Product overview
Description
The Teseo-LIV3R module is an easy to use Global Navigation Satellite System (GNSS) standalone module, embedding Teseo III single die standalone positioning receiver IC working simultaneously on multiple constellations (GPS/Glonass/BeiDou/QZSS).
The Teseo-LIV3R modules bring the proven accuracy and robustness of Teseo chips to the reach of everyone. The certified module with optimized RF, embedded firmware and the complete evaluation environment save development time, while the compactness and cost-effectiveness of this solution make it ideal for many, especially IoT applications, such as insurance, goods tracking, drones, tolling, anti-theft systems, people and pet location, vehicle tracking, emergency calls, fleet management, vehicle sharing, diagnostics and public transportation.
Within its 9.7x10.1 mm tiny size, Teseo-LIV3R is offering superior accuracy thanks to the on board 26 MHz Temperature Compensated Crystal Oscillator (TCXO) and a reduced Time To First Fix (TTFF) relying on its dedicated 32 KHz Real Time Clock (RTC) oscillator.
Teseo-LIV3R also provides server based Real Time Assisted GNSS.
Teseo-LIV3R module, being a certified solution, optimizes the time to market of the final applications with a temperature operating range from -40 °C to 85 °C.
-
All features
- Simultaneous multi-constellation
- -163 dBm tracking sensitivity
- 1.5 m CEP position accuracy
- 2.1 V to 4.3 V supply voltage range
- Tiny LCC 18 pin package (9.7x10.1)
- Operating temperature (-40 °C, 85 °C)
- 17 μW standby current and 70 mW tracking power consumption
You might also like...
Recommended for you
All tools & software
All resources
| Resource title | Version | Latest update |
|---|
Product Specifications (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 3.0 | 22 Sep 2023 | 22 Sep 2023 |
Application Notes (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.1 | 21 Oct 2021 | 21 Oct 2021 |
User Manuals (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 17 Jan 2019 | 17 Jan 2019 | ||
| 6.0 | 16 Dec 2022 | 16 Dec 2022 |
Presentations (3)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 06 May 2020 | 06 May 2020 | ||
| 1.1 | 02 Nov 2021 | 02 Nov 2021 | ||
| 1.0 | 31 Mar 2022 | 31 Mar 2022 |
Flyers (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 20 Jun 2022 | 20 Jun 2022 |
Product Certifications (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 17 Apr 2019 | 17 Apr 2019 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - Teseo-LIV3R
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :
Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| TESEO-LIV3R | Active | RF MODULE | Industrial | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||||
| TESEO-LIV3R | Active | 7.7 / 1k | 5 distributors | RF MODULE | Tape and Reel | SOUTH KOREA | 7A994 | NEC | -40 | 85 | ||||
TESEO-LIV3R Active
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors