STGIPQ5C60T-HLS

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SLLIMM nano 2nd series IPM, 3-phase inverter, 5 A, 600 V, short-circuit rugged IGBT

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Product overview

Description

This second series of SLLIMM (small low-loss intelligent molded module) nano provides a compact, high-performance AC motor drive in a simple, rugged design. It is composed of six improved short-circuit rugged trench gate fieldstop IGBTs with freewheeling diodes and three half-bridge HVICs for gate driving, providing low electromagnetic interference (EMI) characteristics with optimized switching speed. The package is designed to allow a better and more easily screwed-on heat sink, and is optimized for thermal performance and compactness in built-in motor applications or other low power applications where assembly space is limited. This IPM includes a completely uncommitted operational amplifier and a comparator that can be used to design a fast and efficient protection circuit.

  • All features

    • IPM 5 A, 600 V, 3-phase IGBT inverter bridge including 3 control ICs for gate driving and freewheeling diodes
    • 3.3 V, 5 V, 15 V TTL/CMOS input comparators with hysteresis and pull-down/pull-up resistors
    • Internal bootstrap diode
    • Optimized for low electromagnetic interference
    • Undervoltage lockout
    • Short-circuit rugged TFS IGBTs
    • Shutdown function
    • Interlocking function
    • Op-amp for advanced current sensing
    • Comparator for fault protection against overcurrent
    • NTC (UL 1434 CA 2 and 4)
    • Up to ±2 kV ESD protection (HBM C = 100 pF, R = 1.5 kΩ)
    • Isolation ratings of 1800 Vrms/min.
    • UL recognition: UL 1557, file E81734

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
STGIPQ5C60T-HLS
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N2DIP-26L Industrial Ecopack2

STGIPQ5C60T-HLS

Package:

N2DIP-26L

Material Declaration**:

Marketing Status

Active

Package

N2DIP-26L

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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