Product overview
Description
This ACEPACK 2 power module represents a leg of a T-type 3-level inverter topology that integrates the advanced silicon carbide Power MOSFET technology from STMicroelectronics. This module leverages the innovative properties of the wide-bandgap SiC material and a high-thermal-performance substrate. The result is exceptionally low on-resistance per unit area and excellent switching performance that is virtually independent of temperature. An NTC sensor completes the design.
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All features
- 3-level topology
- ACEPACK 2 power module
- 13 mΩ of typical RDS(on) each switch
- Insulation voltage UL certified of 2.5 kVrms
- Integrated NTC temperature sensor
- DBC Cu-Al2O3-Cu based
- Press fit contact pins
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Quality and Reliability
Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
---|---|---|---|---|---|
A2U12M12W2-F2 | Active | ACEPACK 2 | Industrial | Ecopack1 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
A2U12M12W2-F2 | | | distributors No availability of distributors reported, please contact our sales office |
A2U12M12W2-F2 Active
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors