Product overview
Description
STMicroelectronics BALF-NRF01E3 is an ultraminiature balun. The BALF-NRF01E3 integrates matching network in a monolithic glass substrate. Matching impedance has been customized for the nRF51822-QFAA/AB/AC and nRF51422-QFAA/AB/AC RF transceivers.
It uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance.
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All features
- Low insertion loss
- Low amplitude imbalance
- Low phase imbalance
- Coated CSP on glass
- Small footprint: < 1.5 mm2
- Benefits
- Very low profile
- High RF performance
- PCB space saving versus discrete solution
- BOM count reduction
- Efficient manufacturability
All resources
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Product Specifications (1)
Resource title | Version | Latest update | ||
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3.0 | 26 Jan 2016 | 26 Jan 2016 |
Presentations (2)
Resource title | Version | Latest update | ||
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1.0 | 24 Jan 2023 | 24 Jan 2023 | ||
2.0 | 05 May 2023 | 05 May 2023 |
Flyers (2)
Resource title | Version | Latest update | ||
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1.0 | 26 Jan 2023 | 26 Jan 2023 | ||
1.0 | 24 Jan 2023 | 24 Jan 2023 |
Brochures (2)
Resource title | Version | Latest update | ||
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12.24 | 17 Dec 2024 | 17 Dec 2024 | ||
1.0 | 01 Aug 2015 | 01 Aug 2015 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - BALF-NRF01E3
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3D models
All resources
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CAD Symbol & Footprint models (2)
Resource title | Version | Latest update | ||
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ZIP | 1.0 | 07 Jun 2021 | 07 Jun 2021 | |
ZIP | 1.2 | 18 Mar 2020 | 18 Mar 2020 |
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Quality and Reliability
Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
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BALF-NRF01E3 | Active | FLIP CHIP BUMPLESS CSPG | Industrial | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | Minimum Sellable Quantity | |||||||||||||||||||||
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BALF-NRF01E3 | Active | 0.151 / 100 | Available at 2 distributors Distributor availability of BALF-NRF01E3
Distributor reported inventory date: 4/2/2025 | | | | Buy from Distributor | | FLIP CHIP BUMPLESS CSPG | Tape and Reel | FRANCE | EAR99 | NEC | 5000 |
BALF-NRF01E3 Active
Part Number:
BALF-NRF01E3
Minimum Sellable Quantity:
5000
DIGIKEY
Stock
51101Min.Order
1YOSUN
Stock
100Min.Order
1Distributor reported inventory date: 4/2/2025
Stock
Min.Order
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors