STGIPN3H60

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SLLIMM nano small low-loss intelligent molded module IPM, 3 A, 600 V, 3-phase IGBT inverter bridge

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Product overview

Description

This intelligent power module implements a compact, high performance AC motor drive in a simple, rugged design. It is composed of six IGBTs with freewheeling diodes and three half-bridge HVICs for gate driving, providing low electromagnetic interference (EMI) characteristics with optimized switching speed. The package is optimized for thermal performance and compactness in built-in motor applications, or other low power applications where assembly space is limited. This IPM includes an operational amplifier, completely uncommitted, and a comparator that can be used to design a fast and efficient protection circuit. SLLIMM™ is a trademark of STMicroelectronics.

  • All features

    • IPM 3 A, 600 V, 3-phase IGBT inverter bridge including control ICs for gate driving and freewheeling diodes
    • Optimized for low electromagnetic interferences
    • VCE(sat) negative temperature coefficient
    • 3.3 V, 5 V, 15 V CMOS/TTL input comparators with hysteresis and pull-down/pull-up resistors
    • Undervoltage lockout
    • Internal bootstrap diode
    • Interlocking function
    • Shutdown function
    • Comparator for fault protection against overtemperature and overcurrent
    • Op-amp for advanced current sensing
    • Optimized pinout for easy board layout

eDesignSuite

eDesignSuite is a comprehensive set of easy-to-use design-aid utilities ready to help you streamline the system development process with a wide range of ST products.

Power Management Design Center

Thermal-electrical Simulators for Components

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NFC/RFID Calculators

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Power Management Design Center

Power Supply Design Tool

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PFC design with analog and digitial control
Supports various PCB configurations
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Solar Battery Charger
Power Management Design Center

LED Lighting Design Tool

Handles AC-DC and DC-DC design in common topologies
Displays interactive and annotated schematic
Provides current/voltage graphs, Bode plots, efficiency curves and power-loss data
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Power Management Design Center

Digital Power Workbench

Provides a step-by-step optimized design of power section and control loop
Generates the STM32Cube embedded software package for custom applications and allows firmware project generation, compatible with multiple STM32 IDEs
Power Management Design Center

Power Tree Designer

Specify input/output power for each node in the tree
Check for consistency
Design each individual node
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AC Switches Simulator

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Rectifier Diodes Simulator

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Estimate power losses
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STPOWER Studio

Supports long mission profiles
Provides power loss and temperature graphs
Helps define heatsink thermal properties
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Twister Sim

Help select the right ViPOWER Automotive power device
Supports load-compatibility, wiring harness optimization, fault condition impact and diagnostic analysis
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TVS Simulator

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Thermal-electrical Simulators for Components

Estimate

Build simple schematics and firmware inputs in minutes
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Signal Conditioning Design Tool

Active Filters

Handles multi-stage-designs and common topologies
Returns circuit component values
Provides gain, phase and group delay graphs
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Signal Conditioning Design Tool

Comparators

Handles most common configurations
Returns circuit components values
Provides I/O signal waveforms
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Signal Conditioning Design Tool

Low side Current Sensing

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Provides current error graphs
Signal Conditioning Design Tool

High side Current Sensing

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The tool returns link budget estimate
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NFC Tuning Circuit

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Select the topology of the matching network
The tool returns component values for the desired design targets

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STMicroelectronics - STGIPN3H60

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
STGIPN3H60
Active
NDIP-26L Industrial Ecopack2

STGIPN3H60

Package:

NDIP-26L

Material Declaration**:

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Marketing Status

Active

Package

NDIP-26L

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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