SR6P3C4

量産中
Design Win

Stellar SR6 P3 line 32-bit Arm® Cortex®-R52+ automotive integration MCU 3x Cortex®-R52+ cores, 8 MB NVM (2x 7.5 MB "OTA X2") 1.3 MB RAM, with embedded virtualization, safety, and security

データブリーフのダウンロード

製品概要

概要

Stellar integration MCUs have been designed to meet the requirements of domain controllers and ECUs with high integration requested in the architectures of connected updatable automated and electrified cars. They have superior real-time and safe performance (with highest ASIL-D capability). Bringing hardware-based virtualization technology to MCUs, they ease the development and integration of multiple source software onto the same hardware while maximizing the resulting software performance. They offer high-efficiency OTA reprogramming capability with fast new image download and activation at almost no memory overhead thanks to SR6 unique built-in dual-image storage tailored to OTA reprogramming needs. They also provide high-speed security cryptographic services, for instance for network authentication.

  • 特徴

    • AEC-Q100
    • SR6 integration MCUs:
      • Have superior real-time and safe performance (with highest ASIL-D capability)
      • Bring hardware-based virtualization technology to MCUs for simplified multiple software integrations at optimized performance
      • Have built-in fast and cost-effective OTA reprogramming capability (with built-in dual-image storage)
      • Offer high-speed security cryptographic services, for example for network authentication
    • Cores
      • 3 × 32-bit Cortex®‑R52+ cores (all of them in lockstep configuration):
        • Arm® v8-R compliant
        • Single precision floating-point unit (FPU)
        • New privilege level for real-time virtualization
      • 2 Cortex®‑M4 multipurpose accelerators, one in lockstep configuration
      • 4 eDMA engines in lockstep configuration
    • メモリ
      • Up to 8 MB on-chip nonvolatile memory (NVM):
        • PCM (phase-change memory) as nonvolatile memory
        • 7.5 MB code NVM, with embedded memory replication for OTA (over-the-air) reprogramming with up to 2× 7.5 MB
        • 512 KB HSM-dedicated code NVM
      • 256 KB data NVM (128 KB + 128 KB dedicated to HSM)
      • Up to 1328 KB on-chip general-purpose SRAM
    • Security: 2nd generation hardware security module
      • Cybersecurity: ISO/SAE 21434 compliance (refer to the cybersecurity reference manual for details)
      • On-chip high-performance security module with full support for e-safety vehicle intrusion protected applications (EVITA)
      • Symmetric and asymmetric cryptography processor
      • High-performance lock-stepped AES-light security subsystem for fast ASIL-D cryptographic services
    • Safety: comprehensive new-generation ASIL-D safety concept
      • New state-of-the-art safety measures at all levels of the architecture for most efficient implementation of ISO 26262 ASIL-D functionalities
      • Complete hardware virtualization architecture built on Cortex®‑R52+ new privilege mode (best-in-class software isolation, real-time support for multiple virtual machines/applications)
    • Peripheral, I/O, and communication interfaces
      • 16 LINFlexD modules
      • 1 dual-channel FlexRay controller
      • 10 queued serial peripheral interface (SPIQ) modules
      • 2 microsecond channels (MSC) and 1 microsecond plus (MSC-Plus) channel
      • 2 I²C interfaces
      • 2 SENT modules (10 channels each)
      • 2 PSI5 modules (1 channel each)
      • Enhanced analog-to-digital converter system with:
        • 6 separate 12-bit SAR analog converters (including one supervisor/safety ADC).
        • 4 separate 9-bit SAR analog converters (2 channels each) with fast comparator mode
        • 6 separate 16-bit sigma-delta analog converters with embedded DSP processor on each SD ADC
        • Enhanced interconnection with GTM timer for autonomous ADC/GTM subsystem operation
      • Advanced timed I/O capability:
        • Generic timer module (GTM4124)
        • High-resolution timer
      • Communication interfaces:
        • One 10/100/1000 Mbit/s Ethernet controller compliant with IEEE 802.3-2008: IPv4 and IPv6 checksum modules, AVB, VLAN
        • 7 modular controller area network (MCAN) modules, and 1 time-triggered controller area network (M_TTCAN), all supporting flexible data rate (ISO CAN FD®)
        • 2 CAN XL® interfaces

EDAシンボル / フットプリント / 3Dモデル

STMicroelectronics - SR6P3C4

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

Please select one model supplier :

Symbols

EDAシンボル

Footprints

フットプリント

3D model

3Dモデル

品質 & 信頼性

製品型番 マーケティング・ステータス パッケージ グレード RoHSコンプライアンスグレード 材料宣誓書**
SR6P3C490D42FX0R
量産中
FPBGA 17X17X1.8 292 B0.55 P0.8 インダストリアル Ecopack2

SR6P3C490D42FX0R

Package:

FPBGA 17X17X1.8 292 B0.55 P0.8

Material Declaration**:

PDF XML

Marketing Status

量産中

Package

FPBGA 17X17X1.8 292 B0.55 P0.8

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) st.comで提供している材料宣誓書は、パッケージ・ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください

サンプル & 購入

Swipe or click the button to explore more details Don't show this again
製品型番
製品ステータス
Budgetary Price (US$)*/Qty
STから購入
Order from distributors
パッケージ
梱包タイプ
RoHS
Country of Origin
ECCN (US)
ECCN (EU)
Operating temperature (°C)
CPU Clock Frequency (MHz) (max)
最小
最大
SR6P3C490D42FX0R
Available at distributors

販売代理店在庫 SR6P3C490D42FX0R

販売代理店
地域 在庫 最小発注数量 パートナー企業リンク

販売代理店在庫データ:

販売代理店に在庫がない場合は、STのセールス・オフィスまでお問い合わせください

SR6P3C490D42FX0R 量産中

Budgetary Price (US$)*/Qty:
-
パッケージ:
梱包タイプ:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

製品型番:

SR6P3C490D42FX0R

Operating Temperature (°C)

最小:

最大:

CPU Clock Frequency (MHz) (max):

400

Swipe or click the button to explore more details Don't show this again

(*)概算用の参考価格(US$)です。現地通貨でのお見積りについては、STのセールス・オフィスまたは販売代理店までお問い合わせください。