Product overview
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All features
- AEC-Q100 qualified
- High performance e200z420
- 32-bit Power Architecture technology CPU
- Core frequency as high as 120 MHz
- Variable Length Encoding (VLE)
- 2112 KB (2048 KB code flash + 64 KB data flash) on-chip flash memory: supports read during program and erase operations, and multiple blocks allowing EEPROM emulation
- 176 KB HSM dedicated flash memory (144 KB code + 32 KB data)
- 128 KB on-chip general-purpose SRAM (in addition to 64 KB core local data RAM
- Crossbar switch architecture for concurrent access to peripherals, Flash, or RAM from multiple bus masters with end-to-end ECC
- Multi-channel direct memory access controller (eDMA) with 64 channels
- 1 interrupt controller (INTC)
- Comprehensive new generation ASIL-B safety concept
- ASIL-B of ISO 26262
- FCCU for collection and reaction to failure notifications
- Memory Error Management Unit (MEMU) for collection and reporting of error events in memories
- Cyclic redundancy check (CRC) unit
- Enhanced low power support
- Ultra low power STANDBY
- Smart Wake-up Unit
- Fast wake-up and execute from RAM
- Enhanced modular IO subsystem (eMIOS): up to 64 timed I/O channels with 16-bit counter resolution
- Body cross triggering unit (BCTU)
- Triggers ADC conversions from any eMIOS channel
- Triggers ADC conversions from up to 2 dedicated PIT_RTIs
- Enhanced analog-to-digital converter system with:
- 2 independent fast 12-bit SAR analog converters
- 1 supervisor 12-bit SAR analog converter
- 1 10-bit SAR analog converter with STDBY mode support
- Communication interfaces
- 1 Ethernet controller 10/100 Mbps, compliant IEEE 802.3-2008
- 8 MCAN interfaces with advanced shared memory scheme and ISO CAN-FD support
- 14 LINFlexD modules
- 7 Deserial Serial Peripheral Interface (DSPI) modules
- Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for computational shell
- Nexus Development Interface (NDI) per IEEE-ISTO 5001-2003 standard, with some support for 2010 standard
- Boot Assist Flash (BAF) supports factory programming using a serial bootload through the asynchronous CAN or LIN/UART
- Junction temperature range -40 °C to 150 °C
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STMicroelectronics - SPC584B60E1
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Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| SPC584B60E1EG00X | Active | TQFP 64 10x10x1.0 | Automotive Safety | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | CPU Clock Frequency (MHz) (max) | Features set | Flash Size (kB) (Data) | ||
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| min | max | ||||||||||||||||
| SPC584B60E1EG00X | | | distributors No availability of distributors reported, please contact our sales office |
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SPC584B60E1EG00X Active
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors