22 Jun 2017 | Amsterdam

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STMicroelectronics announces ⁽ⁱ⁾ a US$1.5 billion dual-tranche offering of New Convertible Bonds, ⁽ⁱⁱ⁾ the early redemption of its 2019 Convertible Bonds and ⁽ⁱⁱⁱ⁾ the launch of a share buy-back programme

Not for publication or distribution directly or indirectly, in whole or in part, in or into the United States, Australia, Canada, Japan or South Africa or in any other jurisdiction in which offers or sales would be prohibited by applicable law.

This announcement is not an offer to sell or a solicitation to buy securities in any jurisdiction, including the United States, Australia, Canada, Japan or South Africa. Neither this announcement nor anything contained herein shall form the basis of, or be relied upon in connection with, any offer or commitment whatsoever in any jurisdiction.

STMicroelectronics N.V. (the “Company” or “STMicroelectronics”) announces today the launch of a US$1.5 billion offering of senior unsecured bonds convertible into new or existing ordinary shares of STMicroelectronics (the “Shares”) (the “New Convertible Bonds”), the early redemption of the outstanding US$600 million Zero Coupon Convertible Bonds due 2019 (ISIN: XS1083956307, the “2019 Convertible Bonds”) and the launch of a share buy-back programme intended to meet obligations arising from debt financial instruments that are exchangeable into equity instruments and to meet obligations arising from share award programmes.

The press release is available as a PDF here.