MLPF-WB55-02E3

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Design Win

2.4 GHz Matched filter companion chip for STM32WB55Vx

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Product overview

Description

The MLPF-WB55-02E3 integrates an impedance matching network and harmonics filter. The matching impedance network has been tailored to maximize the RF performance of STM32WB55Vx. This device uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance.

  • All features

    • Integrated impedance matching to STM32WB55Vx
    • LGA footprint compatible
    • 50 Ω nominal impedance on antenna side
    • Deep rejection harmonics filter
    • Low insertion loss
    • Small footprint
    • Low thickness ≤ 450 μm
    • High RF performance
    • RF BOM and area reduction
    • ECOPACK2 compliant component

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STMicroelectronics - MLPF-WB55-02E3

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
MLPF-WB55-02E3
Active
FLIP CHIP BUMPLESS CSPG Industrial Ecopack2

MLPF-WB55-02E3

Package:

FLIP CHIP BUMPLESS CSPG

Material Declaration**:

PDF XML

Marketing Status

Active

Package

FLIP CHIP BUMPLESS CSPG

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors