Product overview
Description
The Teseo-LIV4F module is an easy-to-use global navigation satellite system (GNSS) standalone low power module, embedding Teseo IV single die GNSS receiver IC working simultaneously on multiple constellations (GPS/Galileo/Glonass/BeiDou/QZSS) able to provide positioning or raw measurement data.
The Teseo-LIV4F module brings the proven accuracy and robustness of Teseo IV multi bands chips to the reach of everyone: the embedded firmware and the complete evaluation environment save development time, while the compactness and cost-effectiveness of this solution make it ideal for several applications, such as insurance, goods tracking, drones, tolling, anti-theft systems, people and pet location, vehicle tracking, emergency calls, fleet management, vehicle sharing, diagnostics and public transportation.
Within its 9.7 x 10.1 mm tiny size, Teseo-LIV4F is offering superior accuracy thanks to the on-board temperature compensated crystal oscillator (TCXO) and a reduced time to first fix (TTFF) relying on its dedicated real time clock (RTC) oscillator.
Teseo-LIV4F also provides the real-time assisted GNSS able to predict satellite data based on previous observation of satellite.
Teseo-LIV4F module is a CE certified.
Teseo-LIV4F optimizes the time to market of the final applications with a temperature operating range from -40 °C to 85 °C.
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All features
- Simultaneous multiconstellation and multi band GNSS (GPS/Galileo/Glonass/BeiDou/QZSS)
- IRNSS constellation ready
- GNSS raw measurement data
- -162 dBm tracking sensitivity
- Submeter positioning accuracy
- Embedded flash
- Firmware upgrade
- Free firmware configuration
- VCC/VBAT supply voltage range: 3.0 V to 3.63 V
- Tiny LCC-18 pin package (9.7 x 10.1 mm)
- Operating temperature (-40 °C ÷ 85 °C)
- 10 μA standby current consumption and 48.8 mA GNSS L1&L5 tracking current consumption
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All tools & software
All resources
| Resource title | Version | Latest update |
|---|
Product Specifications (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 6.0 | 11 Jun 2024 | 11 Jun 2024 |
Application Notes (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 26 Jun 2024 | 26 Jun 2024 | ||
| 2.1 | 21 Oct 2021 | 21 Oct 2021 |
User Manuals (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.0 | 21 Dec 2023 | 21 Dec 2023 | ||
| 3.0 | 29 Nov 2023 | 29 Nov 2023 |
Product Certifications (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 23 Aug 2022 | 23 Aug 2022 | ||
| 1.0 | 23 Aug 2022 | 23 Aug 2022 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - Teseo-LIV4F
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Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| TESEO-LIV4FTR | Active | 18LD LGA 9.7X10.1X2.55MM PITCH | Industrial | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||||
| TESEO-LIV4FTR | | | 4 distributors | |||||||||||
TESEO-LIV4FTR Active
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors