Mbytes of user SRAM, and 4 Kbytes of SRAM in Backup domain
      • 2x Octo-SPI memory interfaces with on-the-fly decryption, I/O multiplexing and support for serial PSRAM/NOR, Hyper RAM/flash frame formats, running up to 140 MHz in SRD mode and up to 110 MHz in DTR mode
      • Flexible external memory controller with up to 32-bit data bus:
        • SRAM, PSRAM, NOR flash memory clocked up to 125 MHz in Synchronous mode
        • SDRAM/LPSDR SDRAM,
        • 8/16-bit NAND flash memory
      • CRC calculation unit
    • Security
      • ROP, PC-ROP, active tamper, secure firmware upgrade support, Secure access mode
    • General-purpose input/outputs
      • Up to 138 I/O ports with interrupt capability
        • Fast I/Os capable of up to 133 MHz
        • Up to 164 5 V-tolerant I/Os
    • Low-power consumption
      • Stop: down to 32 µA with full RAM retention
      • Standby: 2.8 µA (Backup SRAM OFF, RTC/LSE ON, PDR OFF)
      • VBAT: 0.8 µA with RTC and LSE ON
    • Clock management
      • Internal oscillators: 64 MHz HSI, 48 MHz RC, 4 MHz CSI, 32 kHz LSI
      • External oscillators: 4-50 MHz HSE, 32.768 kHz LSE
      • 3× PLLs (1 for the system clock, 2 for kernel clocks) with fractional mode
    • Reset and power management
      • 2 separate power domains, which can be independently clock gated to maximize power efficiency:
        • CPU domain (CD) for Arm® Cortex® core and its peripherals , which can be independently switched in Retention mode
        • mart run domain (SRD) for reset and clock control, power management and some peripherals
      • 1.62 to 3.6 V application supply and I/Os
      • POR, PDR, PVD and BOR
      • Dedicated USB power embedding a 3.3 V internal regulator to supply the internal PHYs
      • Dedicated MMC power supply
      • High power efficiency SMPS step-down converter regulator to directly supply VCORE or an external circuitry
      • Embedded regulator (LDO) with configurable scalable output to supply the digital circuitry
      • Voltage scaling in Run and Stop mode
      • Backup regulator (~0.9 V)
      • Low-power modes: Sleep, Stop and Standby
      • VBAT battery operating mode with charging capability
      • CPU and domain power state monitoring pins
    • Interconnect matrix
    • 5 DMA controllers to unload the CPU
      • 1× high-speed general-purpose master direct memory access controller (MDMA)
      • 2× dual-port DMAs with FIFO and request router capabilities
      • 1× basic DMA with request router capabilities
      • 1x basic DMA dedicated to DFSDM
    • Up to 35 communication peripherals
      • 4× I2C FM+ interfaces (SMBus/PMBus)
      • 5× USART/5x UARTs (ISO7816 interface, LIN, IrDA, modem control) and 1x LPUART
      • 6× SPIs, including 4 with muxed full-duplex I2S audio class accuracy via internal audio PLL or external clock and 1 x SPI/I2S in LP domain (up to 125 MHz)
      • 2x SAIs (serial audio interface)
      • SPDIFRX interface
      • SWPMI single-wire protocol master I/F
      • MDIO Slave interface
      • 2× SD/SDIO/MMC interfaces (up to 133 MHz)
      • 2× CAN controllers: 2 with CAN FD, 1 with time-triggered CAN (TT-CAN)
      • 1× USB OTG interfaces (1HS/FS)
      • HDMI-CEC
      • 8- to 14-bit camera interface up to 80 MHz
      • 8-/16-bit parallel synchronous data input/output slave interface (PSSI)
    • 11 analog peripherals
      • 2× ADCs with 16-bit max. resolution (up to 24 channels, up to 3.6 MSPS)
      • 1× analog and 1x digital temperature sensors
      • 1× 12-bit single-channel DAC (in SRD domain) + 1× 12-bit dual-channel DAC
      • 2× ultra-low-power comparators
      • 2× operational amplifiers (8 MHz bandwidth)
      • 2× digital filters for sigma delta modulator (DFSDM), 1x with 8 channels/8 filters and 1x in SRD domain with 2 channels/1 filter
    • Graphics
      • LCD-TFT controller up to XGA resolution
      • Chrom-ART graphical hardware Accelerator (DMA2D) to reduce CPU load
      • Hardware JPEG Codec
      • Chrom-GRC™ (GFXMMU)
    • Up to 19 timers and 2 watchdogs
      • 2× 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input (up to 280 MHz)
      • 2× 16-bit advanced motor control timers (up to 280 MHz)
      • 10× 16-bit general-purpose timers (up to 280 MHz)
      • 3× 16-bit low-power timers (up to 280 MHz)
      • 2× watchdogs (independent and window)
      • 1× SysTick timer
      • RTC with sub-second accuracy and hardware calendar
    • Cryptographic acceleration
      • AES chaining modes: ECB,CBC,CTR,GCM,CCM for 128, 192 or 256
      • HASH (MD5, SHA-1, SHA-2), HMAC
      • 2x OTFDEC AES-128 in CTR mode for Octo-SPI memory encryption/decryption
      • 1x 32-bit, NIST SP 800-90B compliant , true random generator
    • Debug mode
      • SWD & JTAG interfaces
      • 4 Kbytes Embedded Trace Buffer
    • 96-bit unique ID

Circuit Diagram

EDA Symbols, Footprints and 3D Models

STMicroelectronics - STM32H7B0AB

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

Please select one model supplier :

Symbols

Symbols

Footprints

Footprints

3D model

3D models

Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
STM32H7B0ABI6Q
Active
UFBGA 169 7x7x0.6 P 0.5 mm Industrial Ecopack2

STM32H7B0ABI6Q

Package:

UFBGA 169 7x7x0.6 P 0.5 mm

Material Declaration**:

PDF XML

Marketing Status

Active

Package

UFBGA 169 7x7x0.6 P 0.5 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

Swipe or click the button to explore more details Don't show this again
Part Number
Marketing Status
Budgetary Price (US$)*/Qty
Order from ST
Order from distributors
Package
Packing Type
RoHS
Country of Origin
ECCN (US)
ECCN (EU)
Operating temperature (°C)
D/A Converters (typ) (12-bit)
Timers (typ) (16-bit)
Timers (typ) (32-bit)
Number of Channels (typ)
SMPS
Number of Channels (typ)
UART (typ)
I/Os (High Current)
Integrated op-amps
Comparator
SPI (typ)
USART (typ)
Number of Channels (typ)
I2S (typ)
Advanced Motor Control Timers
CAN (2.0)
CAN (FD)
Ethernet
min
max
STM32H7B0ABI6Q
Available at distributors

Distributor availability of STM32H7B0ABI6Q

Distributor Name
Region Stock Min. Order Third party link

Distributor reported inventory date:

No availability of distributors reported, please contact our sales office

STM32H7B0ABI6Q Active

Budgetary Price (US$)*/Qty:
-
Package:
Packing Type:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

Part Number:

STM32H7B0ABI6Q

Operating Temperature (°C)

Min:

Max:

D/A Converters (typ) (12-bit):

-

Timers (typ) (16-bit):

-

Timers (typ) (32-bit):

-

Number of Channels (typ):

-

SMPS:

-

Number of Channels (typ):

-

UART (typ):

-

I/Os (High Current):

121

Integrated op-amps:

-

Comparator:

-

SPI (typ):

-

USART (typ):

-

Number of Channels (typ):

-

I2S (typ):

-

Advanced Motor Control Timers:

-

CAN (2.0):

-

CAN (FD):

-

Ethernet:

-

Distributor Name

Distributor reported inventory date:

Swipe or click the button to explore more details Don't show this again

(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors