SR6G7C6

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Stellar SR6 G7 line, 32-bit Arm® Cortex®-R52+ automotive integration MCU 6x Cortex®-R52+ cores, 20.5 MB NVM (2x 19.5 MB "OTA X2") 8.9 MB RAM, with embedded virtualization, safety and security

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Overview

Product overview

Description

Stellar integration MCUs have been designed to meet the requirements of domain controllers and ECUs with high integration requested in the architectures of connected updatable automated and electrified cars. They have superior real-time and safe performance (with highest ASIL-D capability). Bringing hardware-based virtualization technology to MCUs, they ease the development and integration of multiple source software onto the same hardware while maximizing the resulting software performance. They offer high-efficiency OTA reprogramming capability with fast new image download and activation at almost no memory overhead thanks to SR6 unique built-in dual-image storage tailored to OTA reprogramming needs. They also provide high-speed security cryptographic services, for instance for network authentication.

  • All features

    • AEC-Q100
    • SR6 integration MCUs:
      • Have superior real-time and safe performance (with highest ASIL-D capability)
      • Bring hardware-based virtualization technology to MCUs for simplified multiple software integrations at optimized performance
      • Have built-in fast and cost-effective OTA reprogramming capability (with built-in dual-image storage)
      • Offer high-speed security cryptographic services, for example for network authentication
    • Cores
      • 6 × 32-bit Cortex®‑R52+ cores (4 of them with checker cores, and 2 in split-lock configuration):
        • Configurable as either 6 cores (4 of them in lockstep configuration) or 5 cores (all of them in lockstep configuration)
        • Arm® v8-R compliant
        • Single precision floating-point unit (FPU)
        • New privilege level for real-time virtualization
        • 2 cores with Neon™ extensions (for example SIMD, dual precision FPU)
      • 2 Cortex®‑M4 multipurpose accelerators, both in lockstep configuration
      • 4 eDMA engines in lockstep configuration
    • Memories
      • Up to 20.5 MB on-chip nonvolatile memory (NVM):
        • PCM (phase-change memory) as nonvolatile memory
        • 19.5 MB code NVM, with embedded memory replication for OTA (over-the-air) reprogramming with up to 2× 19.5 MB
        • 1024 KB HSM-dedicated code NVM
      • 640 KB data NVM (512 KB + 128 KB dedicated to HSM)
      • Up to 9280 KB on-chip general-purpose SRAM
    • Security: 2nd generation hardware security module
      • Cybersecurity: ISO/SAE 21434 compliance (refer to the cybersecurity reference manual for details)
      • On-chip high-performance security module with full support for e-safety vehicle intrusion protected applications (EVITA)
      • Symmetric and asymmetric cryptography processor
      • High-performance lock-stepped AES-light security subsystem for fast ASIL-D cryptographic services
    • Safety: comprehensive new-generation ASIL-D safety concept
      • New state-of-the-art safety measures at all levels of the architecture for most efficient implementation of ISO 26262 ASIL-D functionalities
      • Complete hardware virtualization architecture built on Cortex®‑R52+ new privilege mode (best-in-class software isolation, real-time support for multiple virtual machines/applications)
    • Device standby/low-power modes
      • Versatile low-power modes
      • Ultra-low power: standby mode for lowest quiescent current with optimized active subsystem (for example standby RAM) and wake-up capability
      • Smart low-power: smart power mode with Cortex®‑M4 subsystem, extended communications interfaces, and ADC peripheral
    • Peripheral, I/O, and communication interfaces
      • 28 LINFlexD modules
      • 2 dual-channel FlexRay controllers
      • 10 queued serial peripheral interface (SPIQ) modules
      • 2 DSPI with shifted PWM serialization support for lighting applications
      • 2 I²C interfaces
      • 2 SENT modules (15 channels each)
      • 2 PSI5 modules (2 channels each)
      • Enhanced analog-to-digital converter system with:
        • 8 separate 12-bit SAR analog converters (including one supervisor/safety ADC).
        • One 9-bit SAR analog converter for device standby/low-power mode
        • Interconnection with GTM timer for autonomous ADC/GTM subsystem operation
      • Advanced timed I/O capability:
        • Generic timer module (GTM4154)
      • Communication interfaces:
        • Two 10/100/1000 Mbit/s Ethernet controllers compliant with IEEE 802.3-2008: IPv4 and IPv6 checksum modules, AVB, VLAN, and EMC optimized SGMII
        • 19 modular controller area network (MCAN) modules, and 1 time-triggered controller area network (M_TTCAN), all supporting flexible data rate (ISO CAN FD®)
    • External memory interfaces
      • 2 octo-SPI IPs to support HyperBus™ memory (flash/RAM) devices
      • 1 SDMMC interface
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The current status of a product:
Active: Product is in volume production
Evaluation: Product is under characterization. Limited Engineering samples available
Preview: Product is in design stage
Target: Product is in design feasibility stage.No commitment taken to produce
Proposal: Marketing proposal for customer feedback.No commitment taken to design or produce
NRND: Not Recommended for New Design.Product is in volume production only to support customers ongoing production.Marketing description of the package type.Compliancy of the device with industry requirement domains (IRD)The RoHS status of a product:
ECOPACK 1: Initial grade to identify European RoHS compliant products.
ECOPACK 2: New grade to identify brominated chlorinated and antimony oxide flame retardant free products.
ECOPACK 3: Halogen free RoHS exemptions free products.
(*): ECOPACK 2 version available upon request.
(**): Some versions still existing in ECOPACK 1 or not compliant.The current status of a product:
Active: Product is in volume production
Evaluation: Product is under characterization. Limited Engineering samples available
Preview: Product is in design stage
Target: Product is in design feasibility stage.No commitment taken to produce
Proposal: Marketing proposal for customer feedback.No commitment taken to design or produce
NRND: Not Recommended for New Design.Product is in volume production only to support customers ongoing production.Budgetary PriceMarketing description of the package type.Storage method used to contain product.Main country of assembly or fabrication of the product.ECCNs are five character alpha-numeric designations used on the Commerce Control List to identify dual-use items for export control purposes. ECCNs are five character alpha-numeric designations used on the Commerce Control List to identify dual-use items for export control purposes.The value as specified by level (minTypMax) of the ambient temperature (in Cel) in which this item was designed to operate.The value as specified by level (minTypMax) of the ambient temperature (in Cel) in which this item was designed to operate.The value as specified by level (minTypMax) of the ambient temperature (in Cel) in which this item was designed to operate.