ST25DV16KC

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Dynamic NFC/RFID tag IC with 16-Kbit EEPROM, and fast transfer mode capability

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Product overview

Description

The ST25DV04KC, ST25DV16KC, and ST25DV64KC devices (hereinafter referred collectively to as ST25DVxxKC) are NFC RFID tags offering, respectively, 4, 16, and 64‑Kbit of electrically erasable programmable memory (EEPROM). These devices feature two interfaces: the first one is an I²C serial link that can be operated from a DC power supply, the second one is an RF link activated when the device acts as a contactless memory powered by the received carrier electromagnetic wave.

In I²C mode, the user memory contains 512 (ST25DV04KC), 2048 (ST25DV16KC), or 8192 (ST25DV64KC) bytes, which can be split in four flexible and protectable areas.

In RF mode, following ISO/IEC 15693 or NFC Forum Type 5 recommendations, the user memory contains 128 (ST25DV04KC), 512 (ST25DV16KC), or 2048 (ST25DV64KC) blocks of 4 bytes, which can be split in four flexible and protectable areas.

These devices offer a fast transfer mode between the RF and contact interfaces, thanks to a 256 bytes volatile buffer (also called mailbox). In addition, the GPO pin provides data about incoming events, like RF field detection, RF activity in progress, or mailbox message availability. An energy harvesting feature is also available.

  • All features

    • Includes ST state-of-the-art patented technology
    • I²C interface
      • Two-wire I²C serial interface supports 1 MHz protocol
      • Single supply voltage: 1.8 to 5.5 V
      • Multiple byte programming (up to 256 bytes)
      • Configurable I²C target address
    • Contactless interface
      • Based on ISO/IEC 15693
      • NFC Forum Type 5 tag certified by the NFC Forum
      • Support of all ISO/IEC 15693 modulations, coding, subcarrier modes and data rates
      • Custom fast read access up to 53 Kbit/s
      • Single and multiple blocks read (same for extended commands)
      • Single and multiple (up to four) blocks write (same for extended commands)
      • Internal tuning capacitance: 28.5 pF
    • Memory
      • Up to 64 Kbit of EEPROM (depending on version)
      • I²C interface accesses bytes
      • RF interface accesses blocks of 4 bytes
      • Write time:
        • From I²C: typical 5 ms for 1 up to 16 bytes
        • From RF: typical 5 ms for one block
      • Data retention: 40 years
      • Write cycles endurance:
        • 1 million at 25 °C
        • 600k at 85 °C
        • 500k at 105 °C
        • 400k at 125 °C
    • Fast transfer mode
      • Fast data transfer between I²C and RF interfaces
      • Half-duplex 256 bytes dedicated buffer
    • Energy harvesting
      • Analog output pin to power external components
    • Data protection
      • User memory: one to four configurable areas, protectable in read and/or write by three 64-bit passwords in RF and one 64‑bit password in I²C
      • System configuration: protected in write by a 64-bit password in RF and a 64-bit password in I²C
    • GPO
      • Interruption pin configurable on multiple RF events (field change, memory write, activity, fast transfer, user set/reset/pulse), and I²C events (memory write completed, RF switch off)
      • Open drain or CMOS output (depending on version)
    • Low power mode (10-ball and 12-pin packages only)
      • Input pin to trigger low power mode
    • RF management
      • RF command interpreter enabled/disabled from I²C host controller
      • I²C priority: immediate RF switch off from I²C
    • Temperature range
      • Range 6:
        • From -40 °C to 85 °C
      • Range 8:
        • From -40 °C to 105 °C (UDFPN8 and UFDFPN12 only)
        • From -40 °C to 125 °C (SO8N and TSSOP8 only, 105 °C max on RF interface)
    • Package
      • 8-pin, 10-ball, and 12-pin
      • ECOPACK2 (RoHS compliant)

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STMicroelectronics - ST25DV16KC

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
ST25DV16KC-IE6C3
Active
UFDFPN 8 2x3x0.6 Industrial Ecopack2
ST25DV16KC-IE6S3
Active
SO8 Industrial Ecopack2
ST25DV16KC-IE6T3
Active
TSSOP-8L Industrial Ecopack2
ST25DV16KC-IE8C3
Active
UFDFPN 8 2x3x0.6 Industrial Ecopack2
ST25DV16KC-IE8S3
Active
SO8 Industrial Ecopack2
ST25DV16KC-IE8T3
Active
TSSOP-8L Industrial Ecopack2
ST25DV16KC-JF6D3
Active
UFDFPN 12L 3X3X0.55 Pitch 0.50 Industrial Ecopack2
ST25DV16KC-JF8D3
Active
UFDFPN 12L 3X3X0.55 Pitch 0.50 Industrial Ecopack2

ST25DV16KC-IE6C3

Package:

UFDFPN 8 2x3x0.6

Material Declaration**:

PDF XML

Marketing Status

Active

Package

UFDFPN 8 2x3x0.6

Grade

Industrial

RoHS Compliance Grade

Ecopack2

ST25DV16KC-IE6S3

Package:

SO8

Material Declaration**:

PDF XML

Marketing Status

Active

Package

SO8

Grade

Industrial

RoHS Compliance Grade

Ecopack2

ST25DV16KC-IE6T3

Package:

TSSOP-8L

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TSSOP-8L

Grade

Industrial

RoHS Compliance Grade

Ecopack2

ST25DV16KC-IE8C3

Package:

UFDFPN 8 2x3x0.6

Material Declaration**:

Marketing Status

Active

Package

UFDFPN 8 2x3x0.6

Grade

Industrial

RoHS Compliance Grade

Ecopack2

ST25DV16KC-IE8S3

Package:

SO8

Material Declaration**:

PDF XML

Marketing Status

Active

Package

SO8

Grade

Industrial

RoHS Compliance Grade

Ecopack2

ST25DV16KC-IE8T3

Package:

TSSOP-8L

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TSSOP-8L

Grade

Industrial

RoHS Compliance Grade

Ecopack2

ST25DV16KC-JF6D3

Package:

UFDFPN 12L 3X3X0.55 Pitch 0.50

Material Declaration**:

PDF XML

Marketing Status

Active

Package

UFDFPN 12L 3X3X0.55 Pitch 0.50

Grade

Industrial

RoHS Compliance Grade

Ecopack2

ST25DV16KC-JF8D3

Package:

UFDFPN 12L 3X3X0.55 Pitch 0.50

Material Declaration**:

PDF XML

Marketing Status

Active

Package

UFDFPN 12L 3X3X0.55 Pitch 0.50

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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