Product overview
Key Benefits
Mainlined OpenSTLinux Distribution
One OpenSTLinux Software compatible with STM32MP1 Series. OpenSTLinux expansion packages can be applied on the top to enable the use of additional components.
3D GPU
Specifically designed to accelerate 3D graphics in applications such as graphical user interfaces (GUI) |
MIPI DSI protocol
Supporting advanced features to deliver displays with higher resolution and quality.
Description
The STM32MP157A/D devices are based on the high-performance dual-core Arm® Cortex®-A7 32-bit RISC core operating at up to 800 MHz. The Cortex-A7 processor includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU and a 256-Kbyte level2 cache. The Cortex-A7 processor is a very energy-efficient application processor designed to provide rich performance in high-end wearables, and other low-power embedded and consumer applications. It provides up to 20% more single thread performance than the Cortex-A5 and provides similar performance than the Cortex-A9.
The Cortex-A7 incorporates all features of the high-performance Cortex-A15 and Cortex-A17 processors, including virtualization support in hardware, NEON™, and 128-bit AMBA®4 AXI bus interface.
The STM32MP157A/D devices also embed a Cortex® -M4 32-bit RISC core operating at up to 209 MHz frequency. Cortex-M4 core features a floating point unit (FPU) single precision which supports Arm® single-precision data-processing instructions and data types. The Cortex® -M4 supports a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
The STM32MP157A/D devices also embed a 3D graphic processing unit (Vivante® - OpenGL® ES 2.0) running at up to 533 MHz, with performances up to 26 Mtriangle/s, 133 Mpixel/s.
The STM32MP157A/D devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16 or 32-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz.
The STM32MP157A/D devices incorporate high-speed embedded memories with 708 Kbytes of Internal SRAM (including 256 Kbytes of AXI SYSRAM, 3 banks of 128 Kbytes each of AHB SRAM, 64 Kbytes of AHB SRAM in backup domain and 4 Kbytes of SRAM in backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, a 32-bit multi-AHB bus matrix and a 64-bit multi layer AXI interconnect supporting internal and external memories access.
All the devices offer two ADCs, two DACs, a low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG). The devices support six digital filters for external sigma delta modulators (DFSDM). They also feature standard and advanced communication interfaces.
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All features
- Includes ST state-of-the-art patented technology
- Core
- 32-bit dual-core Arm® Cortex®-A7
- L1 32-Kbyte I / 32-Kbyte D for each core
- 256-Kbyte unified level 2 cache
- Arm® NEON™ and Arm® TrustZone®
- 32-bit Arm® Cortex®-M4 with FPU/MPU
- Up to 209 MHz (Up to 703 CoreMark®)
- 32-bit dual-core Arm® Cortex®-A7
- Memories
- External DDR memory up to 1 Gbyte
- up to LPDDR2/LPDDR3-1066 16/32-bit
- up to DDR3/DDR3L-1066 16/32-bit
- 708 Kbytes of internal SRAM: 256 Kbytes of AXI SYSRAM + 384 Kbytes of AHB SRAM + 64 Kbytes of AHB SRAM in Backup domain and 4 Kbytes of SRAM in Backup domain
- Dual mode Quad-SPI memory interface
- Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs and SLC NAND memories with up to 8-bit ECC
- External DDR memory up to 1 Gbyte
- Security/safety
- TrustZone® peripherals, active tamper
- Cortex®-M4 resources isolation
- Reset and power management
- 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
- POR, PDR, PVD and BOR
- On-chip LDOs (RETRAM, BKPSRAM, DSI 1.2 V, USB 1.8 V, 1.1 V)
- Backup regulator (~0.9 V)
- Internal temperature sensors
- Low-power modes: Sleep, Stop and Standby
- DDR memory retention in Standby mode
- Controls for PMIC companion chip
- Low-power consumption
- Total current consumption down to 2 µA (Standby mode, no RTC, no LSE, no BKPSRAM, no RETRAM)
- Clock management
- Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator
- External oscillators: 8-48 MHz HSE oscillator, 32.768 kHz LSE oscillator
- 6 × PLLs with fractional mode
- General-purpose input/outputs
- Up to 176 I/O ports with interrupt capability
- Up to 8 secure I/Os
- Up to 6 Wakeup, 3 tampers, 1 active tamper
- Up to 176 I/O ports with interrupt capability
- Interconnect matrix
- 2 bus matrices
- 64-bit Arm® AMBA® AXI interconnect, up to 266 MHz
- 32-bit Arm® AMBA® AHB interconnect, up to 209 MHz
- 2 bus matrices
- 3 DMA controllers to unload the CPU
- 48 physical channels in total
- 1 × high-speed general-purpose master direct memory access controller (MDMA)
- 2 × dual-port DMAs with FIFO and request router capabilities for optimal peripheral management
- Up to 37 communication peripherals
- 6 × I2C FM+ (1 Mbit/s, SMBus/PMBus)
- 4 × UART + 4 × USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI)
- 6 × SPI (50 Mbit/s, including 3 with full duplex I2S audio class accuracy via internal audio PLL or external clock)(+ 4 with USART)
- 4 × SAI (stereo audio: I2S, PDM, SPDIF Tx)
- SPDIF Rx with 4 inputs
- HDMI-CEC interface
- MDIO Slave interface
- 3 × SDMMC up to 8-bit (SD / e•MMC™/ SDIO)
- 2 × CAN controllers supporting CAN FD protocol, out of which one supports time-triggered CAN (TTCAN)
- 2 × USB 2.0 high-speed Host+ 1 × USB 2.0 full-speed OTG simultaneously
- or 1 × USB 2.0 high-speed Host+ 1 × USB 2.0 high-speed OTG simultaneously
- 10/100M or Gigabit Ethernet GMAC
- IEEE 1588v2 hardware, MII/RMII/GMII/RGMII
- 8- to 14-bit camera interface up to 140 Mbyte/s
- 6 analog peripherals
- 2 × ADCs with 16-bit max. resolution (12 bits up to 4.5 Msps, 14 bits up to 4 Msps, 16 bits up to 3.6 Msps)
- 1 × temperature sensor
- 2 × 12-bit D/A converters (1 MHz)
- 1 × digital filters for sigma delta modulator (DFSDM) with 8 channels/6 filters
- Internal or external ADC/DAC reference VREF+
- Graphics
- 3D GPU: Vivante® - OpenGL® ES 2.0
- Up to 26 Mtriangle/s, 133 Mpixel/s
- LCD-TFT controller, up to 24-bit // RGB888
- up to WXGA (1366 × 768) @60 fps or up to Full HD (1920 × 1080) @30 fps
- Pixel clock up to 90 MHz
- Two layers with programmable colour LUT
- MIPI® DSI 2 data lanes up to 1 Gbps each
- 3D GPU: Vivante® - OpenGL® ES 2.0
- Up to 29 timers and 3 watchdogs
- 2 × 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
- 2 × 16-bit advanced motor control timers
- 10 × 16-bit general-purpose timers (including 2 basic timers without PWM)
- 5 × 16-bit low-power timers
- RTC with sub-second accuracy and hardware calendar
- 2 × 4 Cortex®-A7 system timers (secure, non-secure, virtual, hypervisor)
- 1 × SysTick M4 timer
- 3 × watchdogs (2 × independent and window)
- Hardware acceleration
- HASH (MD5, SHA-1, SHA224, SHA256), HMAC
- 2 × true random number generator (3 oscillators each)
- 2 × CRC calculation unit
- Debug mode
- Arm® CoreSight™ trace and debug: SWD and JTAG interfaces
- 8-Kbyte embedded trace buffer
- 3072-bit fuses including 96-bit unique ID, up to 1184-bit available for user
- All packages are ECOPACK2 compliant
Circuit Diagram
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STMicroelectronics - STM32MP157D
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All resources
| Resource title | Version | Latest update |
|---|
HW Models (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 3.0 | 08 Mar 2023 | 08 Mar 2023 |
System View Description (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.0 | 20 Mar 2023 | 20 Mar 2023 | |
| ZIP | 1.1 | 30 Jan 2024 | 30 Jan 2024 |
IBIS models (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.0 | 07 Mar 2023 | 07 Mar 2023 |
BSDL files (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 4.0 | 07 Jun 2023 | 07 Jun 2023 |
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| STM32MP157DAA1 | Active | LFBGA 448 18x18x1.7 P 0.8 mm | Industrial | Ecopack2 | |
| STM32MP157DAB1 | Active | LFBGA 354 16x16x1.7 P 0.8 mm | Industrial | Ecopack2 | |
| STM32MP157DAC1 | Active | TFBGA 361 12x12x1.2 P 0.5 mm | Industrial | Ecopack2 | |
| STM32MP157DAD1 | Active | TFBGA 257 10x10x1.2 P 0.5 mm | Industrial | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | Junction Temperature (°C) (min) | Junction Temperature (°C) (max) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| STM32MP157DAC1 | | | distributors No availability of distributors reported, please contact our sales office |
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| STM32MP157DAD1 | | | distributors No availability of distributors reported, please contact our sales office |
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| STM32MP157DAA1 | | | distributors No availability of distributors reported, please contact our sales office |
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| STM32MP157DAB1 | | | distributors No availability of distributors reported, please contact our sales office |
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STM32MP157DAC1 Active
STM32MP157DAD1 Active
STM32MP157DAA1 Active
STM32MP157DAB1 Active
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors