Product overview
Description
The BALF-ATM-01E3 from STMicroelectronics is an integrated balun, which also integrates a matching network in a monolithic glass substrate. Matching impedance has been customized for the ATMEL chip. The device uses STMicroelectronics’ IPD technology on a non-conductive glass substrate to optimize RF performance.
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All features
- 2.4 – 2.5 GHz balun with integrated matching network
- Matching optimized for following chipsets: ATSAMR21E18
- Low insertion loss
- Low amplitude imbalance
- Low phase imbalance
- Coated CSP on glass bumpless
- Small footprint 2.5 mm²
EDA Symbols, Footprints and 3D Models
All resources
Resource title | Version | Latest update |
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CAD Symbol & Footprint models (2)
Resource title | Version | Latest update | ||
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ZIP | 1.0 | 30 Aug 2021 | 30 Aug 2021 | |
ZIP | 1.0 | 30 Aug 2021 | 30 Aug 2021 |
Quality and Reliability
Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
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BALF-ATM-01E3 | Active | FLIP CHIP BUMPLESS CSPG | Industrial | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | Minimum Sellable Quantity | ||
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min | max | ||||||||||||||
BALF-ATM-01E3 | | | distributors No availability of distributors reported, please contact our sales office |
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BALF-ATM-01E3 Active
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors