Product overview
Key Benefits
Enabling high-performance edge AI on MCUs
Embedded proprietary neural processing unit, ST Neural-ART accelerator.
Arm® Cortex®-M55 core at 800 MHz, highest STM32 core frequency yet.
Elevating graphics & multimedia experiences
Multiple graphics accelerators. Computer vision pipeline. Multimedia encoder/decoder.
Seamlessly integrated in the STM32 ecosystem
Supported by ST Edge AI Suite. Compatible with the TouchGFX packages.
Description
The STM32N6x7xx devices are based on the high-performance Arm® Cortex®-M55, operating at a frequency up to 800 MHz.
The Cortex®-M55 core features the Arm® Helium™ vector processing technology. On top of standard microcontroller tasks, this core enables energy-efficient digital signal processing. The Cortex®-M55 is equipped with a floating-point unit (FPU) that supports single- and half-precision (IEEE 754 compliant) data-processing. The Cortex®-M55 includes a 32-Kbyte ICACHE, a 32-Kbyte DCACHE, as well as 128-Kbyte data TCM RAM and 64-Kbyte instruction TCM RAM with ECC for critical real-time routines.
These microcontrollers have TrustZone®-aware support and a memory protection unit (MPU) for enhanced application security. A secure boot ROM ensures secure booting from external interfaces.
The devices embed a 4.2-Mbyte contiguous SRAM organized in several banks, an 8-Kbyte backup SRAM active in VBAT mode, and a flexible external memory controller (FMC) for static memories, XSPI 8-/16-bit configurations.
The ST Neural-ART accelerator, running at up to 1 GHz and providing 600 Gops using optimized hardware units for DNN (deep-neural network) inference functions. optimizes power efficiency. Dedicated streaming engines are integrated into it to optimize data flow and minimize internal buffer usage and power. The accelerator supports on-the-fly weight decompression and real-time data encryption and decryption.
The Neo-Chrom graphic accelerator ensures efficient 2.5D graphic processing, by providing hardware acceleration for functions like scaling, using high-quality interpolation, free rotation, alpha blending, texture mapping, and perspective transformation.
For camera applications, a parallel and CSI interface together with an integrated hardware ISP is foreseen. The ISP provides processing of three parallel pipes on the same input stream. Supported algorithms are bad pixel, decimation, black-level tuning, exposure control, de-mosaicking, column conversion, contrast, cropping, downsizing, ROI isolation, gamma correction, YUV conversion, and pixel packer. The ISP output can be directly fed via a DMA to the NPU.
Optionally, the devices embed a hardware H264 encoding block supporting baseline profile, main profile and high profile level 1 to level 5.2, supporting frame rates of up to 30 frames per second for 1080p resolution.
A dedicated hardware accelerator ensures fast and simple JPEG and motion JPEG compression and decompression.
The devices offer an extensive range of enhanced I/Os and peripherals, and operate in the -40 to +125 °C temperature range, from 1.71 to 3.6 V power supply. A comprehensive set of low-power modes (Sleep, Stop, and Standby) allows the design of low-power applications.
The STM32N6x7xx devices are offered in six VFBGA packages, ranging from 142 to 264 pins.
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All features
- Includes ST state-of-the-art patented technology
- Core
- Arm® 32-bit Cortex®-M55, 3360 CoreMark®, frequency up to 800 MHz, 1280 DMIPS, 32-Kbyte ICACHE, 32-Kbyte DCACHE
- Arm® MVE (M-Profile vector extension)
- Arm® Helium™ technology
- Arm® TrustZone® MPU, NVIC
- Single and half-precision floating point unit
- Neural processing unit
- ST Neural-ART Accelerator, frequency up to 1 GHz, 600 Gops, 288 MAC/cycle
- Specialized hardware units for DNN (deep-neural network) inference functions
- Flexible dedicated stream processing engine
- Real-time encryption/decryption
- On-the-fly weight decompression
- Memories
- 4.2-Mbyte contiguous SRAM
- 128-Kbyte TCM (tightly-coupled memory) RAM with ECC for critical real-time data + 64-Kbyte instruction TCM RAM with ECC for critical real-time routines
- 8-Kbyte backup SRAM active in VBAT mode
- Flexible external memory controller with cypher engine supporting up to 32-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND memories
- XSPI with support for serial PSRAM, NAND, NOR, HyperRAM™/ HyperFlash™ frame formats
- 2 ports: XSPIM 8- and 16-bit configuration up to 200 MHz
- Graphics
- Neo-Chrom 2.5D GPU: scaling, rotation, alpha blending, texture mapping, perspective transformation
- Chrom-ART Accelerator (DMA2D)
- Hardware JPEG codec with MJPEG
- LCD-TFT controller up to XGA resolution
- Video
- Parallel and 2-lane CSI-2 camera interfaces
- ISP (image signal processor) with three parallel pipes on the same input stream: bad pixel, decimation, black level, exposure, de-mosaic, column conversion, contrast, crop, downsize, ROI, gamma, YUV convention, pixel packer
- H264 video encoding acceleration: baseline profile, main profile, high profile level 1 to level 5.2, 1080p30 and 720p60
- Security and cryptography
- Arm® TrustZone® and securable I/Os memories and peripherals
- SESIP Level 3 (security evaluation standard for IoT platforms), Arm® PSA (platform security architecture) certified
- Flexible life-cycle scheme with RDP and password-protected debug
- Secure provisioning of customer keys in OTP (one-time programmable) fuses
- Secure boot code in ROM, decrypting and authenticating customer uRoT (updatable root-of-trust)
- Secure data storage with hardware-unique key (HUK)
- Secure firmware upgrade support with TF-M (trusted firmware-M)
- Two AES coprocessors, including one with DPA (differential power analysis) resistance
- Public key accelerator (PKA), DPA resistant
- On-the-fly encryption/decryption of external memories
- HASH hardware accelerator
- True random number generator (RNG), NIST SP800-90B compliant
- 96-bit unique ID
- 1.5-Kbyte OTP fuses
- Active tampers
- Communication peripherals
- 2x USB 2.0 high-speed/full-speed device/host OTG controllers (one with UCPD USB Type-C® Power Delivery)
- 10-Mbit, 100-Mbit, and 1-Gbit Ethernet with TSN (time-sensitive networking)
- 4x I2C Fm+ interfaces (SMBus/PMBus®) + 2x I3C
- 6x SPI, of which four I2S-capable
- 2x SAI, with four DMIC support
- 5x USART, 5x UART (ISO78916 interface, LIN, IrDA, up to 12.5 Mbit/s) + 1x LPUART
- 2x SDMMC: MMC version 4.0, CE-ATA version 1.0, and SD version 1.0.1
- 3x FDCAN with TTCAN capability
- Low power
- Sleep, Stop and Standby modes
- VBAT supply for RTC, 32x 32-bit backup registers + 8-Kbyte backup SRAM
- Timers and watchdogs
- 1x high-resolution timer
- 4x 32-bit timers with up to four IC/OC/PWM or pulse counters and quadrature (incremental) encoder input (up to 240 MHz)
- 2x 16-bit advanced motor control timers (up to 240 MHz)
- 13x 16-bit general-purpose and 5x 16-bit low-power timers (up to 240 MHz)
- 2x watchdogs (independent and window)
- 1x SysTick timer
- RTC with subsecond accuracy and hardware calendar
- Debug
- Development support: serial-wire debug (SWD), JTAG
- Embedded Trace Macrocell™ (ETM)
- General-purpose I/Os
- Up to 165 pins
- Analog peripherals
- 1x temperature sensor
- 2x ADCs with 12-bit maximum resolution (up to 5 Msps), up to 20 channels
- 1x ADF filter with SAD and 1x MDF (six filters)
- Reset and power management
- POR, PDR, PBVD, and BOR
- Embedded SMPS step-down converter providing VDDCORE
- 1.71 to 3.6 V application supply and I/Os
- Dedicated power for USB and XSPI I/Os
- Backup regulator (~0.9 V)
- Voltage reference for analog peripheral (VREF+)
- Clock management
- Internal oscillators: 64 MHz HSI, 4 MHz MSI, 32 kHz LSI
- External oscillators: 16 to 48 MHz HSE, 32.768 kHz LSE
- 4x PLL (one for the system clock, one for the ST Neural-ART Accelerator, two for kernel clocks) with fractional mode
- ECOPACK2 compliant packages
Circuit Diagram
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| Resource title | Version | Latest update |
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IBIS models (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.0 | 18 Oct 2024 | 18 Oct 2024 |
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| ZIP | 1.0 | 18 Oct 2024 | 18 Oct 2024 |
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| STM32N657L0H3Q | Evaluation | VFBGA 223 10x10x1 P 0.5 mm | Industrial | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | D/A Converters (typ) (12-bit) | Timers (typ) (16-bit) | Timers (typ) (32-bit) | Number of Channels (typ) | SMPS | Number of Channels (typ) | UART (typ) | I/Os (High Current) | Integrated op-amps | Comparator | SPI (typ) | USART (typ) | Number of Channels (typ) | I2S (typ) | Advanced Motor Control Timers | CAN (2.0) | CAN (FD) | Ethernet | ||
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| STM32N657L0H3Q | | | distributors No availability of distributors reported, please contact our sales office |
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STM32N657L0H3Q Evaluation
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors