Product overview
Description
The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 GHz.
This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.
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All features
- Very low profile
- High RF performance
- PCB space saving
- Efficient manufacturability
- LGA footprint compatible
- Low thickness ≤ 450 µm
EDA Symbols, Footprints and 3D Models
All resources
Resource title | Version | Latest update |
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CAD Symbol & Footprint models (2)
Resource title | Version | Latest update | ||
---|---|---|---|---|
ZIP | 1.0 | 30 Aug 2021 | 30 Aug 2021 | |
ZIP | 1.0 | 30 Aug 2021 | 30 Aug 2021 |
Quality and Reliability
Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
---|---|---|---|---|---|
BAL-UWB-01E3 | Active | FLIP CHIP BUMPLESS CSPG | Industrial | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | Minimum Sellable Quantity | ||
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min | max | ||||||||||||||
BAL-UWB-01E3 | | | distributors No availability of distributors reported, please contact our sales office |
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BAL-UWB-01E3 Active
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors