Product overview
Description
STM32H745xI/G devices are based on the high-performance Arm® Cortex®-M7 and Cortex®-M4 32-bit RISC cores. The Cortex®-M7 core operates at up to 480 MHz and the Cortex®-M4 core at up to 240 MHz. Both cores feature a floating point unit (FPU) which supports Arm® single- and double-precision (Cortex®-M7 core) operations and conversions (IEEE 754 compliant), including a full set of DSP instructions and a memory protection unit (MPU) to enhance application security.
STM32H745xI/G devices incorporate high-speed embedded memories with a dual-bank flash memory of up to 2 Mbytes, up to 1 Mbyte of RAM (including 192 Kbytes of TCM RAM, up to 864 Kbytes of user SRAM and 4 Kbytes of backup SRAM), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, 2x32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memory access.
All the devices offer three ADCs, two DACs, two ultra-low power comparators, a low-power RTC, a high-resolution timer, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG). The devices support four digital filters for external sigma-delta modulators (DFSDM). They also feature standard and advanced communication interfaces.
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All features
- Includes ST state-of-the-art patented technology
- Dual core
- 32-bit Arm® Cortex®-M7 core with double-precision FPU and L1 cache: 16 Kbytes of data and 16 Kbytes of instruction cache; frequency up to 480 MHz, MPU, 1027 DMIPS/ 2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
- 32-bit Arm® 32-bit Cortex®-M4 core with FPU, Adaptive real-time accelerator (ART Accelerator) for internal flash memory and external memories, frequency up to 240 MHz, MPU, 300 DMIPS/1.25 DMIPS /MHz (Dhrystone 2.1), and DSP instructions
- Memories
- Up to 2 Mbytes of flash memory with read-while-write support
- 1 Mbyte of RAM: 192 Kbytes of TCM RAM (inc. 64 Kbytes of ITCM RAM + 128 Kbytes of DTCM RAM for time critical routines), 864 Kbytes of user SRAM, and 4 Kbytes of SRAM in Backup domain
- Dual mode Quad-SPI memory interface running up to 133 MHz
- Flexible external memory controller with up to 32-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND flash memory clocked up to 125 MHz in Synchronous mode
- CRC calculation unit
- Security
- ROP, PC-ROP, active tamper
- General-purpose input/outputs
- Up to 168 I/O ports with interrupt capability
- Reset and power management
- 3 separate power domains which can be independently clock-gated or switched off:
- D1: high-performance capabilities
- D2: communication peripherals and timers
- D3: reset/clock control/power management
- 1.62 to 3.6 V application supply and I/Os
- POR, PDR, PVD and BOR
- Dedicated USB power embedding a 3.3 V internal regulator to supply the internal PHYs
- Embedded regulator (LDO) to supply the digital circuitry
- High power-efficiency SMPS step-down converter regulator to directly supply VCORE and/or external circuitry
- Voltage scaling in Run and Stop mode (6 configurable ranges)
- Backup regulator (~0.9 V)
- Voltage reference for analog peripheral/VREF+
- 1.2 to 3.6 V VBAT supply
- Low-power modes: Sleep, Stop, Standby and VBAT supporting battery charging
- 3 separate power domains which can be independently clock-gated or switched off:
- Low-power consumption
- VBAT battery operating mode with charging capability
- CPU and domain power state monitoring pins
- 2.95 µA in Standby mode (Backup SRAM OFF, RTC/LSE ON)
- Clock management
- Internal oscillators: 64 MHz HSI, 48 MHz HSI48, 4 MHz CSI, 32 kHz LSI
- External oscillators: 4-48 MHz HSE, 32.768 kHz LSE
- 3× PLLs (1 for the system clock, 2 for kernel clocks) with Fractional mode
- Interconnect matrix
- 4 DMA controllers to unload the CPU
- 1× high-speed master direct memory access controller (MDMA) with linked list support
- 2× dual-port DMAs with FIFO
- 1× basic DMA with request router capabilities
- Up to 35 communication peripherals
- 4× I2Cs FM+ interfaces (SMBus/PMBus)
- 4× USARTs/4x UARTs (ISO7816 interface, LIN, IrDA, up to 12.5 Mbit/s) and 1x LPUART
- 6× SPIs, 3 with muxed duplex I2S audio class accuracy via internal audio PLL or external clock, 1x I2S in LP domain (up to 150 MHz)
- 4x SAIs (serial audio interface)
- SPDIFRX interface
- SWPMI single-wire protocol master I/F
- MDIO Slave interface
- 2× SD/SDIO/MMC interfaces (up to 125 MHz)
- 2× CAN controllers: 2 with CAN FD, 1 with time-triggered CAN (TT-CAN)
- 2× USB OTG interfaces (1FS, 1HS/FS) crystal-less solution with LPM and BCD
- Ethernet MAC interface with DMA controller
- HDMI-CEC
- 8- to 14-bit camera interface (up to 80 MHz)
- 11 analog peripherals
- 3× ADCs with 16-bit max. resolution (up to 36 channels, up to 3.6 MSPS)
- 1× temperature sensor
- 2× 12-bit D/A converters (1 MHz)
- 2× ultra-low-power comparators
- 2× operational amplifiers (7.3 MHz bandwidth)
- 1× digital filters for sigma delta modulator (DFSDM) with 8 channels/4 filters
- Graphics
- LCD-TFT controller up to XGA resolution
- Chrom-ART graphical hardware Accelerator (DMA2D) to reduce CPU load
- Hardware JPEG Codec
- Up to 22 timers and watchdogs
- 1× high-resolution timer (2.1 ns max resolution)
- 2× 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input (up to 240 MHz)
- 2× 16-bit advanced motor control timers (up to 240 MHz)
- 10× 16-bit general-purpose timers (up to 240 MHz)
- 5× 16-bit low-power timers (up to 240 MHz)
- 4× watchdogs (independent and window)
- 2× SysTick timers
- RTC with sub-second accuracy and hardware calendar
- Debug mode
- SWD & JTAG interfaces
- 4-Kbyte embedded trace buffer
- True random number generators (3 oscillators each)
- 96-bit unique ID
Circuit Diagram
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EDA Symbols, Footprints and 3D Models
All resources
Resource title | Version | Latest update |
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System View Description (1)
Resource title | Version | Latest update | ||
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ZIP | 1.9 | 23 Nov 2023 | 23 Nov 2023 |
IBIS models (1)
Resource title | Version | Latest update | ||
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ZIP | 5.0 | 11 Mar 2024 | 11 Mar 2024 |
BSDL files (1)
Resource title | Version | Latest update | ||
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ZIP | 5.0 | 14 Oct 2024 | 14 Oct 2024 |
Quality and Reliability
Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
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STM32H745BGT6 | Active | LQFP 208 28x28x1.4 mm | Industrial | Ecopack2 | |
STM32H745BGT6
Package:
LQFP 208 28x28x1.4 mmMaterial Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | D/A Converters (typ) (12-bit) | Timers (typ) (16-bit) | Timers (typ) (32-bit) | Number of Channels (typ) | SMPS | Number of Channels (typ) | UART (typ) | I/Os (High Current) | Integrated op-amps | Comparator | SPI (typ) | USART (typ) | Number of Channels (typ) | I2S (typ) | Advanced Motor Control Timers | CAN (2.0) | CAN (FD) | Ethernet | ||
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STM32H745BGT6 | | | distributors No availability of distributors reported, please contact our sales office |
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STM32H745BGT6 Active
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors