STPay-Topaz-2

Active

ST Payment Secure and Flexible Solution-Java Card ® platform

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Product overview

Description

The STPay-Topaz-2 is a GlobalPlatform® 2.3.1 Java® Card platform for payment and loyalty applications, based on the 34 nm flash technology with up to 110 Kbytes of user non-volatile memory.

The STPay-Topaz-2 can be configured to support various applications, including VISA® 2.8.1g1 or VSDC 2.9.2, MasterCard® M/Chip® Advance 1.2.3 and Discover® D-PAS Connect 2.1. Additionally, it supports Interac® Flash 1.7, AMEX® AEIPS4.5, JCB® D.1.2, RuPay® qSPARC 2.0.2 and BANCOMAT® 1.7 EMV® payment applications. The product is also targeting to support VISA® 3.0, MasterCard® Ecos 2.2 payment applications which are compliant with latest EMVCo kernel C-8 specifications.

The STPay-Topaz-2 seamlessly builds upon the renowned previous generation Topaz-1, allowing card manufacturers and personalization bureaus to leverage and enhance their personalization flow established and validated with the first generation. Moreover, STPay-Topaz-2 extends the card configuration capability allowing the customer to quickly set the card according to their markets. Such flexibility is available up until the card is branded, personalized and issued to the bank. This is possible thanks to:

- Up to six different payment applets that can already be preloaded in the product

- The capability of embedding any brand new applet or to update an existing one based on the needs.

While being able to meet issuing banks demands is a key success factor, being also able to accommodate various card body, module and antenna technologies on its production line is a real challenge. As a response, STPay-Topaz-2 provides the possibility to tune the RF characteristics to ensure best RF performance of the card.

The STPay-Topaz-2 is also available as a Java virtual machine (JVM) platform, providing 190 Kbytes of non‑volatile memory for customer applets.

The STPay system-on-chip solution is a product family that comes ready to embed in the smartcards and loaded with payment applications that run on certified Java® Card platforms. They meet all required security and payment-scheme certifications.

For detailed configuration data, contact your local ST sales office.

  • All features

      • 34 nm flash technology
      • Java® Card platform
      • Up to 110 Kbytes of user NVM
      • Large offer of certified payment applications including: VISA®, MasterCard®, Interac®, Discover®, AMEX®, JCB®, RuPay® and BANCOMAT® (certifications expected mid 2025).
      • Applet selection features for superior stock management, card personalization and issuance flexibility.
    • Platform
      • Java® Card 3.0.5 classic operating system
      • GlobalPlatform® 2.3.1 with Common Implementation Configuration version 1.0
      • EMVCo open platform (certification expected mid 2025)
      • Supports SCP02 and SCP03 secure channel
      • CPS-compliant V1.1
      • ISO/IEC 7816 T = 0 or T = 1 contact protocol
      • ISO/IEC 14443 Type A contactless interface
      • Support of secondary security domain
    • Hardware
      • ST31R480 product based on a 32-bit Arm® SecurCore® SC000TM RISC core
      • Advanced 34 nm flash technology
      • Best-in-class RF performance
    • Cryptography
      • NESCRYPT cryptographic RSA and ECC coprocessor
      • Advanced Encryption System (AES)
    • Personalization
      • RF tuning capability to match various module and antenna technologies
      • Enhanced mode for very fast card personalization
      • EMV® CPS v2 compliant
      • VISA® smart debit/credit (VSDC) Personalization Specification v2.0
      • M/Chip® Advance 1.2.3 Common Personalization Specification

The current status of a product:
Active: Product is in volume production
Evaluation: Product is under characterization. Limited Engineering samples available
Preview: Product is in design stage
Target: Product is in design feasibility stage.No commitment taken to produce
Proposal: Marketing proposal for customer feedback.No commitment taken to design or produce
NRND: Not Recommended for New Design.Product is in volume production only to support customers ongoing production.
Marketing description of the package type.Compliancy of the device with industry requirement domains (IRD)The RoHS status of a product:
ECOPACK 1: Initial grade to identify European RoHS compliant products.
ECOPACK 2: New grade to identify brominated chlorinated and antimony oxide flame retardant free products.
ECOPACK 3: Halogen free RoHS exemptions free products.
(*): ECOPACK 2 version available upon request.
(**): Some versions still existing in ECOPACK 1 or not compliant.
The current status of a product:
Active: Product is in volume production
Evaluation: Product is under characterization. Limited Engineering samples available
Preview: Product is in design stage
Target: Product is in design feasibility stage.No commitment taken to produce
Proposal: Marketing proposal for customer feedback.No commitment taken to design or produce
NRND: Not Recommended for New Design.Product is in volume production only to support customers ongoing production.
Budgetary PriceMarketing description of the package type.Storage method used to contain product.Main country of assembly or fabrication of the product.ECCNs are five character alpha-numeric designations used on the Commerce Control List to identify dual-use items for export control purposes. ECCNs are five character alpha-numeric designations used on the Commerce Control List to identify dual-use items for export control purposes.The value as specified by level (minTypMax) of the ambient temperature (in Cel) in which this item was designed to operate.The value as specified by level (minTypMax) of the ambient temperature (in Cel) in which this item was designed to operate.