Product overview
Description
The STeID Java is a complete solution targeting the Identity and eGovernment markets, and possibly other projects requiring a high-end Java Card OS platform on a smartcard IC. It is developed on the secure microcontroller ST31N600 and includes:
- STeID JC Open OS, which is based on an open Java multi-application platform,
- and a set of Java applets dedicated to the ID market.
The STeID Java is enabled with Java Card technology allowing multiple applications to run on a single card and provides features for secure interoperability of applications. It also provides a secure framework for the execution of the Java Card programs and data access management (via firewall).
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All features
- Operating system
- Open Java Card™ operating system
- Java Card™ 3.0.5
- Global platform 2.3.1
- Cryptographic support (DES, AES, RSA, EC)
- Biometric Java Card™ API
- Post-issuance
- Match-on-card support
- Certified CC EAL 6+ (ongoing)
- Java Card applets
- eMRTD applet supporting
- Basic Access Control (BAC)
- Extended Access Control (EAC)
- Password Authenticated Connection Establishment (PACE)
- ePKI applet with Key generation and Key import
- All applets to be CC certified
- Key hardware features
- Dual Core 32-bit ARM® SecurCore® SC000™
- RSA, EC, AES, and DES coprocessors
- AIS-31 class PTG.2 compliant true random number generator (TRNG)
- ISO 7816 and ISO 14443 with best-in-class RF performance
- Data retention >25 years
- Endurance (erase/write cycling) >500 K cycles
- Certified CC EAL 6+
- Operating system
EDA Symbols, Footprints and 3D Models
STMicroelectronics - STeID-Java
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :
Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| STEID-JAVA | Active | DICE | Industrial | N/A | |
STEID-JAVA
Package:
DICEMaterial Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| STEID-JAVA | | | distributors No availability of distributors reported, please contact our sales office |
STEID-JAVA Active
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors