IO-Link communication transceiver device IC

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Product overview

Description

The L6362A is an IO-Link and SIO mode transceiver device compliant to PHY2 (3-wire connection) supporting COM1 (4.8 kbaud), COM2 (38.4 kbaud) and COM3 (230.4 kbaud) modes. The output stage can be configured as high-side, low-side or push-pull and it can drive resistive, capacitive and inductive loads. It can be connected to a sensor chip with the industrial 24 V environment. The industrial environment could be a PLC, an IO-Link master, a relay or a valve. The L6362A is protected against reverse polarity, among VCC, GND, OUTH, OUTL and I/Q pins. Furthermore, the IC is protected against output short-circuit, overvoltage and impulse voltage withstand (±1 kV pulse amplitude, 1.2/50 μs pulse duration, 500 Ω source impedance).

  • All features

    • Supply voltage from 7 V to 36 V
    • 5 V and 3.3 V compatible I/Os
    • 5 V or 3.3 V, 10 mA selectable linear regulator
    • 0.3 A output current intervention threshold
    • Fully protected
      • Reverse polarity
      • Overload with cut-off function
      • Overtemperature
      • Undervoltage and overvoltage
      • GND and VCC open wire
    • -40 to +125 °C operating ambient temperature
    • Selectable output stages: high-side, low-side, push-pull
    • Suitable to drive L, C and R loads
    • 30 μF output load drive capability
    • Switching capability of inductors up to 500 mJ
    • Wake-up detection supported
    • Fast demagnetization of inductive loads
    • COM1, COM2 and COM3 mode supported
    • Designed to meet:
      • Burst IEC 61000-4-4
      • ESD IEC 61000-4-2
      • Surge EN60947-5-2
    • Miniaturized VFDFPN 12L (3x3x0.90 mm) package

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All tools & software

    • Part number
      Status
      Description
      Type
      Supplier

      TEConcept IO-Link Device Bootloader Stack for FW Upgrade profile

      Active

      IO-Link Device Stack Bootloader stack for Firmware Upgrade profile integration

      Embedded software from partners TEConcept
      TEConcept IO-Link Device Bootloader Stack for FW Upgrade profile

      Description:

      IO-Link Device Stack Bootloader stack for Firmware Upgrade profile integration

      TEConcept IO-Link Device Software Stack

      Active

      Way to integrate state-of-the-art IO-Link technology

      Embedded software from partners TEConcept
      TEConcept IO-Link Device Software Stack

      Description:

      Way to integrate state-of-the-art IO-Link technology
    • Part number
      Status
      Description
      Type
      Supplier

      IO-Link Workshop

      Active

      IO-Link Training for Developers, Users and Test Engineers

      Training from partners TEConcept
      IO-Link Workshop

      Description:

      IO-Link Training for Developers, Users and Test Engineers

      TEConcept IO-Link Stack Integration

      Active

      Engineering services in IO-Link Stack Integration

      Engineering services from partners TEConcept
      TEConcept IO-Link Stack Integration

      Description:

      Engineering services in IO-Link Stack Integration
    • Part number
      Status
      Description
      Type
      Supplier

      P-NUCLEO-IOD3A1

      Active

      STM32 Nucleo pack for IO-Link device applications based on L6362A transceiver, IPS2050H power switch and STM32L073RZ

      Process control and automation ST
      P-NUCLEO-IOD3A1

      Description:

      STM32 Nucleo pack for IO-Link device applications based on L6362A transceiver, IPS2050H power switch and STM32L073RZ

      STEVAL-BFA001V1B

      NRND

      Predictive maintenance kit with sensors and IO-Link capability

      Wired ST
      STEVAL-BFA001V1B

      Description:

      Predictive maintenance kit with sensors and IO-Link capability

      STEVAL-BFA001V2B

      Active

      Multi-sensor predictive maintenance kit with IO-Link stack v.1.1

      Wired ST
      STEVAL-BFA001V2B

      Description:

      Multi-sensor predictive maintenance kit with IO-Link stack v.1.1

      STEVAL-IDP003V1

      Active

      IO-Link industrial modular sensor board based on L6362A

      Wired ST
      STEVAL-IDP003V1

      Description:

      IO-Link industrial modular sensor board based on L6362A

      STEVAL-IFP017V3

      NRND

      Evaluation board for IO-Link transceiver device L6362A

      Process control and automation ST
      STEVAL-IFP017V3

      Description:

      Evaluation board for IO-Link transceiver device L6362A

      STEVAL-IOD003V1

      Active

      IO-Link (PHY) device expansion board based on L6362A

      Wired ST
      STEVAL-IOD003V1

      Description:

      IO-Link (PHY) device expansion board based on L6362A
    • Part number
      Status
      Description
      Type
      Supplier

      P-NUCLEO-IOD01A1

      NRND

      STM32 Nucleo pack for IO-Link device fully compatible with IO-Link v1.1 (PHY and stack)

      STM32 ODE Sense HW ST
      P-NUCLEO-IOD01A1

      Description:

      STM32 Nucleo pack for IO-Link device fully compatible with IO-Link v1.1 (PHY and stack)

EDA Symbols, Footprints and 3D Models

STMicroelectronics - L6362A

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Symbols

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Footprints

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3D models

Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
L6362ATR
Active
VFDFPN 12 3X3X0.9 Industrial Ecopack2

L6362ATR

Package:

VFDFPN 12 3X3X0.9

Material Declaration**:

PDF XML

Marketing Status

Active

Package

VFDFPN 12 3X3X0.9

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

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Part Number
Marketing Status
Budgetary Price (US$)*/Qty
Order from ST
Order from distributors
Package
Packing Type
RoHS
Country of Origin
ECCN (US)
ECCN (EU)
L6362ATR
Active
1.3602 / 1k
Available at 4 distributors

Distributor availability of L6362ATR

Distributor Name
Region Stock Min. Order Third party link
Farnell Element14 EUROPE 22331 1
MOUSER WORLDWIDE 1459 1
DIGIKEY WORLDWIDE 19216 1
YOSUN ASIA/PACIFIC 100 1

Distributor reported inventory date: 3/30/2025

VFDFPN 12 3X3X0.9 Tape and Reel CHINA EAR99 NEC

L6362ATR Active

Budgetary Price (US$)*/Qty:
1.3602 / 1k
Package:
VFDFPN 12 3X3X0.9
Packing Type:
Tape and Reel
RoHS:
Country of Origin:
CHINA
ECCN (US):
EAR99
ECCN (EU):
NEC

Part Number:

L6362ATR

Distributor Name

Farnell Element14

Stock

22331

Min.Order

1

MOUSER

Stock

1459

Min.Order

1

Region

WORLDWIDE Buy from Distributor

DIGIKEY

Stock

19216

Min.Order

1

Region

WORLDWIDE Buy from Distributor

YOSUN

Stock

100

Min.Order

1

Region

ASIA/PACIFIC Buy from Distributor

Distributor reported inventory date: 3/30/2025

Swipe or click the button to explore more details Don't show this again

(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors