Product overview
Description
The LSM6DSV is a high-end, low-noise, low-power 6-axis small IMU, featuring a 3-axis digital accelerometer and a 3-axis digital gyroscope, that offers the best IMU sensor with a triple-channel architecture for processing acceleration and angular rate data on three separate channels (user interface, OIS, and EIS) with dedicated configuration, processing, and filtering.
The LSM6DSV enables processes in edge computing, leveraging embedded advanced dedicated features such as a sensor fusion low-power (SFLP) algorithm and a finite state machine (FSM) for configurable motion tracking.
The LSM6DSV supports the adaptive self-configuration (ASC) feature, which allows the FSM to automatically reconfigure the device in real time based on the detection of a specific motion pattern, without any intervention from the host processor.
-
All features
- Triple-channel architecture for UI, EIS, and OIS data processing
- "Always-on" experience with low power consumption for both accelerometer and gyroscope
- Smart FIFO up to 4.5 KB
- Android compliant
- ±2/±4/±8/±16 g full scale
- ±125/±250/±500/±1000/±2000/±4000 dps full scale
- SPI / I²C & MIPI I3C® v1.1 serial interface with main processor data synchronization
- Auxiliary SPI for OIS data output for gyroscope and accelerometer
- OIS configurable from aux. SPI, primary interface (SPI / I²C & MIPI I3C® v1.1)
- EIS dedicated channel on primary interface with dedicated filtering
- Advanced pedometer, step detector, and step counter
- Significant motion detection, tilt detection
- Standard interrupts: free-fall, wake-up, 6D/4D orientation, click and double click
- Programmable finite state machine for accelerometer, gyroscope, and external sensor data processing with high rate @ 960 Hz
- Embedded adaptive self-configuration (ASC)
- Embedded sensor fusion low-power algorithm
- Embedded temperature sensor
- Analog supply voltage: 1.71 V to 3.6 V
- Independent IO supply (extended range: 1.08 V to 3.6 V)
- Power consumption: 0.65 mA in combo high-performance mode
- Compact footprint: 2.5 mm x 3 mm x 0.83 mm
- ECOPACK and RoHS compliant
You might also like...
EDA Symbols, Footprints and 3D Models
STMicroelectronics - LSM6DSV
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :
Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| LSM6DSV | Preview | LGA 14L 2.5x3x0.86 mm | Ecopack2 | |
| LSM6DSVTR | Active | LGA 14L 2.5x3x0.86 mm | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||||
| LSM6DSVTR | | | distributors No availability of distributors reported, please contact our sales office | |||||||||||
| LSM6DSV | | | distributors No availability of distributors reported, please contact our sales office | |||||||||||
LSM6DSVTR Active
LSM6DSV Preview
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors