Product overview

Description

The Teseo-LIV3F module is an easy to use Global Navigation Satellite System (GNSS) standalone module, embedding TeseoIII single die standalone positioning receiver IC working simultaneously on multiple constellations (GPS/Galileo/Glonass/BeiDou/QZSS).

The Teseo-LIV3F modules bring the proven accuracy and robustness of Teseo chips to the reach of everyone: the embedded firmware and the complete evaluation environment save development time, while the compactness and cost-effectiveness of this solution make it ideal for several applications, such as insurance, goods tracking, drones, tolling, anti-theft systems, people and pet location, vehicle tracking, emergency calls, fleet management, vehicle sharing, diagnostics and public transportation.

Within its 9.7x10.1 mm tiny size, Teseo-LIV3F is offerinDS12152g superior accuracy thanks to the on board 26 MHz Temperature Compensated Crystal Oscillator (TCXO) and a reduced Time To First Fix (TTFF) relying to its dedicated 32 KHz Real Time Clock (RTC) oscillator.

Thanks to the embedded 16 Mbit flash Teseo-LIV3F offers many extra features such as data logging, 7 days autonomous assisted GNSS, FW reconfigurability as well as FW upgrades.

Teseo-LIV3F provides also the Autonomous Assisted GNSS able to predict satellite data based on previous observation of satellite.

Teseo-LIV3F module, being a certified solution, optimizes the time to market of the final applications with a temperature operating range from -40°C to 85°C.

  • All features

    • Simultaneously multiconstellation
    • -163 dBm navigation sensitivity
    • 1.5 m CEP accuracy positioning
    • 16 Mbit embedded Flash for data logging and FW upgrade
    • 2.1 V to 4.3 V supply voltage range
    • Tiny LCC 18 pin package (9.7x10.1)
    • Operating temperature (-40°, 85°C)
    • Free FW configuration
    • 17 μW standby current and 75 mW tracking power consumption

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All tools & software

    • Part number
      Status
      Description
      Type
      Supplier

      AndroidHAL-Teseo

      Active

      Android HAL Device Driver for Teseo GNSS Solutions

      Automotive infotainment and telematics software ST
      AndroidHAL-Teseo

      Description:

      Android HAL Device Driver for Teseo GNSS Solutions

      TESEO-DRAW

      Active

      Dead Reckoning Automotive Way - Sensor fusion firmware for Teseo Family

      Automotive infotainment and telematics software ST
      TESEO-DRAW

      Description:

      Dead Reckoning Automotive Way - Sensor fusion firmware for Teseo Family

      TESEO-SUITE

      Active

      PC software tool to manage, configure and evaluate the performances of Teseo GNSS family

      Automotive infotainment and telematics software ST
      TESEO-SUITE

      Description:

      PC software tool to manage, configure and evaluate the performances of Teseo GNSS family

      Teseo-LIV3FSW

      Active

      Teseo-LIV3F GNSS firmware

      Automotive infotainment and telematics software ST
      Teseo-LIV3FSW

      Description:

      Teseo-LIV3F GNSS firmware
    • Part number
      Status
      Description
      Type
      Supplier

      X-CUBE-GNSS1

      Active

      Global navigation satellite system software expansion for STM32Cube

      STM32Cube Expansion Packages ST
      X-CUBE-GNSS1

      Description:

      Global navigation satellite system software expansion for STM32Cube

      X-LINUX-GNSS1

      Active

      STM32 MPU OpenSTLinux software expansion package for GNSS-based applications

      STM32 MPU OpenSTLinux Expansion Packages ST
      X-LINUX-GNSS1

      Description:

      STM32 MPU OpenSTLinux software expansion package for GNSS-based applications
    • Part number
      Status
      Description
      Type
      Supplier

      EVB-LIV3F

      Active

      TESEO-LIV3F module evaluation board

      GNSS ICs eval boards --
      EVB-LIV3F

      Description:

      TESEO-LIV3F module evaluation board
    • Part number
      Status
      Description
      Type
      Supplier

      AEK-COM-GNSST31

      NRND

      GNSS evaluation board based on Teseo-LIV3F for SPC5 microcontrollers

      Transportation ST
      AEK-COM-GNSST31

      Description:

      GNSS evaluation board based on Teseo-LIV3F for SPC5 microcontrollers

      STEVAL-ASTRA1B

      Active

      Multiconnectivity asset tracking reference design based on STM32WB5MMG and STM32WL55JC

      Wired ST
      STEVAL-ASTRA1B

      Description:

      Multiconnectivity asset tracking reference design based on STM32WB5MMG and STM32WL55JC

      STEVAL-STRKT01

      NRND

      LoRa® IoT tracker

      Wired ST
      STEVAL-STRKT01

      Description:

      LoRa® IoT tracker
    • Part number
      Status
      Description
      Type
      Supplier

      X-NUCLEO-GNSS1A1

      Active

      GNSS expansion board based on Teseo-LIV3F module for STM32 Nucleo

      STM32 ODE Connect HW ST
      X-NUCLEO-GNSS1A1

      Description:

      GNSS expansion board based on Teseo-LIV3F module for STM32 Nucleo

EDA Symbols, Footprints and 3D Models

STMicroelectronics - Teseo-LIV3F

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

Please select one model supplier :

Symbols

Symbols

Footprints

Footprints

3D model

3D models

Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
TESEO-LIV3F
Active
RF MODULE Industrial Ecopack2

TESEO-LIV3F

Package:

RF MODULE

Material Declaration**:

PDF XML

Marketing Status

Active

Package

RF MODULE

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

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Part Number
Marketing Status
Budgetary Price (US$)*/Qty
Order from ST
Order from distributors
Package
Packing Type
RoHS
Country of Origin
ECCN (US)
ECCN (EU)
Operating temperature (°C)
min
max
TESEO-LIV3F
Active
10.5 / 1k
Available at 6 distributors

Distributor availability of TESEO-LIV3F

Distributor Name
Region Stock Min. Order Third party link
Farnell Element14 EUROPE 4910 1
MOUSER WORLDWIDE 606 1
FUTURE WORLDWIDE 1000 1000
AVNET AMERICA 4000 0
DIGIKEY WORLDWIDE 1541 1
Newark Element14 AMERICA 523 0

Distributor reported inventory date: 3/31/2025

RF MODULE Tape and Reel SOUTH KOREA 7A994 NEC -40 85

TESEO-LIV3F Active

Budgetary Price (US$)*/Qty:
10.5 / 1k
Package:
RF MODULE
Packing Type:
Tape and Reel
RoHS:
Country of Origin:
SOUTH KOREA
ECCN (US):
7A994
ECCN (EU):
NEC

Part Number:

TESEO-LIV3F

Operating Temperature (°C)

Min:

-40

Max:

85

Distributor Name

Farnell Element14

Stock

4910

Min.Order

1

MOUSER

Stock

606

Min.Order

1

Region

WORLDWIDE Buy from Distributor

FUTURE

Stock

1000

Min.Order

1000

Region

WORLDWIDE Buy from Distributor

AVNET

Stock

4000

Min.Order

0

Region

AMERICA Buy from Distributor

DIGIKEY

Stock

1541

Min.Order

1

Region

WORLDWIDE Buy from Distributor

Newark Element14

Stock

523

Min.Order

0

Region

AMERICA Buy from Distributor

Distributor reported inventory date: 3/31/2025

Swipe or click the button to explore more details Don't show this again

(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors