Product overview
Key Benefits
Enhanced wireless performance for greater user experience
Bluetooth® LE
High flash memory (2 Mbytes)

Simpler and faster development
Rich ecosystem offering
Design flexibility: available in QFN, WLCSP, and BGA options
Reliable and compliant with the latest regulations
PSA Certified level 3 and SESIP level 3
Compliant with RED and US security standards
Description
The STM32WBA6xxx multiprotocol wireless and ultra-low-power devices embed a powerful and ultra-low-power radio compliant with the Bluetooth® LE and with IEEE 802.15.4-2015. They contain a high-performance Arm® Cortex®-M33 32-bit RISC core, and operate at a frequency of up to 100 MHz.
The devices integrate a 2.4 GHz RADIO supporting Bluetooth® LE, Matter, Thread, and Zigbee®, and make possible to use proprietary protocols and concurrent operation modes. They provide support for an array of up to eight antennas, and an external power amplifier. PTA (packet traffic arbitration) interface is supported as well.
The Cortex-M33 core features a single-precision floating-point unit (FPU), supporting all the Arm single-precision data-processing instructions and all the data types. This core implements a full set of DSP (digital signal processing) instructions and a memory protection unit (MPU) that enhances the application security.
The devices embed high-speed memories (up to 2-Mbyte flash, up to 512-Kbyte SRAM), an extensive range of enhanced I/Os, and peripherals connected to AHB and APB buses on the 32-bit multi-AHB bus matrix.
The security foundation is compliant with the TBSA (trusted-based security architecture) requirements from Arm. It embeds the features needed to implement secure boot, secure data storage, and secure firmware update. Besides these capabilities, the devices incorporate a secure firmware installation feature that allows the customer to secure the provisioning of the code during its production. A flexible life cycle is managed thanks to multiple levels readout protection and debug unlock with password.
Firmware hardware isolation is supported thanks to securable peripherals, memories and I/Os, and privilege configuration of peripherals and memories.
The devices feature protection mechanisms for embedded flash memory and SRAM: readout protection, write protection, secure, and hide protection areas.
Dedicated peripherals reinforce security: a fast AES coprocessor, a secure AES coprocessor with DPA resistance and hardware unique key that can be shared by hardware with fast AES, a PKA (public key accelerator) with DPA resistance, a HASH hardware accelerator, and a true random number generator.
The devices offer active tamper detection and protection against transient perturbation attacks, thanks to several internal monitoring generating secret data erase in case of attack. This helps to fit the PCI requirements for point of sales applications.
Hardware semaphores allow synchronization between software processes.
The devices offer one 12-bit ADC (2.5 Msps), up to two comparators, a low-power RTC, up to two 32-bit general-purpose timer, one 16-bit PWM timer for motor control, three 16-bit general-purpose timers, and two 16-bit low-power timers. They also feature standard and advanced communication interfaces, namely up to four I2Cs, up to three SPIs, one SAI, up to three USARTs, one low-power UART, and one USB OTG high-speed.
The devices operate in the -40 to 85 °C (105 °C junction) and -40 to 105 °C (125 °C junction) temperature ranges from a 1.71 to 3.6 V power supply.
The design of low-power applications is enabled by a comprehensive set of power-saving modes.
Many peripherals (including radio, communication, analog, and timer peripherals) can be functional and autonomous in Stop mode with direct memory access thanks to background autonomous mode (BAM) support.
Some independent power supplies are supported, like an analog independent supply input for ADC and comparators, USB OTG high-speed, 14 GPIOs and dedicated supply inputs for the 2.4 GHz RADIO.
The devices offer four packages, from 48 to 121 pins, with or without SMPS.
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All features
- Includes ST state-of-the-art patented technology
- Ultra-low-power radio
- 2.4 GHz radio
- RF transceiver supporting Bluetooth® LE,IEEE 802.15.4-2015 PHY and MAC, supporting Thread, Matter, and Zigbee®
- Proprietary protocols
- RX sensitivity: -96 dBm (Bluetooth® LE at 1 Mbps), -100 dBm(IEEE 802.15.4 at 250 kbps)
- Programmable output power up to +10 dBm, with 1 dB steps
- Support for external PA
- Packet traffic arbitration
- Integrated balun to reduce BOM
- Single crystal operation
- Suitable for systems requiring compliance with radio frequency regulations ETSI EN 300 328, EN 300 440, FCC CFR47 Part 15 and ARIB STD-T66
- Bluetooth® LE
- LE 2M
- LE coded
- Direction finding
- LE power control
- Isochronous channels
- Extended advertising
- Periodic advertising
- LE secure connections
- LE audio
- Mesh networking
- Core specification v6.0
- Ultra-low-power with FlexPowerControl
- 1.71 to 3.6 V power supply
- -40 to 85/105 °C ambient temperature range
- Autonomous peripherals with DMA, functional down to Stop 1 mode
- 120 nA Standby mode (16 wake-up pins)
- 1.33 μA Standby mode with RTC
- 1.15 µA Standby mode with 64-Kbyte SRAM
- 5.30 µA Stop 2 mode with 64-Kbyte SRAM
- 29 µA/MHz Run mode
- Radio: Rx 4.26 mA / Tx at 0 dBm 5.94 mA
- Core
- Arm® 32-bit Cortex®-M33 CPU with TrustZone®, MPU, DSP, and FPU
- ART Accelerator
- 8-Kbyte instruction cache allowing 0-wait-state execution from flash memory (frequency up to 100 MHz, 150 DMIPS)
- Benchmarks
- 1.5 DMIPS/MHz (Dhrystone 2.1)
- 410 CoreMark® (4.10 CoreMark/MHz)
- Memories
- Up to 2-Mbyte dual bank flash memory with ECC, including 512 Kbytes with 100 K cycles
- Up to 512-Kbyte SRAM, including 64 Kbytes with parity check
- 512-byte (32 rows) OTP
- Power management
- Embedded regulator LDO and SMPS step-down converter, supporting switch on-the-fly and voltage scaling
- Clock management
- 32 MHz crystal oscillator
- 32 kHz crystal oscillator (LSE)
- Internal low power 32 kHz (±5%) RC
- Internal low frequency 32 kHz RC (500 ppm/°C)
- Internal 16 MHz factory trimmed RC (±1%)
- PLL for system clock, audio, and ADC
- General-purpose input/output
- Up to 86 I/Os (most of them 5 V-tolerant) with interrupt capability, and up to 14 I/Os with independent supply down to 1.08 V
- Analog peripherals (independent supply)
- 12-bit ADC 2.5 Msps, up to 16-bit with hardware oversampling
- Two ultra-low-power comparators
- Communication peripherals
- One USB OTG high-speed with embedded PHY
- One SAI (serial audio interface)
- Four UARTs (ISO 7816, IrDA, modem)
- Three SPIs
- Four I2Cs FM+ (1 Mbit/s), SMBus/PMBus®
- System peripherals
- Touch sensing controller, up to 24 sensors, supporting touch key, linear, and rotary touch sensors
- One 16-bit, advanced motor control timer
- Three 16-bit timers and two 32-bit timers
- Two low power 16-bit timers (available in Stop mode)
- Two Systick timers
- RTC with hardware calendar and calibration
- Two watchdogs
- 8-channel DMA controller, functional in Stop mode
- Security and cryptography
- Arm® TrustZone® and securable I/Os, memories, and peripherals
- Flexible life cycle scheme with read-out protection (RDP) and password protected debug
- Root of trust thanks to unique boot entry and secure hide protection area (HDP)
- Secure firmware installation (SFI), thanks to embedded root secure services (RSS)
- Secure data storage with hardware unique key (HUK)
- Secure firmware upgrade support with TF-M
- Two AES coprocessors, including one with DPA resistance
- Public key accelerator, DPA resistant
- HASH hardware accelerator
- True random number generator, NIST SP800-90B compliant
- 96-bit unique ID
- Active tampers
- CRC calculation unit
- Development support
- Serial wire debug (SWD), JTAG
- Embedded trace (ETM)
- ECOPACK2 compliant packages
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All resources
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Product Specifications (1)
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2.0 | 13 Mar 2025 | 13 Mar 2025 |
Application Notes (5 of 37)
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4.0 | 08 Jul 2020 | 08 Jul 2020 | ||
4.0 | 06 Jul 2022 | 06 Jul 2022 | ||
1.1 | 16 Jan 2024 | 16 Jan 2024 | ||
3.0 | 16 Jul 2019 | 16 Jul 2019 | ||
8.0 | 27 Feb 2025 | 27 Feb 2025 | ||
5.0 | 27 Feb 2025 | 27 Feb 2025 | ||
8.0 | 27 Feb 2025 | 27 Feb 2025 | ||
2.0 | 15 May 2024 | 15 May 2024 | ||
4.0 | 04 Oct 2024 | 04 Oct 2024 | ||
23.0 | 27 Feb 2025 | 27 Feb 2025 | ||
7.0 | 09 Dec 2024 | 09 Dec 2024 | ||
2.1 | 11 Jul 2017 | 11 Jul 2017 | ||
3.0 | 17 Aug 2022 | 17 Aug 2022 | ||
5.0 | 25 Feb 2025 | 25 Feb 2025 | ||
16.0 | 25 Jul 2024 | 25 Jul 2024 | ||
8.0 | 27 Feb 2025 | 27 Feb 2025 | ||
10.0 | 27 Feb 2025 | 27 Feb 2025 | ||
10.0 | 27 Feb 2025 | 27 Feb 2025 | ||
10.0 | 27 Feb 2025 | 27 Feb 2025 | ||
10.0 | 29 Oct 2024 | 29 Oct 2024 | ||
8.0 | 27 Feb 2025 | 27 Feb 2025 | ||
7.0 | 27 Feb 2025 | 27 Feb 2025 | ||
14.0 | 18 Feb 2025 | 18 Feb 2025 | ||
2.0 | 17 Jul 2019 | 17 Jul 2019 | ||
7.0 | 27 Jun 2023 | 27 Jun 2023 | ||
12.0 | 27 Feb 2025 | 27 Feb 2025 | ||
17.0 | 07 Mar 2025 | 07 Mar 2025 | ||
11.0 | 27 Feb 2025 | 27 Feb 2025 | ||
10.0 | 27 Feb 2025 | 27 Feb 2025 | ||
1.0 | 20 Feb 2025 | 20 Feb 2025 | ||
15.0 | 06 Feb 2025 | 06 Feb 2025 | ||
3.0 | 29 Mar 2022 | 29 Mar 2022 | ||
65.0 | 17 Feb 2025 | 17 Feb 2025 | ||
8.0 | 07 Nov 2024 | 07 Nov 2024 | ||
19.0 | 05 Feb 2025 | 05 Feb 2025 | ||
17.0 | 17 Feb 2025 | 17 Feb 2025 | ||
1.1 | 11 Jul 2017 | 11 Jul 2017 |
Technical Notes & Articles (5 of 7)
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4.0 | 11 Jul 2017 | 11 Jul 2017 | ||
5.0 | 17 Jul 2024 | 17 Jul 2024 | ||
2.1 | 11 Jul 2017 | 11 Jul 2017 | ||
3.0 | 11 Jul 2017 | 11 Jul 2017 | ||
3.0 | 11 Jul 2017 | 11 Jul 2017 | ||
1.0 | 11 Jul 2017 | 11 Jul 2017 | ||
1.0 | 11 Jul 2017 | 11 Jul 2017 |
User Manuals (2)
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1.0 | 19 Nov 2024 | 19 Nov 2024 | ||
1.0 | 16 May 2024 | 16 May 2024 |
Reference Manuals (1)
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2.0 | 18 Feb 2025 | 18 Feb 2025 |
Programming Manuals (2)
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13.0 | 17 Dec 2024 | 17 Dec 2024 | ||
6.0 | 25 Mar 2025 | 25 Mar 2025 |
Errata Sheets (1)
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1.0 | 17 Feb 2025 | 17 Feb 2025 |
Application Notes for related Tools & Software (5 of 15)
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2.0 | 23 Feb 2018 | 23 Feb 2018 | ||
1.0 | 28 Feb 2025 | 28 Feb 2025 | ||
4.0 | 10 Feb 2022 | 10 Feb 2022 | ||
2.0 | 14 Dec 2020 | 14 Dec 2020 | ||
3.0 | 24 Jul 2020 | 24 Jul 2020 | ||
1.0 | 29 Oct 2019 | 29 Oct 2019 | ||
5.0 | 25 Feb 2025 | 25 Feb 2025 | ||
5.0 | 05 Oct 2021 | 05 Oct 2021 | ||
18.0 | 11 Mar 2025 | 11 Mar 2025 | ||
2.0 | 28 Feb 2025 | 28 Feb 2025 | ||
1.0 | 14 Jan 2020 | 14 Jan 2020 | ||
4.0 | 09 Mar 2023 | 09 Mar 2023 | ||
3.0 | 28 Feb 2023 | 28 Feb 2023 | ||
6.0 | 25 Feb 2025 | 25 Feb 2025 | ||
1.0 | 30 Nov 2021 | 30 Nov 2021 |
Presentations (5)
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1.0 | 19 Feb 2025 | 19 Feb 2025 | ||
1.0 | 20 Jun 2023 | 20 Jun 2023 | ||
1.0 | 21 Mar 2024 | 21 Mar 2024 | ||
1.1 | 02 Dec 2024 | 02 Dec 2024 | ||
1.7 | 18 Mar 2025 | 18 Mar 2025 |
Flyers (5)
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20.0 | 21 Dec 2020 | 21 Dec 2020 | ||
1.0 | 09 Jul 2024 | 09 Jul 2024 | ||
1.0 | 11 Jun 2024 | 11 Jun 2024 | ||
1.0 | 11 Jun 2024 | 11 Jun 2024 | ||
1.2 | 11 Mar 2025 | 11 Mar 2025 |
Product Certifications (1)
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1.0 | 03 Mar 2025 | 03 Mar 2025 |
Security Bulletin (3)
Resource title | Version | Latest update | ||
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1.0 | 19 Nov 2024 | 19 Nov 2024 | ||
1.0 | 28 Jan 2025 | 28 Jan 2025 | ||
1.0 | 28 Jan 2025 | 28 Jan 2025 |
EDA Symbols, Footprints and 3D Models
All resources
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IBIS models (1)
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ZIP | 3.0 | 18 Feb 2025 | 18 Feb 2025 |
BSDL files (1)
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ZIP | 2.0 | 30 Oct 2024 | 30 Oct 2024 |
Quality and Reliability
Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
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STM32WBA62PII6 | Active | UFBGA 121 6x6x0.6 P 0.5 mm | Industrial | Ecopack2 | |
STM32WBA62PII7 | Preview | UFBGA 121 6x6x0.6 P 0.5 mm | Industrial | Ecopack2 | |
STM32WBA62PII6
Package:
UFBGA 121 6x6x0.6 P 0.5 mmMaterial Declaration**:
STM32WBA62PII7
Package:
UFBGA 121 6x6x0.6 P 0.5 mmMaterial Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | D/A Converters (typ) (12-bit) | Timers (typ) (16-bit) | Timers (typ) (32-bit) | Number of Channels (typ) | SMPS | Number of Channels (typ) | UART (typ) | I/Os (High Current) | Integrated op-amps | Comparator | SPI (typ) | USART (typ) | Number of Channels (typ) | I2S (typ) | Advanced Motor Control Timers | CAN (2.0) | CAN (FD) | ||
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STM32WBA62PII7 | | | distributors No availability of distributors reported, please contact our sales office |
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STM32WBA62PII6 Active
STM32WBA62PII7 Preview
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors