Product overview
Description
The MLPF-WB55-02E3 integrates an impedance matching network and harmonics filter. The matching impedance network has been tailored to maximize the RF performance of STM32WB55Vx. This device uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance.
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All features
- Integrated impedance matching to STM32WB55Vx
- LGA footprint compatible
- 50 Ω nominal impedance on antenna side
- Deep rejection harmonics filter
- Low insertion loss
- Small footprint
- Low thickness ≤ 450 μm
- High RF performance
- RF BOM and area reduction
- ECOPACK2 compliant component
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Related Applications
Functions
Industrial
All resources
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Product Specifications (1)
Resource title | Version | Latest update | ||
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3.0 | 28 Nov 2022 | 28 Nov 2022 |
Application Notes (1)
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2.0 | 09 Jan 2023 | 09 Jan 2023 |
Presentations (2)
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1.0 | 24 Jan 2023 | 24 Jan 2023 | ||
2.0 | 05 May 2023 | 05 May 2023 |
Flyers (3)
Resource title | Version | Latest update | ||
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1.0 | 17 Dec 2024 | 17 Dec 2024 | ||
1.0 | 26 Jan 2023 | 26 Jan 2023 | ||
1.0 | 28 Dec 2023 | 28 Dec 2023 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - MLPF-WB55-02E3
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All resources
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CAD Symbol & Footprint models (2)
Resource title | Version | Latest update | ||
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ZIP | 1.0 | 31 Aug 2021 | 31 Aug 2021 | |
ZIP | 1.0 | 31 Aug 2021 | 31 Aug 2021 |
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Quality and Reliability
Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
---|---|---|---|---|---|
MLPF-WB55-02E3 | Active | FLIP CHIP BUMPLESS CSPG | Industrial | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | |||||||||||||||||||||||||||||||||||||||||
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MLPF-WB55-02E3 | Active | 0.13 / 500 | Available at 6 distributors Distributor availability of MLPF-WB55-02E3
Distributor reported inventory date: 3/27/2025 | | | | Buy from Distributor | | FLIP CHIP BUMPLESS CSPG | Tape and Reel | CHINA | EAR99 | NEC |
MLPF-WB55-02E3 Active
Part Number:
MLPF-WB55-02E3
Farnell Element14
Stock
3382Min.Order
1ANGLIA Live
Stock
9300Min.Order
1MOUSER
Stock
6231Min.Order
1AVNET
Stock
10000Min.Order
0DIGIKEY
Stock
3214Min.Order
1YOSUN
Stock
100Min.Order
1Distributor reported inventory date: 3/27/2025
Stock
Min.Order
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors