Product overview
Description
This power module realizes a fourpack topology in an ACEPACK 2 module with NTC and capacitance, integrating the latest advances in silicon carbide MOSFETs from STMicroelectronics, represented by third generation technology. This modular solution is used to realize complex topologies with very high power density and efficiency requirements.
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All features
- Fourpack topology
- ACEPACK 2 power module
- 23 mΩ of typical RDS(on) each switch
- Insulation voltage 2.5 kVrms
- Integrated NTC temperature sensor
- Integrated DC link capacitor
- DBC Cu-Al2O3-Cu based
- Press-fit contact pins
EDA Symbols, Footprints and 3D Models
Quality and Reliability
Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
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A2F20M65W3-FC | Active | ACEPACK 2 | Industrial | Ecopack1 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | |
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A2F20M65W3-FC | | | distributors No availability of distributors reported, please contact our sales office |
A2F20M65W3-FC Active
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors