BALF-CC25-02D3

NRND
Design Win

50Ω / conjugate match to CC2541

Download datasheet

Product overview

Description

STMicroelectronics BAL-CC25-02D3 is an ultra miniature balun which integrates a matching network in a monolithic glass substrate. This has been customized for the CC2541 RF transceivers.

It’s a design using STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate to optimize RF performance.

  • All features

    • 2.45 GHz balun with integrated matching network
    • Matching optimized for following CC2541
    • Low insertion loss
    • Low amplitude imbalance
    • Low phase imbalance
    • Coated Flip-Chip on glass
    • Small footprint: < 0.88 mm²
    • Benefits
      • Very low profile
      • High RF performance
      • PCB space saving versus discrete solution
      • BOM count reduction
      • Efficient manufacturability

EDA Symbols, Footprints and 3D Models

STMicroelectronics - BALF-CC25-02D3

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
BALF-CC25-02D3
NRND
Chip Scale Package 0.4mm pitch Industrial Ecopack2

BALF-CC25-02D3

Package:

Chip Scale Package 0.4mm pitch

Material Declaration**:

PDF XML

Marketing Status

NRND

Package

Chip Scale Package 0.4mm pitch

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

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BALF-CC25-02D3
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BALF-CC25-02D3 NRND

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BALF-CC25-02D3

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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors