Product overview
Description
This silicon carbide Power MOSFET device has been developed using ST’s advanced and innovative 3rd generation SiC MOSFET technology. The device features a very low RDS(on) over the entire temperature range combined with low capacitances and very high switching operations, which improve application performance in frequency, energy efficiency, system size and weight reduction.
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All features
- AEC-Q101 qualified
- Very low RDS(on) over the entire temperature range
- High speed switching performances
- Very fast and robust intrinsic body diode
- Source sensing pin for increased efficiency
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All tools & software
All resources
Resource title | Version | Latest update |
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Product Specifications (1)
Resource title | Version | Latest update | ||
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1.0 | 02 Mar 2023 | 02 Mar 2023 |
Application Notes (3)
Resource title | Version | Latest update | ||
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1.1 | 13 Dec 2022 | 13 Dec 2022 | ||
1.0 | 15 Jul 2019 | 15 Jul 2019 | ||
1.4 | 13 Sep 2018 | 13 Sep 2018 |
Technical Notes & Articles (4)
Resource title | Version | Latest update | ||
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2.2 | 06 Jul 2021 | 06 Jul 2021 | ||
1.0 | 19 Nov 2021 | 19 Nov 2021 | ||
2.4 | 11 Jul 2023 | 11 Jul 2023 | ||
2.0 | 23 Nov 2023 | 23 Nov 2023 |
User Manuals (1)
Resource title | Version | Latest update | ||
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1.3 | 21 Oct 2016 | 21 Oct 2016 |
Flyers (5 of 9)
Resource title | Version | Latest update | ||
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1.0 | 18 Nov 2020 | 18 Nov 2020 | ||
1.0 | 08 May 2020 | 08 May 2020 | ||
1.0 | 21 Mar 2023 | 21 Mar 2023 | ||
1.0 | 16 May 2024 | 16 May 2024 | ||
1.0 | 21 May 2024 | 21 May 2024 | ||
1.0 | 01 Feb 2021 | 01 Feb 2021 | ||
1.0 | 15 Oct 2020 | 15 Oct 2020 | ||
1.0 | 15 May 2020 | 15 May 2020 | ||
3.0 | 01 Aug 2015 | 01 Aug 2015 |
Conference Papers (5 of 8)
Resource title | Version | Latest update | ||
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1.0 | 23 Jul 2018 | 23 Jul 2018 | ||
1.0 | 29 Apr 2021 | 29 Apr 2021 | ||
1.0 | 01 Aug 2015 | 01 Aug 2015 | ||
1.0 | 25 Jul 2018 | 25 Jul 2018 | ||
1.0 | 25 Jul 2018 | 25 Jul 2018 | ||
1.0 | 23 Jul 2018 | 23 Jul 2018 | ||
1.0 | 23 Jul 2018 | 23 Jul 2018 | ||
1.0 | 23 Aug 2021 | 23 Aug 2021 |
EDA Symbols, Footprints and 3D Models
All resources
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SPICE models (1)
Resource title | Version | Latest update | ||
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ZIP | 1.0 | 19 May 2023 | 19 May 2023 |
Quality and Reliability
Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
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SCT060HU75G3AG | Active | HU3PAK | Automotive | Ecopack1 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | |
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SCT060HU75G3AG | | | distributors No availability of distributors reported, please contact our sales office |
SCT060HU75G3AG Active
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors