Product overview
Description
The ACEPACK SMIT is a very compact surface mounted SiC MOSFET module. Thanks to the DBC substrate, the ACEPACK SMIT package provides reliable insulation, a low thermal resistance and high flexibility, enabling several configurations.
The SiC MOSFETs inside provide outstanding features, like very low on-resistance, fast switching, reduced parasitic, and robust body diode. The half-bridge association can be used to build several topologies: totem pole PFC, full, and B6 bridges.
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All features
- AQG 324 qualified
- Half-bridge topology SiC MOSFET module
- 1200 V rated voltage
- Dice on direct bond copper (DBC) substrate
- SMD with insulated top side cooling
- Isolation voltage of 3.4 kVrms
- Low thermal resistance
- Package molding compound group I (CTI ≥ 600 V, 1000 Vrms in pollution degree 2)
EDA Symbols, Footprints and 3D Models
STMicroelectronics - SH70M12W3AG
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3D models
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| SH70M12W3AG | Active | ACEPACK SMIT | Automotive | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SH70M12W3AG | | | distributors No availability of distributors reported, please contact our sales office |
SH70M12W3AG Active
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors