A1F25M12W2-F1

NRND
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ACEPACK 1 power module, fourpack topology, 1200 V, 25 mOhm typ. SiC MOSFET gen.2 with NTC

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Product overview

Description

This power module features a fourpack topology in an ACEPACK 1 module with NTC and integrates the most advanced silicon carbide MOSFETs of STMicroelectronics which are represented by the gen.2 technology. This modular solution can be used to realize complex topologies characterized by very high power density in order to meet the higest efficiency requirements.

  • All features

    • ACEPACK 1 power module:
      • DBC Cu-Al2O3-Cu based
      • Insulation voltage UL certified of 2.5 kVrms
      • Press-fit contact pins
    • Fourpack topology:
      • 1200 V SiC MOSFET
      • RDS(on) typical 25 mΩ
      • Very high-power density
      • Very low switching energies
      • Switching characteristic almost independent from temperature
    • Integrated NTC temperature sensor
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eDesignSuite

eDesignSuite is a comprehensive set of easy-to-use design-aid utilities ready to help you streamline the system development process with a wide range of ST products.

Power Management Design Center

Thermal-electrical Simulators for Components

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Power Management Design Center

Power Supply Design Tool

• SMPS design, by topology, by type and by product
• PFC design with analog and digitial control
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DC/DC
AC/DC
Solar Battery Charger
Power Management Design Center

LED Lighting Design Tool

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• Displays interactive and annotated schematic
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DC/DC
AC/DC
Power Management Design Center

Digital Power Workbench

• Provides a step-by-step optimized design of power section and control loop
• Generates the STM32Cube embedded software package for custom applications and allows firmware project generation, compatible with multiple STM32 IDEs
Power Management Design Center

Power Tree Designer

• Specify input/output power for each node in the tree
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Rectifier Diodes Simulator

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Thermal-electrical Simulators for Components

STPOWER Studio

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Thermal-electrical Simulators for Components

Twister Sim

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Thermal-electrical Simulators for Components

TVS Simulator

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Thermal-electrical Simulators for Components

Estimate

• Build simple schematics and firmware inputs in minutes
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Signal Conditioning Design Tool

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Signal Conditioning Design Tool

High side Current Sensing

• Provides current error graphs.
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NFC Tuning Circuit

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EDA Symbols, Footprints and 3D Models

STMicroelectronics - A1F25M12W2-F1

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
A1F25M12W2-F1
NRND
ACEPACK 1 Industrial Ecopack1

A1F25M12W2-F1

Package:

ACEPACK 1

Material Declaration**:

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More Info

Marketing Status

NRND

Package

ACEPACK 1

Grade

Industrial

RoHS Compliance Grade

Ecopack1

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors

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