製品概要
概要
Stellar integration MCUs have been designed to meet the requirements of domain controllers and ECUs with high integration requested in the architectures of connected update-able automated and electrified cars. They have superior real-time and safe performance (with highest ASIL-D capability). Bringing HW based virtualization technology to MCUs, they ease the development and integration of multiple source SW onto the same HW while maximizing the resulting SW performance. They offer high efficiency OTA reprogramming capability with fast new image download and activation at almost no memory overhead thanks to SR6 unique built-in dual image storage tailored to OTA reprogramming needs and provide high speed security cryptographic services, for instance for network authentication.
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特徴
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- AEC-Q100 automotive qualification on going
- Stellar integration MCUs:
- Have superior real-time and safe performance (with highest ASIL-D capability)
- Bring HW based virtualization technology to MCUs for simplified multiple SW integration at optimized performance
- Have built-in fast and cost effective OTA reprogramming capability (with built-in dual image storage)
- Offer high speed security cryptographic services, for example for network authentication
- Cores
- 32-bit Arm® v8-R compliant CPU cores:
- 6 Cortex®-R52 cores (4 of them with checker cores, 2 in split-lock configuration) allowing usage as either 6 cores (4 of them in lockstep configuration) or 5 cores (all of them in lockstep configuration), single precision FPU, new privilege level for real-time virtualization
- 2 NEON extensions (for example SIMD, dual precision FPU)
- 2 Cortex®-M4 multi purpose accelerators (data move and [pre]-processing). 1 in lockstep configuration
- 4 eDMA engines in lockstep configuration
- 32-bit Arm® v8-R compliant CPU cores:
- メモリ
- Up to 20.5 MB on-chip NVM non volatile memory
- PCM (phase change memory) as non volatile memory
- 19.5 MB code NVM, with embedded memory replication for OTA (over-the-air) reprogramming with up to 2x 19.5 MB
- 1024 KB HSM dedicated code NVM
- 640 KB data NVM (512 KB + 128 KB dedicated to HSM)
- Up to 8576 KB on-chip general-purpose SRAM
- Up to 20.5 MB on-chip NVM non volatile memory
- Security: hardware security module - 2nd generation
- On-chip high performance security module with EVITA full support
- Symmetric and asymmetric cryptography processor
- High performance lock-stepped AES-light security sub-system for fast ASIL-D cryptographic services
- Safety: comprehensive new generation ASIL-D safety concept
- New state of the art safety measures at all level of the architecture for most efficient implementation of ISO26262 ASIL-D functionalities
- Complete HW virtualization architecture build on Cortex®-R52 new privilege mode (best-in class SW isolation, real-time support for multiple virtual machine/applications)
- Device stand-by / low power modes
- Ultra low power: stand by mode for lowest quiescent current with optimized active subsystem (for example stand-by RAM) and wakeup capability
- Smart low power: stand-by mode enhanced with active Cortex®-M4 subsystem and extended COM interfaces and ADC peripheral.
- Peripheral, IOs, communication interfaces
- 28 LINFlexD modules
- 2 dual-channel FlexRay controllers
- 10 queued serial peripheral interface (SPIQ) modules
- 2 SENT modules (15 channels each)
- 2 PSI5 modules (2 channels each)
- Enhanced analog-to-digital converter system with
- 12 separate 12-bit SAR analog converters (including one supervisor/safety ADC).
- 4 separate 9-bit SAR analog converters (2 channels each) with fast comparator mode
- One 9-bit SAR analog converter for device stand-by / low power mode
- Interconnection with GTM timer for autonomous ADC/GTM subsystem operation
- Advanced timed I/O capability
- Generic timer module (GTM4154)
- Communication interfaces
- 2 ethernet controllers 100/1000 Mbps, compliant IEEE 802.3-2008: IPv4 and IPv6 checksum modules, AVB, VLAN and EMC optimized SGMII
- 19 modular controller area network (MCAN) modules, and 1 time-triggered controller area network (M-TTCAN), all supporting flexible data rate (ISO CAN-FD)
- External memory interfaces
- 2 OctalSPI to support Hyperbus™ memory (Flash/RAM) devices
- 1 SDMMC interface
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品質 & 信頼性
| 製品型番 | マーケティング･ステータス | パッケージ | グレード | RoHSコンプライアンスグレード | 材料宣誓書** |
|---|---|---|---|---|---|
| SR6G7C4A2C42FX0R | 開発中 | FPBGA 17X17X1.8 292 B0.55 P0.8 | インダストリアル | Ecopack2 |
(**) st.comで提供している材料宣誓書は、パッケージ･ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください
サンプル & 購入
| 製品型番 | 製品ステータス | Budgetary Price (US$)*/Qty | STから購入 | Order from distributors | パッケージ | 梱包タイプ | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | CPU Clock Frequency (MHz) (max) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小 | 最大 | ||||||||||||||
| SR6G7C4A2C42FX0R | | | distributors 販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください |
| |||||||||||
SR6G7C4A2C42FX0R 開発中
販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください
（*）概算用の参考価格（US$）です。現地通貨でのお見積りについては、STのセールス･オフィスまたは販売代理店までお問い合わせください。